cms tracker
DESCRIPTION
CMS Tracker. CMS Tracking Workshop Fermilab 8/3/04 R. Demina University of Rochester. Outline. Overview Production model and parts flow Sensors Hybrids Alignment Test beam Summary. Bat 40. Civil Engineering and Magnet. TOB. TOB. TEC. TEC. TIB. TIB. TID. TID. PD. PD. - PowerPoint PPT PresentationTRANSCRIPT
CMS Tracking Workshop, Fermilab, 8/3/04, R. Demina 1
CMS TrackerCMS Tracker
CMS Tracking Workshop
Fermilab8/3/04
R. Demina
University of Rochester
CMS Tracking Workshop, Fermilab, 8/3/04, R. Demina 2
OutlineOutline
• Overview
• Production model and parts flow
• Sensors
• Hybrids
• Alignment
• Test beam
• Summary
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Bat 40Bat 40
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Civil Engineering and MagnetCivil Engineering and Magnet
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TOBTOB
TIDTIDTIBTIB
TECTEC
PDPD
Inner TrackerInner Tracker
2-3 pixels + 10-14 strip hits
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CMS TrackerCMS Tracker
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ModulesModules
Full flex kapton circuit from CicorelFull flex kapton circuit from Cicorel
500 m Sensors fromST MicroElectronics500 m Sensors fromST MicroElectronics
CF frames assembled in PakistanCF frames assembled in Pakistan
~20 cm
~5,600 Tracker Outer Barrel (TOB) modules
constructed at FNAL & UCSB
FNAL and UCSB will have equal capabilities and capacity
CMS Tracker Organization
ROD INTEGRATION
AachenKarlsruheStrasbourgZurichWien
PETALS INTEGRATION Aachen
Brussels Karlsruhe
Louvain
Lyon Strasbourg
BrusselsWien Lyon
TEC assemblyTEC assembly
CERN
Frames:
BrusselsSensors:factories
Hybrids:Strasbourg
Pitch adapter:Brussels
Hybrid:CF carrier
TK ASSEMBLYCERN
LouvainStrasbourg
Pisa Perugia Wien
BariPerugia
Bari FirenzeTorinoPisaPadova
TIB-TID INTEGRATION
FNAL
UCSB
TOB assembly TIB-ID assemblyCERN Pisa Aachen Karlsruhe. --> Lyon
Karlsruhe
FNAL Pisa
Sensor QAC
Moduleassembly
Bonding &testing
Sub-assemblies
UCSB
FNAL
US CMS in the overall tracker organization
Integrationinto mechanics UCSB
UR
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OverviewOverview
Layers Quantity APV/mod. Pitch phi Pitch stereo Microbond Wires
SS6 TOB5,6 1,800 6 122 - 4,147,200
SS4 TOB3,4 1,450 4 183 - 2,227,200
DS - rphi TOB1,2 1,150 4 183 - 1,766,400
DS - stereo TOB1,2 1,150 4 183 183 1,766,400
5,550 9,907,200
Type
• FNAL and UCSB will have equal capabilities and capacities FNAL production line
• Gantry operational – made ~20 operational TOB modules.• 2 of 4 DAQ and 2 of 4 ARCS
UCSB Production line• Gantry operational –made 4 operational TOB modules• 1 of 3 DAQ and 2 of 5 ARCS
UCR module diagnostics and repair • 0 of 1 DAQ and 0 of 1 ARC
TOB Module Summary Table
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Module Construction -PipelineModule Construction -Pipeline35193519: hybrids delivered : hybrids delivered 19391939: modules assembled : modules assembled
16461646: modules delivered to bonding centers: modules delivered to bonding centers
14891489: bonded : bonded 14231423: Tested with ARC : Tested with ARC 13441344: are good (94%): are good (94%)
TIB: TIB: 10551055 Assembled Assembled 886886 Tested Tested 855855 are good are good (96%)(96%)
TOB: TOB: 294294 Assembled Assembled 291291 Tested Tested 253253 are good are good (87%)(87%)
TEC: TEC: 590590 Assembled Assembled 246246 Tested Tested 229229 are good are good (93%)(93%)Thin sensors : TIB+TID 1055 of 3558 Thin sensors : TIB+TID 1055 of 3558
(30%)(30%)
TEC 500 of 2512 TEC 500 of 2512 (20%)(20%)
Thick sensors : TOB 294 of 5208 Thick sensors : TOB 294 of 5208
TEC 90 of 3888TEC 90 of 3888
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Silicon SensorsSilicon Sensors
• Original plan: Inner region TIB – thin (300um) sensors – HPK Outer region TEC, TOB– thick (500um) sensors – ST
Microelectronics
• Inner region – consistently high quality, occasional drift of resistivity (resolved)
• Outer region – x7 higher current, vacuum, stress, humidity dependency, higher number of bad channels, some channels go into early breakdown and saturate APV (Microdischarge)
• July 2004 – decision to cancel the production order with ST (after a year of deliberations)
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Hybrid Production OverviewHybrid Production Overview
• This plot still includes the rejected batches
• The gap between ‘bonded’ and ‘shipped’ are the hybrids bonded in the US
• The gap between ‘shipped’ and ‘assembled’ are the hybrids in the processing pipeline and the assembled hybrids from rejected batches that were not shipped.
