cs1 epoxy curing agents[1]

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Epoxy Additives for Adhesives Applications Epoxy Additives for Adhesives Applications

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Page 1: CS1 Epoxy Curing Agents[1]

Epoxy Additives forAdhesivesApplications

Epoxy Additives forAdhesivesApplications

Page 2: CS1 Epoxy Curing Agents[1]

TABLE OF CONTENTS

Introduction ................................1

Two-Component Adhesives...........2-5

Top Epoxy Additives Recommendations ......2

Typical Handling Properties..........................2

Typical Performance Properties ...................3

Comparison Charts.......................................4

Curing Agent Selector Guide ........................5

One-Component Adhesives..........6–8

Top Curing Agent Recommendations...........6

Dicyandiamide Grades..................................6

Substituted Ureas .........................................7

Curing Agent Selector Guide ........................8

Starting Formulations..................back pocket

Page 3: CS1 Epoxy Curing Agents[1]

Mention the word “epoxy,” and people think“glue.” Epoxies have been used as adhesivesfor decades because their chemical structureand resulting properties are well-suited foradhesive applications. Epoxies are also rela-tively easy to process, and therefore haveearned themselves a workhorse reputationamong common adhesive chemistries.

Epoxy-based adhesive formulations offeroutstanding adhesion to a wide variety ofsubstrates, and effectively bond many dis-similar surfaces. They impart tremendousphysical strength to finished products, making epoxies ideal for load-bearing (orstructural) adhesives. Epoxies shrink verylittle during cure, and can be formulated toprovide excellent resistance to chemicals,moisture and heat, making them a morerobust choice than many other resin types.They are suitable for use in 100% solids and water-based formulations, and they display good wetting characteristics onproperly prepared substrates.

Epoxy adhesives are extremely versatile, as they can be formulated with a vast arrayof curing agents, additives and fillers to meet varying processing conditions andperformance requirements. Such versatilityis valuable within the adhesives market.Consider dozens of substrate types, varyingcure conditions, distinct form requirements(pastes, liquids, films, etc.), different pack-aging options (one-component versus two-component) and wide-ranging performancecriteria—the resulting combinations arecountless. Once epoxy chemistry has beenselected for an adhesives job, a whole newset of choices emerge, such as which curing agent to use and what additives areneeded—the list goes on and on.

Air Products has been a major supplier of technologies to the adhesives industry for over 30 years. Today, we offer an unparalleled range of epoxy products tomeet the diverse needs of adhesive formulators, including:

• Polyamides• Amidoamines• Aliphatic Amines• Cycloaliphatic Amines• Diluents• Tertiary Amines• Dicyandiamide• Substituted Ureas• Imidazoles• ModifiersOur novel technologies are marketed under the Amicure®, Ancamine™, Ancamide™,Epodil™, Imicure®, Dicyanex™, Nourybond®,and Curezol* trade names. The products are used in one-component (1K) and two-component (2K) adhesive applications, aswell as in automotive plastisol formulations.**The purpose of this guide is to serve as a resource for selecting curing agents,accelerators and/or diluents for epoxy-based adhesive formulations.

*Curezol is a registered trademark of Shikoku Chemicals Corporation.

**For more information on our Nourybond adhesion promoters for automotive plastisol formulations, please see ourpublication High Performance Adhesion Promoters for Automotive Plastisols.

INTRODUCTION

1

Page 4: CS1 Epoxy Curing Agents[1]

Typical Handling Properties

Curing Agent AHEW Viscosity(1) Mix Gel Time(3) TFST(4) % %(cps, 25 °C) Viscosity(2) minutes hours Cure(5) Cure(5)

(cps, 25 °C) (150g, 25 °C) (6 mil, 25 °C) (1-Day) (7-Day)

Aliphatic Amines

Ancamine 1922A 55 10 510 77 1.5 89 94

Ancamine 1768 95 220 2,820 7 1.5 84 88

Ancamine 1769 48 600 4,170 30 2.5 78 86

Ancamine 2205 95 3,500 14,000 6 1.0 54 63

Ancamine 2390 204 1,200 1,910 25 5.2 87 92

Polyamides

Ancamide 910 230 6,000 6,640 120 8.3 96 99

Ancamide 2482 125 5,500 10,500 130 7.0 83 90

Ancamide 2424 114 14,000 20,000 60 3.0 72 83

Ancamide 260A 120 40,000 19,100 120 10.0 75 90

Ancamide 350A 100 11,000 13,800 170 11.0 62 80

Amidoamines

Ancamide 520 90 175 630 130 11.0 73 87

Cycloaliphatic Amines

Ancamine 2264 54 2,600 6,300 154 5.2 64 74

TWO-COMPONENT ADHESIVESThe term “two-component” (or 2K, the “K”derived from the German spelling of theword komponent) indicates that the curingagent portion and the epoxy resin portion of the adhesive formulation are packagedseparately. The two are kept separate untilready to use, because when combinedunder ambient environmental conditionsthey will react either partially or completely.

There are many different end use marketapplications for 2K adhesives, including auto-motive, aerospace, electrical insulation andgeneral industrial markets. Air Products

offers a broad selection of materials fromwhich the two-component epoxy adhesiveformulator can choose. These products provide a selection of performance and handling properties as diverse as the formu-lation needs themselves. Our 2K productline includes polyamides, amidoamines,aliphatic amines, cycloaliphatic amines, diluents and modifiers.

While there are many products within ourline suitable for use in 2K adhesive applica-tions, our top recommendations are high-lighted below. In order to better understandthe capabilities of each curing agent, pleaserefer to the following charts and tables for

typical handling and performance properties.Additionally, a set of starting point formula-tions is located in the back pocket of thisbrochure. These formulations contain evenmore specific handling and performance data.

PolyamidesPolyamides are the standard class of hard-eners used to cure epoxy resins for 2Kadhesives. These low-toxicity, ambient-cureproducts impart excellent flexibility and goodtoughness—critical attributes for many 2Kadhesive formulations. Polyamides are typi-cally high in viscosity, have long pot livesand provide good water/corrosion resistance.

