Copyright © 2006 Toshiba Corporation. All rights reserved.

Best business power to succeed on the move

Toshiba brings you the best interpretation of the Intel® Centrino® Duo Mobile Technology promise.

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Mobile computer market is experiencing double-digit growth

• End-user computing demands and usage are expanding • Outstanding opportunity to grow sales • Mobile market growth is 3x the rate of desktops

Intel supports thisgrowth by launching‘Napa’, the nextgeneration mobile platform

Source: Gartner, May 2004

0

10

20

30

40

50

60

70

80

90

2002 2003 2004 2005 2006 2007 2008

Total Mobile PC Shipments(millions)

17%Compound

Annual growth

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• Gaining the competitive edge and growing the business depend on a responsive workforce able to work togetheras a team and to respond quickly to customers.

Best business powerto succeed on the move=+

• Intel® Centrino® Duo Mobile Technology helps your business to succeed by taking mobile performance and communication to the next level.

• Toshiba notebooks offer the ideal mixof technology, performance and quality for successon the move and enhanced real-time communication.

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Increased processing power Improved connectivity

Impressive multitasking Better manageability

Best business powerto succeed on the move=+

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Intel® Centrino® Duo Mobile Technology Next generation mobile platform

Q2’2004

Intel® Pentium® M Processor

Dothan 400 MHz

Intel® PRO/Wireless

2200BG Network Connection

Intel® 855 Chipset Family

CarmelRefresh

Intel® Pentium® M Processor

Dothan 533 MHz

Intel® PRO/Wireless 2915ABG Network

Connection

Mobile Intel® 915 Express Chipset

Family

Sonoma NapaNapaNapaNapa

Q1’2005 Q1’2006

Processor

Chipset

Wireless

Intel® Core™ Duo Processor

667 MHz Yonah

Mobile Intel® 945 Express Chipset

FamilyCalistoga

Intel® PRO/Wireless 3945ABG Network

ConnectionGolan

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Platform Sonoma Napa

CPUDothan

Single Core Yonah

Dual Core

FSB 533 MHz 667 MHz

Wireless

CLX2 ABGMiniPCI

form factor

Golan ABG MiniCard

form factor

Memory.DDR2

400/533 MHz DDR2

533/667 MHz

ChipsetAlviso &ICH6-M

Calistoga &ICH7-M

ODD PATA SATA

EthernetIntegrated 10/100 based on PC1e

Integrated 10/100/1G

Based on PCIe

AudioIntel® High

Definition AudioIntel® High

Definition Audio

• Increased Performance

–Dual Core processor with 667MHz FSB

–Generation 3.5 Intel® Integrated Graphics

–DDR2/667 Dual Channel Memory

• Enhanced Wireless Communication

–Latest IEEE 802.11 Standards

• Form Factor

–Reduced Calistoga package size

–Golan MiniCard Form Factor

• Improved Battery Life

–Targeting 5 Hour Battery Life*

Significant platform enhancements extending mobility value proposition

Intel® Centrino® Duo Mobile Technology Improvement versus previous version

* Battery life may vary depending on applications, power management settings and features utilized.

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CRT

LPCSIO/EC

Azalia /AC 97

8 ports

Discrete

Gfx

TPM 1.2LPC

GolanWLAN

DDRII SO-DIMMLVDS

Flat Panel

ExpressCard*ExpressCard*

docking

ICH7MPATA

Calistoga

x2

x1

x1

x1

x1

2 Ports

1 Port

PCIE x16

TV

GbE

SPI Flash

FSB 667MHz

DDR II 667MHz

DMI x4

6 PCIE Ports

Graphics Memory & IO Controller– Main Memory:

• 4 & 2 GB max memory: 256 MB, 512 MB, 1 GB, 2GB modules

• DDR2 400/533/667 MHz, 1-2 Channels• 1 SO-DIMM per channel

– Int. Graphics: Gen 3.5 Core• 1.05V: 133, 166, 250 MHz• 1.50V: 400 MHz• Intermediate Z in Classic Mode• VLD/iDCT, 4X HWMC

– Key Media features• TV-Out & LVDS, SDVO w/ lane reversal• D-connector support• Video Capture via x1 PCI Express* input

– Ext. port PCI Express x16 (PEG)– x2, x4 DMI support with lane reversal– I/O Support: ICH7M

• 6 PCI Express* ports, 8 USB 2.0 ports• 2 SATA , 1 PATA • PCI, LPC, SPI• Azalia & AC ’97• Intel® Matrix Storage Manager 5.5

for SATA HDD/ODD

Target Platforms– Transportable– Full Size– Thin & Light– Mini-Note & Sub-Note

Communication Interfaces

– Golan WLAN with mini-card form factor

– Tekoa Gbit Ethernet with Intel® Active Management Technology

Processor– Yonah Dual Core,– Yonah Single Core– FSB 533/667 MHz

Intel® Centrino® Duo Mobile Technology Overview of Platform Feature

Yonah

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Intel® Centrino® Duo Mobile Technology

Intel® Core™Duo Processor

Intel® 945PM/GM/GMS Chipset

Intel® PRO/Wireless3945ABG

Revolutionary PerformancesDual core changes the experience – more responsive; true multitaskingIntel® Digital Media Boost>1.7X Floating Point >1.8X Integer>200 Enabled Applications

Increased Battery LifeIntel® Dynamic Power Coordination

Display Power Savings Technology 2Extended Battery Life Techniques

5+ Hours of Battery Life*>1/2 W Platform Power Savings

Enhanced Deeper Sleep

Form Factor ImprovementsWLAN in Mini Card form factorSmall Form Factor ChipsetsLV/ULV ProcessorsMore capability in T&L FF~50% reduction in WLAN FF1.1” & Thinner Notebooks

More intelligent WirelessLeading QoS & APIs to improve VoiP

Automatic Selection of Optimum APValidation of Select WWAN Vendors

Increased Range / ConnectivitySimplified & More Powerful SW

Optimizations for Cisco* Networks

The whole is greater than the sum of the parts

Intel® Centrino® Duo Mobile TechnologyAdvancing the 4 vectors of mobility

* Battery life may vary depending on applications, power management settings and features utilized.

