dismantling guide - nvidia€¦ · dismantling guide rev. 1.0 mellanox technologies confidential 2...

Document no. 3420 Mellanox Technologies Confidential

http://www.mellanox.com

Dismantling Guide

OPN: MTS3610

Rev. 1.0

Dismantling Guide Rev. 1.0

Mellanox Technologies Confidential

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NOTE:

THIS INFORMATION IS PROVIDED BY MELLANOX FOR INFORMATIONAL PURPOSES ONLY AND

ANY EXPRESS OR IMPLIED WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED

WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ARE

DISCLAIMED. IN NO EVENT SHALL MELLANOX BE LIABLE FOR ANY DIRECT, INDIRECT,

INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT

LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR

PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY,

WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE)

ARISING IN ANY WAY OUT OF THE USE OF THIS HARDWARE, EVEN IF ADVISED OF THE

POSSIBILITY OF SUCH DAMAGE.

Mellanox Technologies, Inc.

350 Oakmead Parkway Suite 100

Sunnyvale, CA 94085

U.S.A.

www.mellanox.com

Tel: (408) 970-3400

Fax: (408) 970-3403

Mellanox Technologies Ltd

PO Box 586 Hermon Building

Yokneam 20692

Israel

Tel: +972-4-909-7200

Fax: +972-4-959-3245

© Copyright 2011. Mellanox Technologies, Inc. All Rights Reserved.

Mellanox®, BridgeX®, ConnectX®, InfiniBlast®, InfiniBridge®, InfiniHost®, InfiniRISC®, InfiniScale®,

InfiniPCI®, PhyX® and Virtual Protocol Interconnect® are registered trademarks of Mellanox Technologies, Ltd.

CORE-Direct and FabricIT are trademarks of Mellanox Technologies, Ltd. All other marks and names mentioned

herein may be trademarks of their respective companies.

Contact Information

Should you have any questions regarding our Products, please feel free to contact us directly or contact our

local distributors.

Mellanox Technologies Call Center Tel: +

Email: [email protected]

http://www.mellanox.com/

mailto:[email protected]



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Table of Contents

Revision .......................................................................................................................................... 5

Preface............................................................................................................................................. 5 Intended Audience .......................................................................................................................... 5 Switch OPNs ................................................................................................................................... 5 Policy Statement ............................................................................................................................. 6 1 Dismantling Instructions ......................................................................................................... 7

1.1 Chassis Switch System Systems - General ..................................................................... 7 1.2 General Preparations ....................................................................................................... 7

2 Extraction of the Modules ....................................................................................................... 8

2.1 Extracting the Power Supply Unit (PSU) ....................................................................... 8 2.1.1 PSU Sub Assembly Disassembling ............................................................................ 9

2.2 Extracting the Leaf Board ............................................................................................... 9 2.2.1 Leaf Module Sub Assembly Disassembling ............................................................. 11

2.3 Extracting a Spine Board .............................................................................................. 11 2.3.1 Spine Module Sub Assembly Disassembling ........................................................... 13

2.4 Management Module Extraction................................................................................... 14

2.4.1 Management Module Sub Assembly Disassembling ............................................... 15

2.5 Battery Extraction ......................................................................................................... 17 2.6 Memory Card Extraction .............................................................................................. 17

2.7 Fan Extraction ............................................................................................................... 19 2.7.1 Fan Module Sub Assembly Disassembling .............................................................. 20

3 Chassis and Backplane .......................................................................................................... 21

List of Tables

Table 1: Revision ...................................................................................................................... 5

Table 2: Switch OPNs for this Procedure ................................................................................. 5

Table of Figures

Figure 1 Front and Rear View of the MTS3610 ....................................................................... 7 Figure 2 Spine Side of Chassis .................................................................................................. 8 Figure 3 Power Supply Unit ...................................................................................................... 8 Figure 4 Remove the Mechanical Enclosure and Fans ............................................................. 9 Figure 5 Removing a Leaf ....................................................................................................... 10

Figure 6 Leaf Latches .............................................................................................................. 10 Figure 7 Mechanical Enclosure Screw Locations ................................................................... 11 Figure 8 Spine Side ................................................................................................................. 12

Figure 9 Ejector Latch ............................................................................................................. 13 Figure 10 Remove the Screws ............................................................................................... 13 Figure 11 Management Module ............................................................................................ 14 Figure 12 Management Module Latches ............................................................................... 15



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Figure 13 Management Module ............................................................................................ 16 Figure 14 Remove Battery .................................................................................................... 17 Figure 15 Memory Card Location ......................................................................................... 18

Figure 16 Memory Card Slots ............................................................................................... 18 Figure 17 Remove Fan Modules ........................................................................................... 19 Figure 18 Remove the Fan Module Cards............................................................................. 20 Figure 19 Remove the Chassis Screws.................................................................................. 21



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Revision

Table 1: Revision

Revision Date

1.0 Oct. 2010

Preface

This manual is intended as a reference for dismantling MTS3610 switch systems in

preparation of meeting the requirements of WEEE recycling.

Intended Audience

This manual is intended for technicians who dismantle the switch systems, as a reference

for WEEE recyclers.

Mellanox Technologies emphasizes the importance of carefully following all procedures

described in this guide to prevent personal injury.

Switch OPNs

This document is valid for all of the switch OPNs listed in Table 2.