Air Products Epoxy Additives for 2K Adhesive Formulations—Top Recommendations

Aliphatics Polyamides Amidoamines Cycloaliphatics Tertiary Amines Diluents Modifiers

Ancamine 1922A Ancamide 910 Ancamide 520 Ancamine 2264 Ancamine K-54 Epodil 748 Epodil L

Ancamine 1768 Ancamide 2482 Epodil 749

Ancamine 1769 Ancamide 2424 Epodil 750

Ancamine 2205 Ancamide 260A

Ancamine 2390 Ancamide 350A

2

(1) ASTM D 455-83, Brookfield RV (2) ASTM D 455-83, Brookfield RV; w/ liquid DGEBA, EEW=190

(3) Techne GT-4 Gelation Timer (4) BK Drying recorder

(5) DSC analysis, 10 °C/min ramp

Page 5: CS1 Epoxy Curing Agents[1]

Typical Performance Properties

Curing Agent Tensile Tensile Tensile Flexural Flexural Hardness(3) Glass Glass Water WaterStrength(1) Modulus(1) Elongation(1) Strength(2) Modulus(2) (Shore D) Transition Transition Absorption(5)% Absorption(5)%(psi) (Kpsi) (% at (psi) (psi) Temp(4) °C Temp(4) °C (7-Day (30-min

Break) (7-Day (30-min@ @ 25 °C) @120 °C)@25 °C) 120 °C)

Aliphatic Amines

Ancamine 1922A 9,000 470 6 13,500 470 82 49 77 1.70 1.58

Ancamine 1768 11,500 490 4 15,900 590 82 52 74 1.30 1.18

Ancamine 1769 2,000 790 4.2 5,240 610 80 58 103 0.95 1.47

Ancamine 2205 — — — 3,960 540 70 57 76 1.75 1.21

Ancamine 2390 3,236 120 54 4,380 130 72 52 38 2.39 2.34

Polyamides

Ancamide 910 1,000 140 100 — — 57 22 19 3.62 3.65

Ancamide 2482 9,400 370 6 15,800 410 77 46 78 2.27 1.22

Ancamide 2424 4,400 590 1 6,800 460 84 57 83 1.39 1.18

Ancamide 260A 5,300 310 5 12,500 260 85 43 96 1.99 1.49

Ancamide 350A 4,400 510 1 11,600 360 84 49 97 1.33 1.48

Amidoamines

Ancamide 520 7,900 420 3 13,800 410 82 53 83 1.55 1.61

Cycloaliphatic Amines

Ancamine 2264* 11,900 480 21,100 460 87 56 128 0.71 0.76

More recently developed polyamides providelower viscosity, better compatibility withepoxy resins and better cure profiles underadverse conditions than standard polyamides.

AmidoaminesAmidoamines as a class of curing agents arelow in viscosity and vary in reactivity fromfast to ultra-slow. They exhibit very goodadhesion (particularly to concrete and otherporous substrates) due to their chemicalstructure. They also cure extremely wellunder humid conditions. DOT noncorrosiveversions of several standard amidoaminesare available.

Aliphatic AminesAliphatic amines typically provide the 2Kadhesives formulator with fast reactivity andare therefore often used as accelerators forother curing agents. Many can be cured ateither ambient or elevated temperatures. Theyare relatively moisture insensitive with goodchemical resistance, particularly to solvents.

Mechanical strengths of an aliphatic amine-cured system are generally high. For heat-cure applications, most aliphatic aminesprovide good elevated temperature perfor-mance, very good chemical resistance andgood electrical properties.

Cycloaliphatic AminesCycloaliphatic amines provide good adhe-sion and very good chemical resistance, as

well as excellent color and color stability. Theycure well at low temperatures, even underdamp conditions. Within the cycloaliphaticfamily exists a range of cure times, cureschedules (ambient vs. heat cure) and potlives. For heat-cure applications, cycloaliphaticamines provide high glass transition temper-atures, excellent chemical resistance andstrong mechanical performance.

Reactive DiluentsMonofunctional and difunctional glycidylethers reduce the viscosity of typical epoxyresins without causing significant changesin final physical properties of adhesive for-mulations. Their benefits include improvedease of application and improved pigment/filler wetting.

3

Part A:

Standard DGEBA Liquid Epoxy 60 parts

Talc (Microtuff 325F)(1) 38 parts

Fumed Silica (Cab-O-Sil TS-720)(2) 2 parts

Part B:

Curing Agent 50 parts

Aluminum (Toyal 101)(3) 22 parts

Talc (Microtuff 325F) 27 parts

Fumed Silica (Cab-O-Sil TS-720) 1 part

Unless otherwise specified, tests requiring a formulated systemwere comprised of standard liquid epoxy DGEBA resin mixed with a stoichiometric amount of curing agent. The formulations werecured for 7 days at 25° C/50% relative humidity. Tensile and flexuralstrength tests were conducted using the following model adhesiveformulation with mix ratio for A:B using a 1:1 stoichiometric ratio.Hardness, glass transition temperature and water absorption testswere conducted on neat DGEBA liquid resin/amine curing agentmixtures, using a 1:1 stoichiometric ratio.

*These test specimens were cured at 120 °C for 30 minutes(1) ASTM D638-86

(2) ASTM D790-86(3) ASTM D2240-86

(4) ASTM D3418-82(5) Water weight gain (%) after 7 days @ 41 °C cure

(1) Microtuff 325F is manufactured by Barretts Minerals, Inc.(2) Cab-O-Sil TS-720 is manufactured by Cabot Corporation(3) Toyal 101 is manufactured by Toyal-America

Page 6: CS1 Epoxy Curing Agents[1]

Typical Handling Properties

High

AHEW

2390

910

50

300

250

225

200

175

150

125

100

75

520,17682205,350A

2424,260A2482

High

MIXED VISCOSITY

2264910

2482

1922A,5202390,1768

350A2205

24,000

22,000

20,000

18,000

16,000

14,000

12,000

10,000

8,000

6,000

4,000

2,000

260A2424

Shortest

Longest

GEL TIME

22051768

9102264

350A

20

200

180

160

140

120

100

80

60

40

2482350A

2390,1769

2424

1922A

260A

Shortest

THIN FILM SET TIME

2482

350A520

260A

910

220517681922A

23902264

1

2

3

4

7

5

6

8

9

10

11

12

2424

Most

Least

% CURE (1 DAY)

