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DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

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Electronic Costing & Technology Experts

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March 2015 – Version 1 – Written by Sylvain Hallereau

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Bosch BMI160 6-Axis MEMS IMU

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Glossary1. Overview / Introduction 4

– Executive Summary– Reverse Costing Methodology

2. Company Profile 7– Bosch Sensortec– BMI160 Characteristics

3. Physical Analysis 12– Synthesis of the Physical Analysis– Physical Analysis Methodology– Package

– Package Views, Dimensions & Pin Out– Package Opening– Wire Bonding Process– Package Cross-Section

– ASIC Dies– View, Dimensions & Marking– Delayering– Main Blocks Identification– Cross-Section – Process Characteristics

– MEMS Gyro & Accelero Dies– View, Dimensions & Marking– Bond Pad Opening & Bond Pad– Cap Removed & Cap Details– Sensing Area Details– Cross-Section (Sensor, Cap & Bonding)– Process Characteristics

– Consumer 6-Axis IMU Comparison– Bosch Sensortec BMI055 versus BMI160– Bosch BMI160 versus Invensense MPU6500

4. Manufacturing Process Flow 107– Global Overview– ASIC Front-End Process– MEMS Gyro & Accelero Process Flow– Wafer Fabrication Unit– Packaging Process Flow– Package Assembly Unit

5. Cost Analysis 134– Synthesis of the cost analysis– Main steps of economic analysis– Yields Hypotheses– ASIC Front-End Cost– ASIC Back-End 0 : Probe Test & Dicing– ASIC Wafer & Die Cost– MEMS Gyro & Accelero Front-End Cost– MEMS Gyro & Accelero Front-End Cost per process steps– MEMS Gyro & Accelero Back-End 0 : Probe Test & Dicing– MEMS Gyro & Accelero Wafer & Die Cost– Back-End : Packaging Cost– Back-End : Packaging Cost per Process Steps– Back-End : Final Test & Calibration Cost– BMI160 Component Cost– Consumer 6-Axis IMU Comparison

6. Estimated Price Analysis 173– Manufacturer Financial Ratios– Estimated Selling Price

Contact 178


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• This full reverse costing study has been conducted to provide insight on technology data,

manufacturing cost and selling price of the Bosch BMI160 6-Axis MEMS IMU.

• It is the second MEMS 6-Axis IMU manufactured by Bosch for consumer applications. It combines a

16-bit 3-Axis accelerometer, a 16-bit 3-Axis gyroscope in a 3.0x2.5x0.8mm LGA package (the

smallest footprint at its introduction).

• The new MEMS Gyro area is 2 times smaller than previous generation used in BMI055 thanks to a

new design and process.

• The BMI160 has a 10x lower consumption mode for step detection and significant motion functions,

only 20µA. The very low consumption is based on a “7-axis” sensor.

• The unique ASIC fusions the sensors data. Moreover, the ASIC can be connected to geomagnetic or

pressure sensor. In this configuration, the BMI160 controls the data acquisition of the external

sensor and the data of all sensors is made available via the built-in FIFO.

• The BMI160 applications: senses orientation, tilt, motion, acceleration, rotation, shock, vibration

and heading in cell phones, handhelds, computer peripherals, man-machine interfaces, virtual

reality features and game controllers.


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The reverse costing analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price


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• Package: LGA 14-pin

• Dimensions: 3 x 2.5 x 0.95mm

• Pin Pitch: 0.5mm

• Marking:

TSE

S4

Package top view

Package back viewPackage Side View


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• The die marking includes the logo of Bosch and:

BAI160CA

BOSCH

2014

ASIC Gyro Die Marking


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• The die marking includes:

BOSCH

CMA334M

MEMS Accelero Die Marking

MEMS Accelero bond pads


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MEMS Sensing Area Overview

MEMS Sensing Area – SEM View

MEMS Sensing Area – SEM View

Poly 3

Poly 2

Poly 1

Poly 3

Poly 2

Poly 1


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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated).

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

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