1450/month ( 8.5% 1450/month ( 8.5% /month)/month)
Need ~ Need ~ 1700017000
35%35%
Bonded : 700/month Bonded : 700/month
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New hybrid problemNew hybrid problem
• On April 19th it was reported that two TOB modules had an anomalous behavior of the pedestals after several ( 10-20 ) minutes of tests. It was quickly traced back to an open in the via to a calibration pad of the APV. This open escapes the FIT test ( < 1 min) but should not escape the QC at Cicorel. The via opened AFTER the hybrid left Cicorel.
• The Via affected is a long via: i.e. from layer 1 to layer 4
• A new test was designed to identify this fault in a short ( 10”) amount of time and many hybrids were tested with this method.
• We had a number of cases with multiple faults in the same hybrid
• Cicorel was alerted and cuts have been made on bad hybrids
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A NORMAL AND “GOOD” VIA
The circuit is made with 2 plates of kapton (K) with 18 microns layers of copper on each side (CK). These 2 plates areglued together (G). The via is drilled using a laser beam, which is focused and defocused when it goes through the kapton, copperor glue. And after this drilling about 15 microns of copper is deposited (CS), and a thin layer of Nickel (Ni) – seethe different color – is also chemically deposited. What is observed is an “overetching” of the glue layer due to a differentbehaviour under the laser beam and (to a lesser extend) at the plasma cleaning stage.
CK
K
G
CS
Ni
The new Hybrid ProblemThe new Hybrid ProblemA “so A “so called” called”
good viagood via
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On this via,the overetching is so large than the copper is almost absent.Picture taken from one hybrid sendback to CICOREL (probably from CERN last week, maybe from Strasbourg)
Ceramic
Bottom layer
Isotac
A bad viaA bad via
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Actions Actions • Cicorel restarts the production with new settings. The new Cicorel restarts the production with new settings. The new hybrids should be delivered to CERN ~ middle of July.hybrids should be delivered to CERN ~ middle of July.
• Implement more strict quality control at Cicorel during hybrid Implement more strict quality control at Cicorel during hybrid productionproduction
• Evaluate the quality of the existing batches on batch to batch Evaluate the quality of the existing batches on batch to batch bases. This is a difficult task since we have no full informationbases. This is a difficult task since we have no full information
• Perform aging tests with thermal cycles on existing batches Perform aging tests with thermal cycles on existing batches to assess the long term reliability of the delivered hybridsto assess the long term reliability of the delivered hybrids
•Preliminary results show that the failure rate on the hybrids of Preliminary results show that the failure rate on the hybrids of the bad TOB batch is larger ( ~ 10) than on the other batches.the bad TOB batch is larger ( ~ 10) than on the other batches.
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Mod 1 Mod 2
Mod 3
Without 2DWith 2D
S1-
X1
S1-
X2
S1-
X3
S1-
X4
S2-
X1
S2-
X2
S2-
X3
S2-
X4
S1-
Y1
S1-
Y2
S1-
Y3
S1-
Y4
S2-
Y1
S2-
Y2
S2-
Y3
S2-
Y4
FNAL Gantry Random ErrorsFNAL Gantry Random Errors
Original 5 m spec not always met.
10 m is ok
May be improved…
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Test beam X5Test beam X5TOB set up with 6 (2DS, 3 SS4, 1 SS6)rods mounted in a TOB set up with 6 (2DS, 3 SS4, 1 SS6)rods mounted in a TOB-Like StructureTOB-Like Structure
1 full control ring – Read out with Final FED and FEC .1 full control ring – Read out with Final FED and FEC .
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Test beam at X5Test beam at X5FED9U works Zero suppression works
Internal pedestal + common mode noise subtraction
Zero suppression being studied – first results encouraging
Read 512 strips/module Read 512 strips/module Clusters done offlineClusters done offline
Cluster are done in the FED Cluster are done in the FED and read only clustersand read only clusters
S/N=36
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SummarySummary
• CMS tracker- all silicon system : 2-3 pixels + 10-14 strip hits
• Production distributed over Europe and US
• Silicon sensors – July 2004 - place full production order with HPK Still working out the legalities with ST
• Potentially dangerous problem with Hybrids – “bubble” via Working with company to improve QA
• Gantry alignment <10 um
• Test beam performance S/N=36
• 2004-2005 – critical year
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