1768, 2482

2205

910

260A,5202424

2264

100

90

70

80

60

50

1922A, 2390

350A

Most

Least

% CURE (7 DAYS)

1922A

2390260A, 2482

2205

910

350A

2264

100

90

70

80

60

50

1768, 520

2424

COLOR(Gardner)

Low Low

High

1922A176917682390

2205

910

2482,520260A,350A

24242264

1

2

3

4

7

5

6

8

9

10

11

12

Low

High

VISCOSITY

2390

1922A520,1768, 1769

2482

2205

260A40,000

14,000

13,000

12,000

11,000

10,000

9,000

8,000

7,000

6,000

5,000

4,000

3,000

2,000

1,000

2264

910

350A

2424

Low

Longest

176922641922A

1769

4

TWO-COMPONENT ADHESIVES — TOP CURING AGENT RECOMMENDATIONS

Page 7: CS1 Epoxy Curing Agents[1]

Ancamide 520

• Amidoamine

• 175 cps

• Cost-effective

Ancamide 2264

• Highest Tg with heat cure

• Excellent chemical resistance

• Good toughness

Ancamine 1788

• Fast curing aliphatic amine

• 220 cps

• 10-minute gel time

Ancamine 2205

• Fast curing aliphatic amine

• 3,600 cps

• 6-minute gel time

Ancamine 1922A

• Best thermal shock resistance

• Best electrical properties

• Ultra-low viscosity (~10 cps)

Ancamide 260A

• Good flexibility and adhesion

• ~40,000 cps

• 65 phr

Ancamine 2390

• Flexible hardener allowing 1:1 mix ratio

• High elongation, tear resistance and toughness

Improved electricals, thermal shockresistance and viscosity

Lower Viscosity

ImprovedChemical Resistance

Traditional Polyamides

Improved Flexibility

Ancamide 2482

• Best general-purpose polyamide foradhesive applications

• Excellent adhesion, good flexibility

• Low viscosity

• Cost-effective

Ancamide 910

• Outstanding flexibility (100% elongation)

• Best-in-class peel strength (>40 pli)

• Excellent thermal shock resistance

• Good electrical properties

5

Faster Cure

TWO-COMPONENT EPOXY ADHESIVE CURING AGENT SELECTOR GUIDE

Ancamide 1769

• Rapid ambient or heat cure

• No plasticizers or VOCs

• Good electrical insulation properties

• Dot noncorrosive

• Low PHR (25)

Ancamide 2424

• Increased reactivity/rapid strength development

• Enhanced low-temperature cure

Ancamide 350A

• Good flexibility and adhesion

• ~11,000 cps

• 55 phr

Page 8: CS1 Epoxy Curing Agents[1]

Air Products Epoxy Additives for 1K Adhesive Formulations—Top Recommendations

Aliphatics Dicyandiamide Imidazoles Tertiary Amines Ureas

Ancamine 2014AS Amicure CG-325 Imicure AMI-2 Amicure DBU-E Amicure UR

Ancamine 2014FG Amicure CG-1200 Imicure EMI-24 Amicure BDMA Amicure UR2T

Ancamine 2337S Amicure CG-1400 Curezol 2E4MZ Amicure UR-S

Ancamine 2441 Dicyanex 200X Curezol 1B2MZ

Dicyanex 325 Curezol C17Z

Dicyanex 1200 Curezol 2MZ-Azine

Dicyanex 1400 Curezol 2PZ

Curezol 2MA-OK

Dicyandiamide Grades Used In Adhesive Applications(Listed In Order From Coarse to Fine)

Dicy Grade Particle Size Inert Flow ControlSpecifications Agent (% by wt)

Dicyanex 200X 50% <200µ 0.0

Dicyanex 325 90% <44µ; 50% <16µ 2.5

Amicure CG-325 90% <44µ; 50% <16µ 0.5

Dicyanex 1200 90% <35µ; 50% <13µ 2.5

Amicure CG-1200 90% <30µ; 50% <11µ 0.5

Amicure CG-1400 90% <10µ; 50% <7µ 0.5

Dicyanex 1400B 90% <10µ; 50% <5µ 2.5

ONE-COMPONENT ADHESIVES Within the world of adhesives, the term“one-component” (or 1K) indicates that the curing agent and resin are packagedtogether as a single unit by the formulator,and will remain stable (i.e. will not react)until the appropriate environmental condi-tions are applied.

Major market applications for one-compo-nent adhesives include automotive, aero-space, microelectronics and electrical

insulation compounds. Air Products providesan extensive line of one-component epoxycuring agents, allowing epoxy formulators tomeet a vast array of adhesive challenges withinnovative chemistries. Our product offeringsin this area include dicyandiamide, dicyandi-amide accelerators and latent hardeners.

DicyandiamideDicyandiamide (also referred to as “dicy” forshort) is considered to be the workhorse ofall 1K epoxy curing agents due to its ease ofuse, excellent performance properties, longshelf stability and low toxicity. Dicy is sup-plied in a white crystalline powder form. AirProducts offers a broad selection of gradesfrom which to choose. The grades vary pri-marily in terms of particle size, but also inthe amount of flow control agent present.Our dicy grades marketed under the tradename Amicure contain 0.5% by weight of an inert flow control agent to prohibit clump-ing, while our dicy grades marketed under

the name Dicyanex contain 2.5% by weightof the inert flow control agent. The onlyexception is Dicyanex 200X, which does not contain any flow control agent.

While dicy performance properties are inhigh demand, at times its activation temper-ature is too high for the formulator’s desiredefficiency. Therefore, dicy is often used inconjunction with an accelerator in order tolower its activation temperature while main-taining or enhancing the resulting physicalperformance of the adhesive. Acceleratorsinclude modified aliphatic amines, imidazolesand substituted ureas.

6

Page 9: CS1 Epoxy Curing Agents[1]

7

Modified Aliphatic AminesIn addition to dicy, there are several modi-fied aliphatic amines which can be used tocure epoxy resin in a 1K adhesive formula-tion. Ancamine 2014AS, Ancamine 2014FG,Ancamine 2337S and Ancamine 2441 cur-ing agents will cure epoxy resin without theuse of dicy, and all except Ancamine 2337Scuring agent can be used to accelerate dicy.These products offer excellent balances offast reactivity with good shelf stability andgood performance properties. For additionalinformation on each of our latent modifiedaliphatic amine hardeners, please refer toour 1K selector guide on page 8, as well asto their individual technical data sheets.

