A device comprising a flow celldefining a treatment region thatcontains a treatment location thatextends along a plane for thechemical or electrolytic surfacetreatment of plate-shaped articlesat the treatment location, when amain plane of the articles extendsalong the plane along which thetreatment location extends, withfirst feed elements in the form oftubes with outlet openings for thedirected supply of a process liquidto the treatment region, charac•terized by additional, second feedmeans in the treatment region forthe directed introduction of airinto the active area of guide ele•ments, which consist of flow grat•ings maintained at a distance on

both sides of the treatment loca•tion, with small plates arrangedin the manner of a shutter, whichare inclined upward and down•ward in the direction parallelwith the plan along which thetreatment location extends.

~COPPIII"'L

U.S. Patent 5,897,761. Apr. 27, 1999H. Tagusari et at., assignors toMitsui Mining & Smelting Co. Ltd.,TokyoA method for manufacturing anelectrodeposited copper foil hav•ing a matte side and a shiny sidefor use in making a printed wiringboard, which comprises buffingthe surface of the matte side ofthe electrodeposited copper foil to

completely remove the originalprofile of the matte side; furtherbuffing the surface of the matteside to form a fine roughness hav•ing buffed linear streaks and tocontrol the surface roughness ofthe matte side to 1.5 JLm or less;and subjecting the buffed matteside to a nodule forming treat•ment and controlling the surfaceroughness to 1.5 to 2.0 JLm afterthe nodule forming treatment.

MnIIOD ... COLOalI8 TOOL l1li'U.S. Patent 5,897,762. Apr. 27, 1999K. T. Liu, Taichung Hsien, TaiwanA method for coloring tool bits,said method comprising providinga plurality of tool bit bodies, saidtool bit bodies each including at

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