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Innovations Enabling Semiconductor Roadmap Chee Wee Liu (劉致為)
http://www.nanosioe.ee.ntu.edu.tw
High mobility/High K/ 3D x3DGDP similar to Philippine (1.2x) if semi dies
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2017 年全球半導體廠商營收前十大排名
2017 Rank
2016 Rank Vendor 2017 Revenue
2017 Market Share (%) 2016 Revenue
2016-2017 Growth (%)
1 2SamsungElectronics
61,215 14.6 40,104 52.6
2 1 Intel 57,712 13.8 54,091 6.7
3 4 SK Hynix 26,309 6.3 14,700 79.0
4 6MicronTechnology
23,062 5.5 12,950 78.1
5 3 Qualcomm 17,063 4.1 15,415 10.7
6 5 Broadcom 15,490 3.7 13,223 17.1
7 7TexasInstruments
13,806 3.3 11,901 16.0
8 8 Toshiba 12,813 3.1 9,918 29.2
9 17 Western Digital 9,181 2.2 4,170 120.2
10 9 NXP 8,651 2.1 9,306 -7.0
Others 174,418 41.6 157,736 10.6
Total Market 419,720 100.0 343,514 22
Source: Gartner (January 2018)
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2018
Technology
trend
AIIOT
Cloud and
Virtualization
Connectivity
Ubiquitous
video
Computer
vision
Robot and
Drone
Blockchain
Cloud AIOn-Device AI
Digital current : BITCOIN
5G wireless
Broadcast
Image sensorImage processing and analysis
The top eight transformative technologies for the global technology market in 2018, IHS Marktreport Ref: https://www.businesswire.com/news/home/20180104005040/en/IHS-Markit-Identifies-Top-Technology-Trends-2018
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Strained Si starting from 90 nm node
• Enabling technologies: high mobility, high-k/metal gate, 3D transistor 6
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https://www.eetimes.com/document.asp?doc_id=1333244&print=yesTSMC’s Roadmap 5/2/2018
7nm: 2018/5 in volume production
7nm+:early 2019, using EUV lithography ramping
5nm:• To start risk production of a 5-nm node in the first half of 2019.
• To use EUV on multiple layers and 5-nm nodes.
• To start 5-nm production in 2020.
2nm and beyond:• Stacked nanowires or nanosheets
• Germanium channel with record-low contact resistance
• 2D back-end materials including molybdenum disulfide
• To enlarge copper grains to reduce resistance in interconnects.
• selective dielectric-on-dielectric deposition process to enable self-aligning of copper vias.
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Silicon Crystal Structure (Ge, SiGe, GeSn)
• Unit cell of silicon crystal is cubic.
• Each Si atom has 4 nearest neighbors.
• Si sp3
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Large Ion and small Vdd
•要馬兒好又要馬兒不吃草
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Power Saving : To Increase Mobility
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VDD(0.9V)VG
• SS ≥ 60 mV/decade for thermionic emission
• SS ≤ 60 mV/decade → NCFET , TFET
log ID
Large
SS
Small
SS
VDD(0.5
V)
Ion
SS (subthreshold slope) = inverse
of the slope in log ID vs VG plot
Delay = CV/Ion
Ioff
Reduce to Power (= CVDD2f) in transistor level small VDD
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• Intel co-founder Gorden Moore noticed in 1964
• Transistor density on a chip doubles per
generation 2x/generation
• Amazingly still correct, likely to keep until 20xx
Moore’s Law (scaled FETs)
MORE Than MOORE: Sensor/MEMS,
Analog, RF, …
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Strained Si at room temperature (90 nm)
Strained Si
M. H. Lee et al., IEDM, 69 (2003).
Mobility enhancement
Δ2
Δ4
The tensile strain lowers Δ2 valleys with low in-plane
effective mass.
More electron in high mobility Δ2 valleys
~2x enhancement
Control Si
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High mobility strained Si
SiGe relaxed buffer layer
To reduce Coulomb scattering:
1. No doping in the SiGe/Si/SiGe
heterostructure.
2. Thick SiGe barrier layer. To prevent remote
charged impurity scattering from gate stack
To reduce phonon scattering:
2DEG mobility is measured at 0.3K.
Ref: F. Schaffler et al., Semicond. Sci. Tech., 12, 1515 (1997).
2D electrons
µ~3.5x105cm2/V-s
Our approach
SiGe barrier layer
Si QW
modulation
doped layer
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SiGe relaxed buffer
SiGe barrier layer
SiGe graded buffer
Si QW
1μm200 nm
SiGe Graded Buffer Layers
Step graded buffer layer
• Dislocations confined in the compositionally graded
buffer layer.
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Quantum Hall Effect
Integral and fraction quantum Hall Effect can is observed in the 2DEG
structure.
1.6 M cm2/V-s
T. M. Lu et al., APL, 94, 182102 (2009).
Collaborate with Prof. D. C. Tsui, Princeton Univ.
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Record High 2DEG Mobility (2.4 M cm2/V s)
2.4 × 106 cm2/V s by the reduction of background
charges from 2.3 x 1014 cm-3 to 1.2 x 1014 cm-3.
0.0 5.0x1010
1.0x1011
1.5x1011
2.0x1011
2.5x1011
0.0
5.0x105
1.0x106
1.5x106
2.0x106
2.5x106
3.0x106
2D
EG
mo
bil
ity (
cm
2/V
s)
Electron density (cm-2)
20% enhancement
Background charges: 1.2 x 1014 cm-3
Background charges: 2.3 x 1014 cm-3
M. Yu. Melnikov et al., APL, 106, 092102 (2015).
Collaborate with Prof. S. V. Kravchenko, Northeastern Univ.
