Download - iphone 5 And Iphone 7 (april 14 And 17, 2017) · iPhone 5 and iPhone 7 (April 14 and 17, 2017) •iPhone 5 ‐WiFimodule •iPhone 7 ‐battery ‐application processors ‐wafer

iPhone 5 and iPhone 7(April 14 and 17, 2017)• iPhone 5‐ WiFi module

• iPhone 7‐ battery‐ application processors‐ wafer level packaging‐ 3D NAND

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iPhone 5

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WiFi Front End in iPhone 5

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Broadcom BCM4334 inside the Murata 331S0171 MCM

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Smartphone Front End

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We’ll close the detailed portion of this blog with a look at the Antenna Tuning Modules supplied by RF Micro. The RF1101 is a high power SPDT Switch and the RF1102 helps by optimizing the iPhones’ antennas for the specific bands in use. This lowers the power consumption of the phone whilst also allowing the carriers the ability to add more customers to the network.

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iPhone 7: Battery

Actually, it's a relatively benign Lithium‐ion battery. This 3.8 V, 1960 mAh battery is rated for a capacity of 7.45 Wh—a notable increase from the 6.55 Wh battery in last year's model.

138.3 x 67.1 x 7.1 mm

iPhone 4: 115.2 mm x 58.6 mm x 9.3 mm; 1400 mAh No major improvement in storage density.

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Black sheet covering the logic board

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Logic Board ‐ A

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Number of Transistors

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iPhone 73.3 Billions

iPhone 62 Billions

iPhone 51 Billion

iPhone 4<< 1 Billion

A10, 125 mm2

Application Processors

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iPhone 6’s A8 Processor

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A10 vs. A9• The A10 is the first Apple‐produced quad‐core SoC, with two high‐performance cores and two energy‐efficient cores. Apple claims that the high‐performance cores are 40% faster than Apple's previous A9 processor and that the two high‐efficiency cores consume 20% of the power of the high performance Hurricane cores.

• Apple states that it has 40% greater CPU performance and 50% greater graphics performance compared to its predecessor, the Apple A9.

• The new 6‐core GPU built into the A10 chip is 50% faster while consuming 66% of the power of its A9 predecessor. 18



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Fan‐Out WLP and Other Packaging Solutions

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Different Packaging Solutions

Now that it appears the 40 to 50 percent improvement in performance in the newest Apple A10 processor is largely from its wafer-level fan out packaging from TSMC, demand for the packaging approach is ramping fast. “This is one of the fastest ramps we’ve seem for a package in a long time,” said TechSearch International president Jan Vardaman. “It’s a very disruptive technology that will have a big impact on the industry.” The thinner, lower-cost packaging approach is also showing up in RF and audio codec chips in mobile phones, with ~2 billion units just in Samsung and Apple phones, potentially bringing big changes to the packaging materials market. Laminate substrate suppliers will see demand plunge, copper post suppliers will see little change, and makers of wafer-level dielectrics could potentially see 3X growth in volume. “But don’t think you’ll see that in revenue, since customers will really beat the prices down.”

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TSMC InFO (Integrated Fan‐Out)

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InFO WLP for A10

A10Memory

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InFO WLPthe Vertical Interconnect Pillars in the in FO WLP are about 250 um dia at an aspect ratio of 1:1 and are at a pitch of 350 um, no d

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Apple A10

A1026



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Qualcomm Snapdragon

Qualcomm SnapdragonSnapdragon is a suite of system on a chip (SoC) semiconductor products designed and marketed by Qualcomm for mobile devices. The Snapdragon central processing unit (CPU) uses the ARM RISC instruction set, and a single SoC may include multiple CPU cores, a graphics processing unit (GPU), a wireless modem, and other software and hardware to support a smartphone's global positioning system (GPS), camera, gesture recognition and video.

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Snapdragon 835

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Logic Board ‐ BUpdate! The Toshiba 3D NAND was in fact found in the 256GB version of the smartphone we tore down.

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3D NAND

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Toshiba “BiCS” for “Bit Cost Scaling

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NAND

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3D NAND

https://www.extremetech.com/computing/211812‐planar‐nand‐flash‐is‐dead‐all‐hail‐our‐new‐3d‐nand‐overlords

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3D NAND

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3D NAND

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3D NAND

Die photograph

Vertical NAND cell structure

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Download - iphone 5 And Iphone 7 (april 14 And 17, 2017) · iPhone 5 and iPhone 7 (April 14 and 17, 2017) •iPhone 5 ‐WiFimodule •iPhone 7 ‐battery ‐application processors ‐wafer

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