eldaas technologies company profile
TRANSCRIPT
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Company
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Profile
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Who We are
• ELDAAS is a private limited company registered in 2010
• Based out of Bengaluru, India and Having presence in Raleigh, USA
• Provides Design and Engineering services at optimal cost
• ISO 9001:2015 Certified company
• 50+ Highly skilled engineering resources
• Completed over 300+ Projects successfully.
• Proven product design capabilities with established predictable, Lean and Agile process
• Multiple technologies under one roof – Analog, Digital and RF/Microwave.
• Voted among 50 Best Companies to work for – Silicon Review
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Vision, Mission and Values
Vision
Mission
Values
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To contribute significantly to the creationof a world of Intelligent Products
To provide Intelligent & Innovative ElectronicDesigns and Products, with state-of -the artTechnologies and Cost-Effective Solutions
We’re Passionate About SuccessWe’re Innovative In Our ThinkingMake Customer a HeroBegin with Trust
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Domain Expertise
Artificial Intelligence, AIoT & ML
Telecommunications
Internet of Things (IoT)
Consumer Electronics
Defence & Aerospace
Healthcare
Semiconductors
Security & Surveillance
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Our Services
Embedded Design and
Engineering FPGA Design and
Engineering RF & Microwave
Design and Engineering
Analog, Digital, RF and Mixed signal
Semiconductor Design
• Concept study • PCB Design and simulations • Product/Module/sub-
system/system Design and Engineering
• Mechanical engineering • Cable forms design • Prototyping • Box building • Integration, Evaluations and
certifications • Volume production and
manufacturing services • Software/firmware
development • Signal processing • RF circuit design, analysis
and simulations • Semiconductor design • Onsite/offsite manpower
staffing solutions • Obsolescence Management
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Technology Segments
Services
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Hardware Engineering
Hardware
• High Speed Board design • Sub module design • Add-on Module design • Platform/evaluation boards • Component Engineering • Cost Optimization • Circuit Simulations • Protocol validation • Testing and measurements • Obsolescence Management • Proto Manufacturing &
Support
Processors • Microprocessor - Intel, Freescale,
Texas Instruments • FPGA – Xilinx, Intel, Microsemi
[Microchip], Lattice semi • DSP – Texas Instruments, Analog
Devices • Microcontroller – Atmel
[Microchip], NXP, ST- Micro, Microchip ,Cypress and TI
• PowerPC-NXP
Interfaces • SRIO,USB 2.0 / 3.0, Gigabit Ethernet, SGMII,
SATA, MIL-1553, JESD204B
• HDMI, LVDS, VGA, MIPI_DSI
• SDRAM/DDR2 / DDR3 / DDR4, QDR, LPDDR /LPDDR2/LPDDR3
• Flash Memories- NOR, NAND, eMMC, SD card, SSD, SDHC, SDXC, UFS
• Back Plane :VME, VPX, PCIe Gen4.0, cPCI, PCI, PMC, XMC, FMC
• Optical Interface: SFP
• Camera: MIPI,HD, USB, IP,SD
• Audio: HDA, I2S,
• Video Encoding: H.264, H.265
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Software Engineering
Embedded Software Services
• (BSP) development, Customisation & OS Porting • Device drivers • Firmware • Protocol development • Cross platform porting • QT
OS Platforms
• Windows Embedded compact • Android • VX Works • RT Linux • Windows
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Software languages Verilog VHDL Embedded C C++
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PCB Design and Board Simulations
PCB Design
• Expertise in handling up to 26 Layers with Blind/Buried via
• SERDES Signals up to 12 Gbps • Expertise in Rogers and other high
