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Condit ioning of a Polymeric Substrate U.S. Patent 5,527,566. June 18, 1996 M.J. Schadt and A. Viehbeck, assignors to IBM Corp., Armonk, N. Y.

A method of conditioning a polymeric substrate for electroless plating, which comprises exposing to an oxygen contain- ing plasma and subsequently exposing in the absence of a plasma to a reducing.at- mosphere at elevated temperature of at least 120°C wherein the reducing atmo- sphere contains hydrogen to thereby reac- tivate the polymeric substrate; and further comprising activating regions of the poly- meric substrate by depositing a catalytic seed metal thereon.

Cathodic Eiectrocoat U.S. Patent 5,527,614. June 18, 1996 C.W. Carpenter et aL, assignors to BASF Corp., Southfield, Mich.

Pigment dispersants with primary amine functionality suitable for use in cathodic electrocoat compositions.

Electrodeposit ion Photoresist U.S. Patent 5,527,656. June 18, 1996 G. Imai et aL, assignors to Kansai Paint Co. Ltd., Hyogo, Japan

A positive-type electrodeposition photo- resist composition comprising 100 parts by weight of a polymer having carboxyl group(s); 5 to 150 parts by weight of a

compound having at least 2 vinyl ether groups per molecule; and 0.1 to 40 parts by weight of a compound, which generates an acid when irradiated with an actinic ray.

Aqueous Coating Composit ion U.S. Patent 5,527,840. June 18, 1996 M.J. Chutko and P.C, Martino, assignors to The Valspar Corp., Pittsburgh

An aqueous coating composition com- prising at least 50% by weight of a solvent component, which includes at least about 70% water; and at least about 30% of a film forming component, which includes a car- boxy addition polymer and an epoxy resin wherein the carboxy addition polymer and the epoxy resin are reacted in the presence of a tertiary amine.

Fiber Media Blasting Material U.S. Patent 5,529,589. June 25, 1996 W.R. Lynn et aL, assignors to Technology Trust Inc., Dover, N.H.

A solid, granulated fiber blasting media comprising a plurality of individual discrete granulated particles for use in treating a sur- face to remove undesired contaminants.

Waterborne Coating U.S. Patent 5,527,848. June 18, 1996 C.W. Carpenter and S.K Scott, assignors to BASF Corp., Southfield, Mich.

An aqueous coating composition, com- prising at least one water-compatible poly-

mer; a crosslinking agent; and an optically variable pigment treated with a slurry of solvents selected from the group consisting of water, organic solvents, and mixtures thereof, and at least one metal salt.

Electroplating Process U.S. Patent 5,528,000. June 18, 1996 G.R. Allardyce et al., assignors to Shipley Co. L,L,C., Marlborough, Mass.

A printed circuit board having metal- lized through holes providing electrical contact from one side of the board to the other, said metallized through holes having a layer of discrete particles of a conductive polymer adsorbed from a suspension of the same disposed between the circuit board base material and the metallized surface of the through holes.

Disk-Type Powder Coating Apparatus U.S. Patent 5,529,246. June 25, 1996 E. Saito and T. Murakami, assignors to Ransburg Industrial Finishing K.K., Tokyo

An electrostatic powder coating method, comprising supplying powder particles to a central portion of a disk through an annular passageway defined between a pair of rel- atively rotating tubes and extending toward the central portion of the disk.

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