design automation in power electronics design automation in...

Design Automation in Power Electronics

Alan Mantooth, University of Arkansas

H. Alan MantoothDistinguished Professor of Electrical Engineering

President, IEEE Power Electronics Society

Executive Director, NSF Center forGRid-Connected Advanced Power Electronics Systems (GRAPES)

Deputy Director, NSF Engineering Research Center forPower Optimization of Electro-Thermal Systems (POETS)

November 5, 2018

Design Automation in Power Electronics

IEEE PEAC 2018 No Reprint Without Authorization

Design Automation for Power Electronics


Outline

Emerging Trends• Conclusion => Wide Bandgap design is here to stay for

many reasons and applications

• BUT, we still have technologies to put into place to produce optimal designs

• One of these areas of technological need is in our tooling (i.e., Design Automation)

Review of DAPE Workshop in September

Describe Key Gaps and Hope to Inspire New Ideas

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Conclusions from Emerging Trends Talk

High speed switching of WBG technology offers advantages, but comes with penalties if not carefully deployed

Heterogeneous integration is required to unleash the full capability of SiC power devices

Added capabilities around the SiC power device can help with integration and reliability

Issues with EMI and signal integrity can be addressed through circuit and integration solutions, and with the aid of design tools

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Emerging Trends in SiC Power Electronics


Poor Integration Leads to Failures




H. Alan Mantooth, General ChairUniversity of Arkansas

Portland, OregonSeptember 22, 2018



Alan Mantooth, University of Arkansas 6

Workshop Purpose

Understand the current state-of-the-art in design automation for power electronics

Describe emerging needs => driven by WBG technologies

GOALS

A clear identification of the common ground and synergy between power electronics and design automation

An understanding of the limits of the current design automation technology and tools

Capture the needs for future workIEEE PEAC 2018 No Reprint Without Authorization



DAPE ProgramFirst Session

08:30-09:00 Alan Mantooth University of Arkansas Workshop Opening Keynote Speech

09:00-09:30 Johann Kolar ETH Zurich Power Electronics Design 4.0

09:30-10:00 Brian Peaslee General Motors Automotive Power Electronics Detailed Design and Analysis

10:00-10:30 Tony Lennon Mathworks Electric Powertrain Development – Transitioning between Levels of Power Electronics Simulation Fidelity

10:30-11:00 Coffee Break .

11:00-11:30 Mick Tegethoff Mentor Graphics Understanding the Impact of On-Chip Power Electronics on IC Performance via Electrothermal Circuit Simulation

11:30-12:00 Steve Chwirka ANSYS Coupled Multi-Physics FEA and Circuit Solutions for Power Electronics

12:00-12:30 Panel Discussion

12:30-14:00 Lunch Break .




DAPE ProgramSecond Session

14:00-14:30 Dushan Boroyevich Virginia Tech EDA Tools for Aerospace Power

14:30-15:00 Kamiar J. Karimi Boeing Electronics: Status, Challenges, and Barriers

15:00-15:30 Alan Courtay Synopsys Methods and Tools to Efficiently Model Power Electronics Components from Datasheets: Power Diodes, MOSFETs, IGBTs, BJTs, Fuses, Magnetics and Motors

15:30-16:00 Coffee Break .

16:30-17:00 Frede Blaabjerg Aalborg University Mission-Profile-based Reliability Design Tools -Current Status and Outlook

17:00-17:30 Ivan Čelanović Typhoon HIL Ultra-high Fidelity Real-Time Simulation for Power Electronics and Microgrids: Empowering Test Driven Development

17:30-18:00 Panel Discussion.

18:00-20:00 DAPE Reception .




Design Automation Primer

Electronic Design Automation (a.k.a. Electronic Computer-Aided Design) is a category of software tools for designing electronic systems such as integrated circuits and printed circuit boards.

The tools work together in a design flow that chip designers use to design and analyze entire semiconductor chips. Since a modern semiconductor chip can have billions of components, EDA tools are essential for their design.

Source: Wikipedia

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Workshop Topics

Tool vendors spoke of the current capabilities of their tools• Modeling and simulation with Saber

• Multi-level modeling and simulation with Matlab/Simulink

• Electro-thermal analysis for on-chip power supplies

• FEA with ANSYS tools

• Hardware-in-the-loop with Typhoon HIL

Industry shared their current practices in automotive and aerospace (GM, Boeing)

Academics described how they see things developing now and in the future (Kolar, Boroyevich, Blaabjerg)

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Model-based Design was a Prevalent Theme

Several versions of the V-diagram were presented

The term “digital twin” was elaborated as a current and evolving practice

Multi-objective design optimization• Hierarchical

• Multidisciplinary

• The right approach…?

Power electronics visions• Power Electronics Design 4.0

• Parameter Uncertainty Quantification

• Design for Reliability and Robustness

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MBE Design Flow

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GM Flow

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Source: Brian PeasleeIEEE PEAC 2018 No Reprint Without Authorization



Mathworks V

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Source: Tony Lennon




Digital Twins!

15Source: www.railwayage.com via Johann Kolar


http://www.railwayage.com/



Digital Twins!

16Source: US Air Force via Johann Kolar




Digital Twins!

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Source: Johann KolarIEEE PEAC 2018 No Reprint Without Authorization



Multi-ObjectiveOptimization Approach

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Electric Circuits Model Electro-

magnetic Model

Digital Controller Model

Models for Passives

Loss Model + Thermal Model




Abstraction of Power Converter Design

19Source: Johann Kolar




OEM-level Optimization

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Source: Brian Peaslee




Multi-physics Problem

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Source: Brian Peaslee




Multidisciplinary Design Optimization

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Source: Dushan BoroyevichIEEE PEAC 2018 No Reprint Without Authorization



Power ElectronicsDesign Flow

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• … from the specs we go into…

• Schematic (Matlab/Simulink, PLECS, LTSpice, Saber, …)

• Controls (Matlab, HIL, PHIL)

• Component Selection (passives, modules)

• Electro-thermal Circuit Analysis

• Board Layout

• PEX, DRC

• Thermal, Electrical, EMI, Accurate Modeling

• Cabinet Design

• Cabinet Layout (Modules, Passives, bussing)

• Electro-thermal Analysis

• Manufacturing

• TestIEEE PEAC 2018 No Reprint Without Authorization



Optimization is the Approach

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Multi-Objective Optimization – Guarantees Best Utilization of All Degrees of Freedom

Source: Johann KolarIEEE PEAC 2018 No Reprint Without Authorization



Power ElectronicsTechnology S-Curve





PE Design 4.0





Conclusions from DAPE






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Source: Tony Lennon




Power Electronics DA Gaps

Widely-accepted design flow

Extraction of PC board parasitics and back annotation onto schematics

Signal integrity analysis for power electronics

Support for simultaneous electro-thermal co-design

PE circuit synthesis

PE design optimization

Module design optimization

Cabinet design optimization

Uncertainty quantification

Design for reliability

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