ImidazolesImidazoles can be used as curing agents forone-component adhesive systems. Theyalso are effective accelerators for dicy.Imidazoles are often chosen for their rapidcure characteristics beyond their activationtemperatures, as well as for their extremelyhigh Tg development. For more informationon Air Products’ complete line of imida-zoles, please consult our brochure entitled,

Imidazole Curing Agents for Epoxy Resinsor our brochure entitled, Epoxy CuringAgents and Diluents Product Guide.

Substituted UreasSubstituted ureas have been used effectivelyfor many years as dicy accelerators. Theywill not cure epoxy resins by themselves,but their synergistic performance with dicymakes them outstanding accelerator choices.These materials provide good latency andare excellent for use in adhesive applicationsrequiring B-staged forms, such as film adhe-sives. They also work well in the presence ofsolvents. Air Products offers three differenturea-based products; each less toxic and moreuser-friendly than traditional Monuron®/Diuron materials.

Starting FormulationsSeveral 1K and 2K adhesive starting formu-lations are included in the back pocket ofthis brochure for reference.

For additional information on the epoxy addi-tives used in the starting formulations, pleaseconsult their individual technical data sheets.

Product Structure Melting Point Use Level w/ Dicy Latency w/ Dicy @ 25 °C

Amicure UR 131 °C 0.5-3.0 phr 6 weeks

Amicure UR-S Fine grind 131 °C 0.5-3.0 phr 4 weeks version of Amicure UR

Amicure UR2T 182 °C 0.5-3.0 6 weeks N

Superior Technical and Sales SupportAir Products’ manufacturing, technical andcustomer-service capabilities are key ele-ments of our commitment to the adhesivesindustry. Our world-class manufacturingfacilities are located in Huntington Beachand Los Angeles, California; Cumberland,Rhode Island; and Clayton, England. TheseISO 9002-certified facilities, coupled withmultiple geographic stocking points and atrained, responsive customer-service team,enable Air Products to supply our worldwidecustomers efficiently and reliably.

In addition, Air Products offers a wealth ofadditional information and resources to assist you in your selection process ofcuring agents and modifiers for adhesiveformulations. Please see our back cover fora list of these additional resources, as wellas global contact information. Contact ustoday for assistance in answering yourepoxy adhesive concerns.

Page 10: CS1 Epoxy Curing Agents[1]

8

ONE-COMPONENT EPOXY ADHESIVE CURING AGENT SELECTOR GUIDE

Finer Particle Size

Film AdhesivesLow TemperatureReactivity

Utility in Solvent-BasedFormulations

Lowest ActivationTemperature

Suitable for Use withDiluted Resins

Rapid Green StrengthDevelopment

Best Latency

Highest Tgs

• Amicure UR-S

Used with or without dicy:

• Ancamine 2014FG

• Ancamine 2441

Used with or without dicy:

• Ancamine 2441

• Ancamine 2014AS Used with or without dicy:

• Imidazoles

• Ancamine 2441

• Modified Aliphatic Amines(Ancamine 2014AS,2014FG, 2441,2337S)

• Imidazoles

• Modified AliphaticAmines (Ancamine2014AS, 2014FG,2441)

• Imidazoles

• Substituted Ureas

DicyAccelerators

Dicyandiamide

• Workhorse 1K curing agent

• Exceptional latency

• Excellent adhesion

• Low toxicity

• Ancamine 2441

• Ancamine 2014FG

• Imidazoles (Imicure EMI-24,AMI-2)

• Ancamine 2441

• Amicure UR, UR2T, UR-S

• Imidazoles (Imicure AMI-2)

• Ancamine 2337S

Used with or without dicy:

• Ancamine 2441

• Imidazoles

Other 1K Curing

Agents

• Amicure UR

• Amicure UR2T

Page 11: CS1 Epoxy Curing Agents[1]

Two-Component Adhesive Starting FormulationGeneral Purpose Adhesive

Ingredients % By Weight

A Side DGEBA Type Liquid Resin (EEW=190) 60.0

Diethylene glycol 1.0

Aluminum (Toyal 101)(1) 37.0

Fumed Silica (Cab-O-Sil TS-720)(2) 2.0

100.0

B Side AncamideTM 2482 Curing Agent 38.0

Hycar ATBNX16 (3) 12.0

Aluminum (Toyal 101) 22.0

Talc (Microtuff 325F)(4) 27.0

Fumed Silica (Cab-O-Sil TS-720) 1.0

100.0

Mix Ratio: 1:1 By Weight and VolumeCure Schedule: 7 days at 25 °C

Performance Properties

Substrate Test Cure Result Unit of FailureMeasure Mode

HDG CR Steel Lap shear, ambient cure 7 days/25 °C 2400 psi cohesive

Lap shear, heat cure 30 min/150 °C 2800 psi cohesive

T-Peel, ambient cure 7 days/25 °C 13 pli cohesive

T-Peel, heat cure 30 min/150 °C 16 pli cohesive

Aluminum Lap shear, ambient cure 7 days/25 °C 2500 psi cohesive

Lap shear, heat cure 30 min/150 °C 2750 psi cohesive

T-Peel, ambient cure 7 days/25 °C 22 pli cohesive

T-Peel, heat cure 30 min/150 °C 20 pli cohesive

ABS Lap shear, ambient cure 7 days/25 °C 550 psi adhesive

PCB Lap shear, ambient cure 7 days/25 °C 750 psi substrate

(1) Toyal 101 is manufactured by Toyal-America (3) Hycar ATBNX16 is manufactured by BF Goodrich(2) Cab-O-Sil TS-720 is manufactured by Cabot Corporation (4) Microtuff 325F is manufactured by Barretts Minerals, Inc.

