current mobile manufacturing scenario in india
TRANSCRIPT
1. Design and customization from Ref. Design(with Certifications)
2. Board Assembly - SMT
3. Board Level Testing
Assembly4. Assembly
5. Verification
6. Final SW flashing
7. Packing
PURCHASE,STORES……..
CONFIDENTIAL : T Y JOSE [email protected] Mob 9496276116
CONFIDENTIAL : T Y JOSE [email protected] Mob 9496276116
CONFIDENTIAL : T Y JOSE [email protected] Mob 9496276116
Design:
1. Electrical CAD Tools with Signal integrity
2. OSCILOSCOPE with Logic ANALYZER
3. VSA VSG for Radio capability
4. Power supplies
5. Mechanical CAD tools.5. Mechanical CAD tools.
6. Thermal analysis SW& Tools
Board Assembly SMT:
1. Screen Printer
2. Pick and Place
3. Reflow
4. Conveyor
5. AOI (optional)
CONFIDENTIAL : T Y JOSE [email protected] Mob 9496276116
Testing and Final Assembly:
1. Flashing Interface
2. Bench Power supply
3. Multi meter, VSA/VSG or CMU
4. Tools
5. Pneumatic Press
6. Fixtures6. Fixtures
7. Electrical screw driver
8. ESD proof soldering station
9. Work Benches ESD Proof
SW Loading:
1. Flashing Interface
Packing:
1. USB Barcode scanner
2. PC
CONFIDENTIAL : T Y JOSE [email protected] Mob 9496276116
Design Digital and RF : Capital - 150-200L . Space -1000 Sq. feet
Design Mechanical:Capital - 50 L , Man power 1+1
Board Assembly SMT :Capital - 100 -200 L . Space -1500 Sq. feet per line
Testing and Assembly : Capital 100-250 L , Space- 1000 Sq. Feet per set up
CONFIDENTIAL : T Y JOSE [email protected] Mob 9496276116
Process Option 1 Option 2 Option 3
Design In house design
• Capital cost
• Risks
Out source deign to
R&D house
• IP
• Quality
Use China ODM
• Identification
• Cost
Mech.
Design
Plastic parts
In house design
• Capital cost
• Tooling cost
10L
Outsource design +
Tooling
• Design - 5L Tooling
– 10L Per Product
Use China ODM
10L – 10L Per Product
SMT In house SMT
• Capital cost
Out source Initially to
EMS till Volume
balances with capital
cost
• Quality risks
From China ODM
Testing &
Assembly
In house In house In house
CONFIDENTIAL : T Y JOSE [email protected] Mob 9496276116
Assembled boards from ODMs in China, Chip set: Qualcomm, Mediatek…..
Casing from China or customized in India.
Final Testing in India factory.Final Testing in India factory.
SW (Android)Flashing and Packing in India.
Inputs:
Board, display and mechanicals
IMEI and MAC address.
Test Stations and assembly units
CONFIDENTIAL : T Y JOSE [email protected] Mob 9496276116
CONFIDENTIAL : T Y JOSE [email protected] Mob 9496276116
T Y JOSE
Mob: 9496276116/9952967626
Mail: [email protected]
Web: https://in.linkedin.com/in/tyjose