Table 2: Switch OPNs for this Procedure

MTS3610



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Policy Statement

Mellanox Technologies recognizes the importance of developing connectivity solutions

that not only enable our customers to optimize their data centers performance, but also

protect the environment and ensure that future generations enjoy its bounties. Mellanox

Technologies is committed, therefore, to meeting the requirements of the European

Union’s WEEE (waste electrical and electronic equipment) directive. The directive

mandates how the materials used in electrical and electronic equipment must be disposed

of.

Mellanox Technologies has worked closely with its suppliers to eliminate hazardous

materials from its products. There are instances, however, where it has not proven

possible to completely eliminate all hazardous materials. Consequently, all applicable

products are labeled with a crossed out “wheelie” bin symbol, indicating that special care

must be applied to their disposal and / or recycling.



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1 Dismantling Instructions This chapter provides detailed instructions for dismantling the InfiniBand chassis switch

systems. Follow the instructions in the order they are presented.

1.1 Chassis Switch System Systems - General

The chassis switch system complies with the RoHS directive under the exemption known

as RoHS-R-5.

Chassis switch systems are comprised of:

Leaf modules

Spine modules

Management modules

Fan modules

Power supply modules

Chassis and other mechanical parts such as slot dividers

Backplane

Figure 1 Front and Rear View of the MTS3610

1.2 General Preparations

The switch system is assembled using Philips screws, and handles with snap in latches

for modules.

To disassemble the switch system parts you will need a small Philips screwdriver.

The pictures displayed in the following pages provide visual guidance explaining how to

remove the modules from the mechanical base.

Spines

Power

supplies

Fan module

Leafs

Fan module

Management

modules



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2 Extraction of the Modules

2.1 Extracting the Power Supply Unit (PSU)

Figure 2 Spine Side of Chassis

To extract a PSU:

1. Remove the power cord from the power supply unit.

Figure 3 Power Supply Unit

2. Grasping the handle with one hand, push the black latch release while pulling the

handle outward.

Power Supply Units

Latch

Handle



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3. Remove the PSU.

4. Remove all PSUs from the chassis.

2.1.1 PSU Sub Assembly Disassembling

After removing the PSUs use a Philips screwdriver to disassemble the mechanical covers

and remove all sub components.

Figure 4 Remove the Mechanical Enclosure and Fans

5. Remove the Fans from the PSU.

2.2 Extracting the Leaf Board

There are up to 18 leaf modules located on the front side of these products.

The leaf module is removed from the chassis using snap handles.

The following pictures show how to open the snap handles and remove the leaf module

from the chassis.



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Figure 5 Removing a Leaf

Figure 6 Leaf Latches

1. Push from the center of the leaf in an outward direction on the red buttons.

2. Continue pushing outward until the snaps pop.

3. Grab the snaps and pull the leaf out of the chassis.

4. Remove all leafs from the chassis.



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2.2.1 Leaf Module Sub Assembly Disassembling

1. After removing the modules use a Philips screwdriver to disassemble the mechanical

covers and remove all sub components.

Figure 7 Mechanical Enclosure Screw Locations

2. Remove the Heat sink and the board.

2.3 Extracting a Spine Board

There are up to 9 Spine modules located on the rear side of the product.



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The Spine module is removed by opening the handles.

Figure 8 Spine Side

1. Push outward on the latches to unlock the ejectors from the chassis.

2. Open the ejectors until they are 90 degrees from the module.

3. Pull out on the module using both ejectors.

4. Remove all spines from the chassis.



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The following pictures show how to use the snap handles to remove the Spine module

from the chassis.

Figure 9 Ejector Latch

2.3.1 Spine Module Sub Assembly Disassembling

After removing the modules use a Philips screwdriver to disassemble the mechanical


Figure 10 Remove the Screws

Lock for the Ejector Latch



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Remove the Heat sink and the board.

2.4 Management Module Extraction

There are 1 or 2 management modules located on the front side below the leaf modules.

The management module is removed using the snap handles.

Figure 11 Management Module



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Figure 12 Management Module Latches

1. Push from the center of the leaf in an outward direction on the red buttons.

2. Continue pushing outward until the snaps pop.

3. Grab the snaps and pull the leaf out of the chassis.

4. Remove all management modules from the chassis.

2.4.1 Management Module Sub Assembly Disassembling





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Figure 13 Management Module



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2.5 Battery Extraction

In all Mellanox systems where there is a CPU board and / or management board, there is

a: COIN TYPE LITHIUM BATTERY CR1620 3V 75MA.

Figure 14 Remove Battery

2.6 Memory Card Extraction

There are 1 or 2 Memory cards in the MTS3610 systems.

1. Unscrew and remove the wing nut.

2. Remove the lock down clamp.

3. Remove the memory card(s) by pulling it out of the card slot.

Remove the

battery



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Figure 15 Memory Card Location

Figure 16 Memory Card Slots



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2.7 Fan Extraction

There are 2 Fan modules located in the MTS3610 system.

One is horizontal and one is vertical.

Figure 17 Remove Fan Modules

Leaf Side Fan

Module



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1. Unscrew the four thumbscrews using your fingers or a Phillips screwdriver. They are

captured and will not come out.

2. Pull the two handles simultaneously, and slide out the fan module.

2.7.1 Fan Module Sub Assembly Disassembling


covers and remove all sub components(fans and fan cards).

Figure 18 Remove the Fan Module Cards

Spine Side Fan

Module

Fan cards



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3 Chassis and Backplane

After removing and disassembling all field replaceable modules use a Philips screwdriver

to disassemble the chassis and the Backplane.

1. Remove the top and side screws to remove the cover and side panels.

2. Slide out the cover.

3. Unscrew the backplane screws and remove the backplane.

Figure 19 Remove the Chassis Screws

Screws



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