Air Products and Chemicals, Inc., 7201 Hamilton Boulevard, Allentown, PA 18195-1501Tel: (800) 345-3148, (610) 481-6799, Fax: (610) 481-4381, http://www.airproducts.com/epoxyadditives

The information contained herein is offered without charge for use by technically qualified personnel at their discretion and risk. All statements, technical information and recommendations

contained herein are based on tests and data which we believe to be reliable, but the accuracy or completeness thereof is not guaranteed and no warranty of any kind is made with respect thereto.

© Air Products and Chemicals, Inc., 2001 Printed in USA 125-0005(a)

Page 12: CS1 Epoxy Curing Agents[1]

© Air Products and Chemicals, Inc., 2001 Printed in USA 125-0005(b)

Ingredients % By Weight

A Side Standard Liquid Epoxy Resin, EEW=190 50.5

Epodil™ 748 Diluent 7.0

Talc (Microtuff 325F)(1) 40.0

Fumed Silica (Cab-O-Sil TS-720)(2) 2.5

100.0

B Side Ancamide™ 910 Curing Agent 38.0

Ancamide 2482 Curing Agent 15.0

Aluminum (Toyal 101)(3) 20.0

Talc (Microtuff 325F) 25.0

Fumed Silica (Cab-O-Sil TS-720) 2.0

100.0

Mix Ratio: 1:1 by Weight and VolumeCure Schedule: 7 days @ 25 °CThin Film Set Time: 8 hours (BK Drying Recorder, TFST3)

Performance Properties

Substrate Test Cure Max Unit of FailureStress (psi) Measure Mode

HDG CR Steel Lap shear, ambient cure 7 days/25 °C 1770 Psi cohesive

Lap shear, heat cure 30 min/120 °C 2040 Psi cohesive

Lap shear @ 120 °C, ambient cure 7 days/25 °C 25 Psi adhesive

Lap shear @ 120 °C, heat cure 30 min/120 °C 95 Psi adhesive

Lap Shear, 7 d. H2O immersion @ 41 °C 7 days/25 °C 2090 Psi adhesive

T-Peel, ambient cure 7 days/25 °C 34 Pli cohesive

T-Peel, heat cure 30 min/120 °C 32 Pli cohesive

Aluminum Lap shear, ambient cure 7 days/25 °C 1490 Psi cohesive

Lap shear, heat cure 30 min/120 °C 1640 Psi cohesive

Lap shear @ 120 °C, ambient cure 7 days/25 °C 225 Psi mixed

Lap shear @ 120 °C, heat cure 30 min/120 °C 175 Psi mixed

Lap Shear, 7 d. H2O immersion @ 41 °C 7 days/25 °C 1820 Psi cohesive

T-Peel, ambient cure 7 days/25 °C 11 Pli cohesive

T-Peel, heat cure 30 min/120 °C 14 Pli cohesive

ABS Lap shear, ambient cure 7 days/25 °C 1020 Psi adhesive

Lap shear, heat cure 30 min/120 °C 880 Psi adhesive

PCB Lap shear, ambient cure 7 days/25 °C 1460 Psi substrate

Lap shear, heat cure 30 min/120 °C 1045 Psi mixed

(1) Microtuff 325F is manufactured by Barretts Minerals, Inc. (3) Toyal 101 is manufactured by Toyal-America

Two-Component Adhesive Starting FormulationFlexible Adhesive

Air Products and Chemicals, Inc., 7201 Hamilton Boulevard, Allentown, PA 18195-1501Tel: (800) 345-3148, (610) 481-6799, Fax: (610) 481-4381, http://www.airproducts.com/epoxyadditives

The information contained herein is offered without charge for use by technically qualified personnel at their discretion and risk. All statements, technical information and recommendations

contained herein are based on tests and data which we believe to be reliable, but the accuracy or completeness thereof is not guaranteed and no warranty of any kind is made with respect thereto.

Page 13: CS1 Epoxy Curing Agents[1]

Two-Component Adhesive Starting FormulationFast, Flexible Adhesive

Ingredients % By Weight

A Side DGEBA Type Liquid Resin (EEW=190) 60.0

Talc (Microtuff 325F)(1) 38.0

Fumed Silica (Cab-O-Sil TS-720)(2) 2.0

100.0

B Side Ancamine™ 2390 Curing Agent 46.0

Ancamine 1768 Curing Agent 9.0

Aluminum (Toyal 101)(3) 16.0

Talc (Microtuff 325F) 27.0

Fumed Silica (Cab-O-Sil TS-720) 1.0

100.0

Mix Ratio: 1:1 by weightCure Schedule: 7 days@ 25 °CThin Film Set Time: 3 hours (BK Drying Recorder, TFST3)

Performance Properties

Substrate Test Cure Max Unit of FailureStress (psi) Measure Mode

HDG CR Steel Lap shear, ambient cure 7 days/25 °C 2240 Psi cohesive

Lap shear, heat cure 30 min/120 °C 2220 Psi cohesive

Lap shear @ 120 °C, ambient cure 7 days/25 °C 200 Psi mixed

Lap shear @ 120 °C, heat cure 30 min/120 °C 295 Psi cohesive

Lap shear, 7 d. H2O immersion/41 °C 7 days/25 °C 2361 Psi cohesive

T-Peel, ambient cure 7 days/25 °C 16 Pli cohesive

T-Peel, heat cure 30 min/120 °C 16 Pli cohesive

Aluminum Lap shear, ambient cure 7 days/25 °C 1990 Psi cohesive

Lap shear, heat cure 30 min/120 °C 2190 Psi cohesive

Lap shear @ 120 °C, ambient cure 7 days/25 °C 210 Psi adhesive

Lap shear @ 120 °C, heat cure 30 min/120 °C 290 Psi mixed

Lap shear, 7 d. H2O immersion/41 °C 7 days/25 °C 2210 Psi cohesive

T-Peel, ambient cure 7 days/25 °C 5 Pli cohesive

T-Peel, heat cure 30 min/120 °C 5 Pli cohesive

ABS Lap shear, ambient cure 7 days/25 °C 775 Psi adhesive

Lap shear, heat cure 30 min/120 °C 265 Psi adhesive

PCB Lap shear, ambient cure 7 days/25 °C 775 Psi adhesive

Lap shear, heat cure 30 min/120 °C 190 Psi adhesive

(1) Microtuff 325F is manufactured by Barretts Minerals, Inc. (3) Toyal 101 is manufactured by Toyal-America(2) Cab-O-Sil TS-720 is manufactured by Cabot Corporation

© Air Products and Chemicals, Inc., 2001 Printed in USA 125-0005(c)

Air Products and Chemicals, Inc., 7201 Hamilton Boulevard, Allentown, PA 18195-1501Tel: (800) 345-3148, (610) 481-6799, Fax: (610) 481-4381, http://www.airproducts.com/epoxyadditives

The information contained herein is offered without charge for use by technically qualified personnel at their discretion and risk. All statements, technical information and recommendations

contained herein are based on tests and data which we believe to be reliable, but the accuracy or completeness thereof is not guaranteed and no warranty of any kind is made with respect thereto.