speed materials • High speed digital, Analog, RF boards &
Mixed-Signal • Hybrid PCB Design • Flex PCB Design • HDI design • Legacy board design conversion • DFX analysis data conversion
Simulations • Multi Gbps signal Simulation
• 3 D characterization
• PDN Planning
• Power Aware SI
• Signal Integrity Analysis
• EMC/EMI Analysis
• Power Integrity Analysis
• Thermal Analysis
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RF and Microwave design services
• UP-Down Converters • Wideband Tranceivers
(Upto 6GHz, -110dBm sensitivity)
• Wideband Transmitters/Receivers
• Synthesizers • RF Front Ends • Filters, Couplers, Splitters • Power Amplifiers • Hybrid Boards (RF, Digital
and Signal processing)
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Expertise upto 60GHz
Defence, Aerospace, Consumer and Telecom applications
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Signal
Processing
Architecture Definition
Algorithm development
DSP design review
FPGA implementation
Matlab and Simulink modelling and simulation
Cost, Performance and efficiency optimisation
Verification and debugging
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Tool Expertise
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Semiconductors
FPGA
Signal Processing
Embedded
RF and Microwave
PCB and Simulation
Mechanical
Atmel Studio 7
HFSS Advanced Design System
Hyper Lynx
Allegro
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Products
ELDAAS Confidential 12
elSoM-i500 System on Module elSoM-3CG System on Module elSoM-5EG System on Module
eldB-i500 Base Board/ Carrier Board elSoM-i500 Developer Kit elSoM-SDR System on Module
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Hand held Base station SBC Octasic
Vision Eye test controller
Wideband transceiver GPS Tracker
Integrated VOIP System BEL
Up/Down convertor ADE
Multichannel data acquisition radar module
AirPro-1 Data Link
K9 Tanker -electronics
MODEM IP Core Radar Pulse Simulator Test Jig
Products
ELDAAS Confidential 13 Features and Specifications of few Products are given in the next 3 slides
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Digital Computing System(DiComS)
Specifications:
• Main Memory : Onboard 2GB DDR3, 2MB L2 Cache Memory
• Storage : Onboard 8GB eMMC 5.0 Flash, extendable
• SATA Interface: Support 2xSATAII ports with 3-Gbps Gen2
• USB Interface : 3x USB 2.0 Type-A ports
• SD Card : Support External SD Card Up to 32GB
• Bus Interface :1x I²C, 1x HDA,2xUARTs
• Audio :HD Audio Codec
• Display : 80MHz Dual channel LVDS interface
• Resolution : up to 1920 x 1200 pixels
• Dual channel LVDS interface support: 24 bpp
• Ethernet : 2x Gigabit10/100/1000 Mbps data rate support with RGMII mode
• Operating temperature:-40° to 85° c
• Relative Humidity : - 5% ~ 90%, non-condensing
• Power Supply : 12V ±5%
• Power Consumption : 15 W (Max)
• Mechanical Dimension : 173mm x169mm x87mm
• Home Automation, Auto driving application, Automatic vending machine, Medical application like C.T Scan, Ultrasound machine, IoT application
DiComS is a Digital Computing System for processing high speed data and images. With standard interfaces like Gigabit Ethernet, SATA Based Memory, USB based, SD Card DicomS is ideal for multiple applications. Can be Powered using Power Over Ethernet (PoE); Supports RISC architecture. configurable with various processors on a single carrier board.
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elSoM - SDRData Link
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• Wideband RF : 100MHz to 5GHz
• No. of Channels : One, Clock In and Out for multiple Transceivers synchronization.
• FPGA, Processor and RF front end on a single board for better performance
• 32Mb SRAM for FPGA, 256Mb SDRAM for processor.
• Data rate :11Mbps(QPSK),Bandwidth: 200 KHz/2 MHz (Tunable).
• Transmit Power: Single tone -5dBm ±2dBm and with QPSK : -25dBm.