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Intel® Centrino® Duo Mobile TechnologyChipset roadmap

Per

form

ance

Val

ue

Mai

nst

ream

Q4’05 Q1’06 Q2’06 H2’06

Integrated Gfx Only Discrete Gfx OnlyIntegrated + Discrete Gfx Small Form Factor

915PM533/400MHz FSB

Dual Channel DDR2-533/400Single Channel DDR2-400Single Channel DDR333

PCI Express x1637.5mm x 40mm / FCBGA

915GMS400MHz FSB

Single Channel DDR2-400Intel® Display Power Saving

Technology 2.027mm x 27mm / FCBGA

915GM915PM features

+ Intel® Graphics Media Accelerator 900

+ Intel® Display Power Saving Technology 2.0

945PM667/533MHz FSB

DDR2-667/533; 4GB max memPCI Express x16

37.5mm x 37.5mm / FCBGA

945GM945PM features

+ Intel® GMA 950+ Intel® Display Power Saving

Technology 2.0

855

Fam

ily

945GMZ667/533MHz FSB

DDR2-533; 2GB max memIntel® GMA 950

37.5mm x 37.5mm / FCBGA

945GMS667/533MHz FSB

Single Channel DDR2-533Intel® Display Power Saving

Technology 2.027mm x 27mm / FCBGA

910GML400MHz FSB

Dual Channel DDR2-400Single Channel DDR2-400Single Channel DDR333

37.5mm x 40mm / FCBGA

940GML533MHz FSB

DDR2-533; 2GB max memIntel® GMA 950

37.5mm x 37.5mm / FCBGA

852

2006 Corporate Stable

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Dual Channel DDR-2 667 MHz Memory

Intel® Stable Image Platform Program

Intel® 915GM & 915PM ChipsetsIntel® PRO/Wireless 2200BG & 2915ABG

DeployQualify & Launch

Qualify & Launch

Intel® Pentium®

M processor

Intel® Calistoga Graphics

Golan Minicard/ Muroc

- High quality, stable and cost effective graphics- Support for key 3D features without the added costs

or power of discrete graphics

- Delivers increased bandwidth for improved system performance without compromising power for demanding business applications and multitasking environments

Yonah Dual Core - Intel® First Mobile Dual Core processor

- Support for real-time applications- Extended manageability support

Next Generation Chipset, Generation 3.5 Integrated Graphics

Designed to execute multiple threads simultaneously by using two cores on one Die

Napa - stable image platform aligned to Napa Q1’06 Launch

- Provides standardized hardware configuration that IT departments can deploy into the enterprise for a set period of time

New / latest memory technology

- Increased performance - Support multi-threaded applications- Effective multitasking- Real productivity gains

BenefitFeature

Latest IEEE standard support (including 802.11e)

- Manage all your hardware & software computing assets- Heal systems remotely regardless of the OS or system

state- Protect your enterprise against software attacks

Out-of-Band HW & SW Inventory, Remote Reboot & System Control, Alerting, Event Log, and 3rd PartyNon-Volatile Storage

- Enables low power CPU state with audio activity resulting in power savings

- High quality audio with support for an increased number of audio streams

- Jack re-tasking enables input or output functionality as required

Intel’s latest High Definition Audio specification. Dolby exclusive licensing is available.

Tekoa GbE & Intel® ActiveManagement Technology

Azalia - Intel® High Definition Audio

Intel® Centrino® Duo Mobile TechnologySales Advantages

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• Intel’s first Dual-Core mobile optimized CPU

• 667 MHz Front Side Bus

• Built on Intel’s new 65nm technology

• Two mobile optimized execution cores in a single processor

• Parallel threads executed on separate cores with dedicated CPU resources

• Yonah Dual-Core leverages Intel® Hyper-Threading Technology (HT Technology) ecosystem

Intel® Centrino® Duo Mobile TechnologyYonah Processor Overview

BusBus

L2

cache

L2

cache

Core1

Core1

Core2

Core2

L2

cache

L2

cache

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Intel® Centrino® Duo Mobile TechnologyBenefits for B2B

“I get more done in the same about of time!” • Greater productivity thanks to dual-core processing and improved

multitasking

“My intensive application runs better!”• Improved efficiency thanks to the optimized architecture

“I can respond faster to my highly demanding business priorities”• More responsive computing thanks to faster hardware components

“I can finally do everything, work everywhere, communicate anytime without boundaries!”

• Improved mobile working thanks to enhanced wireless technologies.

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• Business can be more responsive with breakthrough dual-core processing capabilities on new notebooks

• New innovations for enhanced manageability and better security in today’s increasingly mobile business environment

• New notebooks enable improved battery life to increase mobility and productivity

• Extended connectivity options on notebooks give employees more flexibility to collaborate with clients and colleagues

Intel® Centrino® Duo Mobile TechnologyBusiness Value Proposition

computers.toshiba-europe.com