Page 14: CS1 Epoxy Curing Agents[1]

Two-Component Adhesive Starting FormulationHeat-Cured Non-Toughened Adhesive

Ingredients % By Weight

A Side DGEBA Type Liquid Resin (EEW=190) 68.0

Talc (Microtuff 325F)(1) 29.5

Fumed Silica (Cab-O-Sil TS-720)(2) 2.5

100.0

B Side Ancamine™ 2264 Curing Agent 40.0

Aluminum (Toyal 101)(3) 24.0

Talc (Microtuff 325F) 34.0

Fumed Silica (Cab-O-Sil TS-720) 2.0

100.0

Mix Ratio: 2A:1B By WeightSuggested Cure Schedule: 30 minutes @ 150 °C Thin Film Set Time: 5 hours (BK Drying Recorder, TFST3)

Performance Properties

Substrate Test Cure Max Unit of FailureStress (psi) Measure Mode

Steel Lap shear, heat cure 30 min/150 °C 1513 Psi adhesive

Lap shear @ 120 °C, heat cure 30 min/150 °C 697 Psi adhesive

Lap shear, 7 d. H2O immersion/41 °C 30 min/150 °C 1453 Psi adhesive

T-Peel, heat cure 30 min/150 °C 11 Pli cohesive

Aluminum Lap shear, heat cure 30 min/150 °C 1734 Psi cohesive

Lap shear @ 120 °C, heat cure 30 min/150 °C 396 Psi cohesive

Lap shear, 7 d. H2O immersion/41 °C 30 min/150 °C 1836 Psi cohesive

T-Peel, heat cure 30 min/150 °C 4 Pli cohesive

(1) Microtuff 325F is manufactured by Barretts Minerals, Inc. (3) Toyal 101 is manufactured by Toyal-America(2) Cab-O-Sil TS-720 is manufactured by Cabot Corporation

© Air Products and Chemicals, Inc., 2001 Printed in USA 125-0005(d)

Air Products and Chemicals, Inc., 7201 Hamilton Boulevard, Allentown, PA 18195-1501Tel: (800) 345-3148, (610) 481-6799, Fax: (610) 481-4381, http://www.airproducts.com/epoxyadditives

The information contained herein is offered without charge for use by technically qualified personnel at their discretion and risk. All statements, technical information and recommendations

contained herein are based on tests and data which we believe to be reliable, but the accuracy or completeness thereof is not guaranteed and no warranty of any kind is made with respect thereto.

Page 15: CS1 Epoxy Curing Agents[1]

Ingredients % By Weight

A Side DGEBA Type Liquid Resin (EEW=190) 64.0

Talc (Microtuff 325F)(1) 34.5

Fumed Silica (Cab-O-Sil TS-720)(2) 1.5

100.0

B Side AncamineTM 2264 Curing Agent 36.0

Hycar ATBNX16(3) 11.0

Aluminum (Toyal 101)(4) 15.5

Talc (Microtuff 325F) 36.0

Fumed Silica (Cab-O-Sil TS-720) 1.5

100.0

Mix Ratio: 2A:1B By Weight Suggested Cure Schedule: 30 minutes @ 150 °C Thin Film Set Time: 5 hours (BK Drying Recorder, TFST3)

Performance Properties

Substrate Test Cure Max Unit of FailureStress (psi) Measure Mode

HDG CRS Lap shear, heat cure 30 min/150 °C 2090 Psi cohesive

Lap shear @ 120 °C, heat cure 30 min/150 °C 850 Psi cohesive

Lap shear, 7 d. H2O immersion/41 °C 30 min/150 °C 1560 Psi mixed

T-Peel, heat cure 30 min/150 °C 12 Pli cohesive

Aluminum Lap shear, heat cure 30 min/150 °C 2210 Psi cohesive

Lap shear @ 120 °C, heat cure 30 min/150 °C 730 Psi cohesive

Lap shear, 7 d. H2O immersion/41 °C 30 min/150 °C 2110 Psi cohesive

T-Peel, heat cure 30 min/150 °C 4 Pli cohesive

(1) Microtuff 325F is manufactured by Barretts Minerals, Inc. (3) Hycar ATBNX16 is manufactured by BF Goodrich(2) Cab-O-Sil TS-720 is manufactured by Cabot Corporation (4) Toyal 101 is manufactured by Toyal-America

© Air Products and Chemicals, Inc., 2001 Printed in USA 125-0005(e)

Two-Component Adhesive Starting FormulationHeat-Cured Toughened Adhesive

Air Products and Chemicals, Inc., 7201 Hamilton Boulevard, Allentown, PA 18195-1501Tel: (800) 345-3148, (610) 481-6799, Fax: (610) 481-4381, http://www.airproducts.com/epoxyadditives

The information contained herein is offered without charge for use by technically qualified personnel at their discretion and risk. All statements, technical information and recommendations

contained herein are based on tests and data which we believe to be reliable, but the accuracy or completeness thereof is not guaranteed and no warranty of any kind is made with respect thereto.