• Receiver sensitivity: -95dBm @ 10dB SNR with sine wave
• Secured & Encrypted : AES 128
• Ethernet : 10/100/1000 Mbps data rate support with RGMII mode
• External Interfaces : Power Jack, USB, I/O Socket
• Power : 3.5W @CW and 5.5W @ QPSK
• Weight : 352 Gram Size: 102X93X34 mm
• Operating temperature of -40 °𝑐 to 85° c
• RF Connector : SMA(F)
• Application : Control, Monitoring, Telemetry data for UAVs
Air Pro-1 used as a Data link system, provides full duplex digital communication. QPSK modulation scheme used for maintaining high data
link performance with a high fade
margin. It is specifically designed for all UAV platforms with strict low size, weight, power and cost (SWaP-C) constraints.
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C Band Up-Down Converter
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• Selectable bandwidth from 250 KHz to 40 MHz
• Supports 70MHz and 140MHz IF
• Supports Remote Interface control
• LCD Display for selected Frequency, Gain &Bandwidth
• Local/Remote selection switch
• 1U 19” rack mountable, 10 kg max
• 230 V AC Power supply
• On board RF Synthesizers
• <-60 dBc Spurious rejection
• Cyclone II Controller
• 10/100 BaseT Ethernet Interface
• Max Output Power +10 dBm
• Harmonic Rejection < -60 dBc
• Receiver Sensitivity -110 dBm
The C-Band up/down converter is designed to be used in satellite communications and aerospace applications such as Tx and Rx for data transmission and reception in the C-band. The down converter converts 4.0 - 5.5 GHz to 70 MHz/140MHz and up converter converts from 70 MHz/140MHz to 4.0 - 5.5 GHz.
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Why ELDAAS
• Customer first policy
• Reduced total development costs
• Proven product design capabilities and established predictable process
• Experience in Design , Engineering Qualification and certification to Industrial as well as Mil grade standards. Manufacturing processes comply to IPC standards
• Flexible engagement model, at any stage of development and Manufacturing cycle.
• Established vendor relationships
• Experience in Various development platforms and Chipset types
• Experience with big programs like SDR, K9 Vajra, Kavach etc
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Ideas to Market
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Engagement Model
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• Build to Print
• Build to concept
• Build to Specifications
• Prototype to Volume production
• Flexible engagement from any stage to any stage
• Mass Manufacturing
Fixed cost
Actual Cost
Cost per hour
Cost per resource
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Our Customers
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Our Partners
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Upcoming Own Facility
• Total Area of the land:
43, 560 Sft
• Built up area: 10000 Sft
• Capacity to house 200 people
• Will be operational from Jan 2021
• Less than 5km from the International Airport
• Vegetation across the site
• Garden like invigorating environment, stimulation ideas and innovation
• Main building • Work-stations • Atrium
• Campus view
Aerospace Park
The Bengaluru Aerospace park is fast emerging
as a major aerospace manufacturing hub. It
comprises of a 1000-acre industrial park. This
land has been allotted to several Indian
companies and MNCs like HAL, BEL, Astra,
Boeing, Cyient, Centum, SAAB, etc. Many have
already started operating from the Aerospace
park providing a great eco system . An adjacent
SEZ has been developed in collaboration with
the US Aerospace Supplier Development
Mission to India.
Eldaas is constructing its own facility at the Aerospace Park in Bengaluru, with State-of-the-art facilities
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Products Global Presence
Bangalore Raleigh
eldaas
Confidential
USA
ELDAAS Technologies Inc
INDIA
ELDAAS Technologies Pvt. Ltd.
562110, Karnataka, India [email protected]
+91 80 42009090
1000 Bearcat Way STE 105Morrisville NC 27560, USA
+1 984 203 9494
Plot No. 27, Hi-Tech Aerospace & Defense Park,Bhatramarenhalli, Devanahalli, Bengaluru
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Suneel Kumar, CEO & Founder
Specialist in RF, Microwave
I.V.Sarma, Chairmanwith 4 decades of experience
in Technology development, Innovation, Manufacture and
Marketing with several
S.Varadarajan VP of RADARswith 3 decades of experience in development of Radars, Complex Technologies and systems; recipient of
many awards.
View Profile View Profile View Profile
and Digital Technologies
achievements and honours
The Leadership
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Thank You
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