Detailed Design For Manufacturability Analysis Product Name: XYZ1243

Component BOM NumberProduct Name: 1Component 1 8Component 2 2Component 3 1Component 4 6Component 5 3Component 6 2Component 7 1Component 8 2Component 9 3

Component 10 2Component 11 1Component 12 1Component 13 1

Processes NumberBoard prep 1Screen Printing 1Autoinsertion (overhead) 2Adhesive dispense (overhead) 1Solder reflow 1Inspect 2Test 1Que 3Board Handling 8Manual Insertion (overhead) 1TotalAssembly time sec. 1910Assembly time min. 31.8DPU 0.222DPPM 222,164 First Pass Yield 80.1%© Thomas A. Little CONSULTING, 1999

Customer Name: n/a Date:Description Assy Type Component Assy Time (sec.)

SMT&ManualSMT/Auto 2SMT/Auto 0.5SMT/Auto 3SMT/Auto 0.5SMT/Auto 0.5SMT/Auto 0.5SMT/Auto 1SMT/Auto 0.75SMT/Auto 1.2SMT/Auto 0.35

Manual 0.5Manual 0.5Manual 1.3

Description n/a n/a

Definitions:# Component opportunities

# Board opportunities # Adhesive dispense opportunities

# Auto-insertion opportunities # Manual insertion opportunities

# Screen printing opportunities

3/1/2002Extended Assy Time # Opportunities (d) Probability of a Defect P(d)

16000 0.0000116 65 0.00002

1 20 0.000023 56 0.00023 2 0.00002

1.5 2 0.000021 2 0.000021 150 0.00002

1.5 65 0.000023.6 55 0.000020.7 4 0.000020.5 2 0.000020.5 2 0.00000021.3 54 0.00002

Assembly Time # Opportunities (d) Probability of a Defect P(d)100 5 0.0003200 13000 0.0000007100 150 0.0000002100 75 0.0000007150 13000 0.0000007100 16000 0.0000007320 16000 0.0000007500 0 0

75 6 0.00006200 4 0.0000002

=number of leads/joints for all components (includes component defects, and insertion related defects) =number of SMT solder pads+number of through holes+number of interconnects (board related defects only) =total number of adhesive spots placed on the board (adhesive dispense related defects only) =machine setup related errors (defects which are other than component placement) =manual insertion setup related errors =number of SMT solder pads

DPU Ave. Rework (sec.) Rework (sec.) Yield0.1600 24.00 150 85.2%0.0013 0.08 60 99.9%0.0004 0.01 25 100.0%0.0112 1.34 120 98.9%0.0000 0.00 50 100.0%0.0000 0.00 50 100.0%0.0000 0.00 50 100.0%0.0030 0.24 80 99.7%0.0013 0.07 50 99.9%0.0011 0.08 75 99.9%0.0001 0.00 30 100.0%0.0000 0.00 20 100.0%0.0000 0.00 20 100.0%0.0011 0.09 80 99.9%

DPU Ave. Rework (sec.) Rework (sec.) Yield0.0015 0.30 200 99.9%0.0091 1.82 200 99.1%0.0000 0.00 75 100.0%0.0001 0.00 75 100.0%0.0091 0.68 75 99.1%0.0112 0.84 75 98.9%0.0112 0.84 75 98.9%0.0000 0.00 75 100.0%0.0004 0.03 75 100.0%0.0000 0.00 75 100.0%

=number of leads/joints for all components (includes component defects, and insertion related defects) =number of SMT solder pads+number of through holes+number of interconnects (board related defects only) =total number of adhesive spots placed on the board (adhesive dispense related defects only)

unitsUSL 9 milsLSL 5 milsTarget 7 milsAverage 7.2 milsStandard Deviation 0.95 mils

Loss USL 2.91%Loss LSL 1.03%Loss Total 3.93%Yield 96.07%DPU 0.0393