Page 16: CS1 Epoxy Curing Agents[1]

One-Component Adhesive Starting FormulationGeneral Purpose Adhesive

Ingredients Using Dicyandiamide Parts By Weight

DGEBA Type Liquid Resin (EEW=190) 100.0

Amicure® CG-1200 Curing Agent 6.0

Ancamine™ 2014AS Curing Agent 5.0

Fumed Silica (Cab-O-Sil TS-720)(1) 2.0

Ingredients Without Dicyandiamide

DGEBA Type Liquid Resin (EEW=190) 100.0

Ancamine 2014AS Curing Agent 28.0

Fumed Silica (Cab-O-Sil TS-720) 2.0

Suggested Cure Schedule: 30 minutes @ 120 °C

Performance Properties

With Dicy Without Dicy

Stroke Gel Time (min) Stroke Gel Time (min)

@ 80 °C no gel after 30 minutes @ 80 °C 22@ 100 °C no gel after 30 minutes @ 100 °C 15@ 120 °C 18.0 minutes @ 120 °C 2@ 140 °C 5.5 minutes @ 140 °C 1

Glass Transition Temperature after cure: Glass Transition Temperature after cure:

30 min @ 100 °C —- 30 min @ 80 °C 38 °C60 min @ 100 °C 40 °C 30 min @ 100 °C 75 °C30 min @ 120 °C 80 °C 30 min @ 120 °C 85 °C30 min @ 140 °C 120 °C 30 min @ 140 °C 85 °C

Lap Shear Strength Development (Electrogalvanized Steel) Lap Shear Strength Development (Electrogalvanized Steel)

60 min @ 100 °C 465 psi 30 min @ 80 °C 215 psi30 min @ 120 °C 920 psi 30 min @ 100 °C 635 psi30 min @ 140 °C 1170 psi 30 min @ 120 °C 1050 psi

30 min @ 140 °C 1500 psi

Shelf Stability Shelf Stability(Time needed to double viscosity @ 42 °C): >3 months (Time needed to double viscosity @ 42 °C): 11 weeks

(1) Cab-O-Sil TS-720 is manufactured by Cabot Corporation

© Air Products and Chemicals, Inc., 2001 Printed in USA 125-0005(f)

Air Products and Chemicals, Inc., 7201 Hamilton Boulevard, Allentown, PA 18195-1501Tel: (800) 345-3148, (610) 481-6799, Fax: (610) 481-4381, http://www.airproducts.com/epoxyadditives

The information contained herein is offered without charge for use by technically qualified personnel at their discretion and risk. All statements, technical information and recommendations

contained herein are based on tests and data which we believe to be reliable, but the accuracy or completeness thereof is not guaranteed and no warranty of any kind is made with respect thereto.

Page 17: CS1 Epoxy Curing Agents[1]

© Air Products and Chemicals, Inc., 2001 Printed in USA 125-0005(g)

One-Component Adhesive Starting FormulationFast Curing Adhesive

Ingredients Parts By Weight

DGEBA Type Liquid Resin (EEW=190) 100.0

Ancamine™ 2337S Curing Agent 40.0

Fumed Silica (Cab-O-Sil TS-720)(1) 1.0

Suggested Cure Schedule: 30 minutes @ 120 °C or 40 minutes @ 100 °C

Performance Properties

Stroke Gel Time (min)

@ 175 °F (80 °C) 2.7@ 250 °F (120 °C) <1

DSC Activation Temperature 71 °C

Pot Life >4 weeks

Glass Transition Temperature (DSC) 71 °C

Lap Shear Strength on Cold Rolled Steel (psi)Cured 30 minutes @ 80 °C 905Cured 30 minutes @ 100 °C 1,320Cured 30 minutes @ 120 °C 1,670Cured 30 minutes @ 140 °C 1,650

(1) Cab-O-Sil TS-720 is manufactured by Cabot Corporation

Air Products and Chemicals, Inc., 7201 Hamilton Boulevard, Allentown, PA 18195-1501Tel: (800) 345-3148, (610) 481-6799, Fax: (610) 481-4381, http://www.airproducts.com/epoxyadditives

The information contained herein is offered without charge for use by technically qualified personnel at their discretion and risk. All statements, technical information and recommendations

contained herein are based on tests and data which we believe to be reliable, but the accuracy or completeness thereof is not guaranteed and no warranty of any kind is made with respect thereto.

Page 18: CS1 Epoxy Curing Agents[1]

© Air Products and Chemicals, Inc., 2001 Printed in USA 125-0005(h)

One-Component Adhesive Starting FormulationHigh-Performance Adhesive

Ingredients Using Dicyandiamide Parts By Weight

DGEBA Type Liquid Resin (EEW=190) 100.0

Amicure® CG-1200 Curing Agent 6.0

Ancamine™ 2441 Curing Agent 5.0

Fumed Silica (Cab-O-Sil TS-720)(1) 1.0

Ingredients Without Dicyandiamide

DGEBA Type Liquid Resin (EEW=190) 100.0

Ancamine 2441 Curing Agent 20.0

Fumed Silica (Cab-O-Sil TS-720) 1.0

Suggested Cure Schedule: 30 minutes @ 120 °C

Performance Properties

With Dicy Without Dicy

Onset Temperature 124 °C Onset Temperature 99 °C

Glass Transition Temperature 136 °C Glass Transition Temperature 114 °C(After 30 min @ 120 °C) (After 30 min @ 120 °C)

Lap Shear Strength Development (Cold Rolled Steel) Lap Shear Strength Development (Cold Rolled Steel)

30 min @ 120 °C 570 psi 30 min @ 120 °C 610 psi30 min @ 140 °C 1150 psi 30 min @ 140 °C 1120 psi

Viscosity Increase @ 42 °C Viscosity Increase @ 42 °C after 4 weeks: 5% after 4 weeks: 11%

(1) Cab-O-Sil TS-720 is manufactured by Cabot Corporation

Air Products and Chemicals, Inc., 7201 Hamilton Boulevard, Allentown, PA 18195-1501Tel: (800) 345-3148, (610) 481-6799, Fax: (610) 481-4381, http://www.airproducts.com/epoxyadditives

The information contained herein is offered without charge for use by technically qualified personnel at their discretion and risk. All statements, technical information and recommendations

contained herein are based on tests and data which we believe to be reliable, but the accuracy or completeness thereof is not guaranteed and no warranty of any kind is made with respect thereto.

Page 19: CS1 Epoxy Curing Agents[1]

One-Component Adhesive Starting FormulationInduction Heat-Cured Adhesive

Ingredients Parts By Weight

DGEBA Type Liquid Resin (EEW=190) 87.5

Kelpoxy G292-100(1) 25.0

Amicure® CG-1200 Curing Agent 7.0

Ancamine™ 2337S Curing Agent 12.5

Ancamine 2441 Curing Agent 10.0

Aluminum (Toyal 101)(2) 40.0

Fumed Silica (Cab-O-Sil TS-720)(3) 1.0

Cure Schedule: Induction cure for 4 seconds at 190 °C or 4 seconds at 204 °C (1 second ramp; 3 second hold)

Performance Properties

Green Shear Strength at 25 °C (psi)

Cured 4 seconds @ 190 °C 590Cured 4 seconds @ 204 °C 1060

Green Shear Strength in 24 hours (psi)

(cured 4 seconds @ 190 °C)Electrogalvanized Steel 570Hot Dipped Galvanized Steel 900

Shear Strength at 150 °C (psi)

Electrogalvanized Steel 185Hot Dipped Galvanized Steel 152

(1) Kelpoxy G292-100 is manufactured by Reichhold(2) Toyal 101 is manufactured by Toyal-America(3) Cab-O-Sil TS-720 is manufactured by Cabot Corporation

© Air Products and Chemicals, Inc., 2001 Printed in USA 125-0005(i)

Air Products and Chemicals, Inc., 7201 Hamilton Boulevard, Allentown, PA 18195-1501Tel: (800) 345-3148, (610) 481-6799, Fax: (610) 481-4381, http://www.airproducts.com/epoxyadditives

The information contained herein is offered without charge for use by technically qualified personnel at their discretion and risk. All statements, technical information and recommendations

contained herein are based on tests and data which we believe to be reliable, but the accuracy or completeness thereof is not guaranteed and no warranty of any kind is made with respect thereto.

Page 20: CS1 Epoxy Curing Agents[1]

Substrates, Bonding Parameters and Test Methods

Substrates

Cold Rolled Steel Zinc Phosphate treated cold-rolled steel, 0.032" (Hot Dipped Galvanized, Electrogalvanized)

Aluminum Alloy 2024-T3, conforming to specification B 209, 63-mil thickness for lap shears, 20-mil thickness for T-peels

ABS Dow Pulse 830, 180 °F bake material, 1/8 inch

Polycarbonate General Electric Lexan LS, 250 °F bake material, 1/8"

Surface Preparation

Cold Rolled Steel Dry rag wipe

Aluminum Phosphoric acid anodizing

ABS and Polycarbonate Dry rag wipe

Lap Shear Sample Preparation and Testing

1" x 4" coupons

0.5" overlap for metals and 1.0" overlap for thermoplastic substrates

0.010" bond line thickness (including glass micro-beads; 1g/100 g of mixed adhesive formulation)

Testing according to ASTM D1002

T-Peel Sample Preparation and Testing

1" x 4" coupons

3" bond overlap

0.010" bond line thickness (including glass micro-beads; 1g/100 g of mixed adhesive formulation)

Testing according to ASTM D1876

Cure Schedules

As indicated.

Test Conditions

As indicated.

© Air Products and Chemicals, Inc., 2001 Printed in USA 125-0005(j)

Air Products and Chemicals, Inc., 7201 Hamilton Boulevard, Allentown, PA 18195-1501Tel: (800) 345-3148, (610) 481-6799, Fax: (610) 481-4381, http://www.airproducts.com/epoxyadditives

The information contained herein is offered without charge for use by technically qualified personnel at their discretion and risk. All statements, technical information and recommendations

contained herein are based on tests and data which we believe to be reliable, but the accuracy or completeness thereof is not guaranteed and no warranty of any kind is made with respect thereto.

Page 21: CS1 Epoxy Curing Agents[1]

© Air Products and Chemicals, Inc., 2001 Printed in USA 125-0005

Additional Adhesives-Related Resources Available from Air Products

On-Line Resources:

Air Products’ Epoxy Additives Website:www.airproducts.com/epoxyadditives

On-line Ancamide 910 Short Course www.airproducts.com/epoxyadditives/adhesives

Literature

Air Products’ Epoxy Curing Agents Used in Contact with Food or Potable Water

Chemical Resistance for Ambient Cure Epoxy Formulations

Epoxy Curing Agents and Diluents ProductGuide

Epoxy Curing Agents for Civil Engineering Applications

Epoxy Resin and Curing Agent Stoichiometry

High-Performance Adhesion Promoters for Automotive Plastisols

Imidazole Curing Agents for Epoxy Resins

Technical Papers

“Latent Amine (Ancamine 2014AS/FG)Addresses Needs for One-Package EpoxyAdhesives” by Dilip Shah and Peter Lucas;Adhesives Age June 1992

“Latent Amine (Ancamine 2441) AddressesNeeds for One-Package Epoxy Adhesives” byDilip Shah Adhesives Age December 1997

“Toughened One-Package Epoxy Adhesivesfor Lower-Temp, Hem-Flange Bonding” byDilip Shah; Adhesives & Sealants Industry,1995

“Versatile, Flexible Curing Agent for Two-Component Epoxy Adhesive Formulations”by Julie Baum, Dilip Shah and Gabriel Kuklis;Epoxy Resin Formulators Conference, Spring 2000.

Contact Us

To request literature referenced here or foradditional information on Air Products’ epoxy curing agents and modifiers for theadhesives industry, call our ProductInformation Center at 800-345-3148 or visitour web site at:www.airproducts.com/epoxyadditives/adhesives

North America

Air Products and Chemicals, Inc.Product Information Center—A63117201 Hamilton Blvd.Allentown, PA 18195-1501 U.S.A.Tel: 800-345-3148(Outside the U.S. or Canada, 610-481-6799)Fax: 610-481-4381

Air Products Chemicals Europe

Kanaalweg 15Box 31933502 GD UtrechtNetherlandsTel: +31 302 857 100Fax: +31 302 857 111

Air Productsc/o Anchor Italiana SpAVia Rismondo 427100 PaviaItalyTel: +39 382-539982Fax: +39 382-308462

Air Products France78 Rue Championnet75018 ParisFranceTel: +33 144-925-295Fax: +33 144-925-291

Air Products Chemicals Asia

Air Products Asia, Inc.9 Temasek Boulevard #08-02Suntec Tower 2Singapore 038989Tel: +65 332-1617Fax: +65 332-1601

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