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• SiGe/Ge has higher mobility than Si
• GeSn mobility is not known!
MRS Bulletin Aug. 2014
21
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SiGe channel PFET using Si cap
Si
Si0.2Ge0.8
Si cap
•Si cap for high K/metal gate•3x mobility enhancement C.Y. Peng APL 2007, ROC patent 2006
0.10 0.15 0.20 0.25 0.300
100
200
300
400
500
600 Universal Moblity
Bulk Si SB PFET
-Ge SB PFET
3x
Eff
ec
tiv
e h
ole
mo
bil
ity
(c
m2/V
s)
Effective electric field (MV/cm)
22
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23Ref: Toward Quantum FinFET pp 55-79
• A substantial improvement of 70–85 % with SiGe fins is noticed at high carrier density of 1013 cm−2.
Strained Si0.75Ge0.25 channel pFET
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• k ↑, Cox, inv ↑, Ion ↑
• k ↑, thigh-k ↑, leakage ↓
Effects of High-k
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3D Transistors to Reduce SS
• Current can NOT go through at Vgs=0V.
• SS approaches 60 mV/dec (70 mV in real devices)
Source: Intel
Planar FETs
ref: C.Hu, “Modern Semicon. Devices for ICs” 2010, Pearson
3D transistors
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Slide 7-28
Variations of FinFET
Nanowire
FinFET
Short
FinFETTall FinFET
• Tall FinFET has the advantage of providing a large W and therefore large Ion while occupying a small footprint.
• Short FinFET has the advantage of less challenging lithography and etching.
• Nanowire FinFET gives the gate even more control over the silicon wireby surrounding it.
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• S/D: -high doping-low parasitic resistance Optimization for in-situ doped GeSn S/D and
PtGeSn/PtGe formation to decrease parasitic resistance are achieved.
• Epi-strain engineering: fully compressive strain for stacked GeSn channels-defect and dislocation: defect confinement at Ge/SOI interface-inter-channel uniformity: sacrificial layers design • Channel release
-etching selectivity: H2O2 etching -Inter-channel uniformity & line edge roughness: sacrificial layers etching with ultrasonic assist technique-effective mass & strain after channel release:biaxial to uniaxial strain & microbridge effect
• Low thermal budget gate stacks-low Dit of IL, high-k material, and low dispersion: TiN/ZrO2/Al2O3+RTO with 400oC thermal budget
Beyond FinFET: stacked GAA
29
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Process flow CVD epitaxy on 200mm SOI Fin formation by E-beam patterning
and anisotropic etching (pure Cl2 or HBr )
Channel release (H2O2(wet)) along <110>
Gate dielectric and in-situ electrode formation (ALD @ 250oC)Al2O3+RTO 400oC +ZrO2 + in-situ TiN
Gate stack annealing (FGA 400oC 10min)
Gate metal pad (TiN), S/D contact formation by sputtering (Pt), and PMA at 400oC
30
Device fabrication
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Stacked 3 channels GeSn JL pGAAFETs with optimum S/D
• Parasitic resistance is reduced by optimum S/D. Ion=1975mA/mm at VOV=VDS=-1V and Ion=554mA/mm at VOV=VDS=-0.5V with 3 channels.
-1.0 -0.5 0.00
200
400
600
800
1000
1200
1400
1600
1800
2000
2200
at VOV=VDS
=-1V
I D(m
A/m
m)
Ion
=1975 mA/ mm
VDS(V)
VOV = 0~-1V
step=-0.25 V
-2 -1 0 110
-4
10-3
10-2
10-1
100
101
102
103
104
105
Ion/Ioff~5.0x103
3 channels
LCH
=60nm
JL GeSn
I D(m
A/m
m)
VDS
= -0.5V
VDS
= -0.05V
Ion/Ioff~7.1x104
VGS
(V)
SS=108mV/dec
50nm 0 50 100 150 200 2500
200
400
600
800
1000
1200
1400
1600
1800
2000
2200optimum etching 3 wires [Sn]=7% 133 21
~3.3X
optimum etching 2 wires 133 21
IM 1 channel
[Sn]=6%non optimum etching
2 wires, [Sn]=6%
JL 1 channel
I on p
er
ch
an
ne
l w
idth
(mA
/mm
)
LCH
(nm)
optimum etching 2 wires 133 21non optimum S/D [Sn]=10%
Vov=Vds=-1V -2 -1 0 1
10-4
10-3
10-2
10-1
100
101
102
103
104
105
Ion/Ioff~5.0x103
3 channels
LCH
=60nm
JL GeSn
I D(m
A/m
m)
VDS
= -0.5V
VDS
= -0.05V
Ion/Ioff~7.1x104
VGS
(V)
SS=108mV/dec
-3 -2 -1 0 1 2
1E-14
1E-13
1E-12
1E-11
1E-10
1E-9
1E-8
1E-7
1E-6
1E-5
B
A
B
D
-3 -2 -1 0 1 2
1E-14
1E-13
1E-12
1E-11
1E-10
1E-9
1E-8
1E-7
1E-6
1E-5
B
A
B
D
-2 -1 0 110
-4
10-3
10-2
10-1
100
101
102
103
104
105
Ion/Ioff~5.0x103
3 channels
LCH
=60nm
JL GeSn
I D(m
A/m
m)
VDS
= -0.5V
VDS
= -0.05V
Ion/Ioff~7.1x104
VGS
(V)
SS=108mV/dec
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Source: Applied Materials p.32
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3 D NAND Flash
p.33Source: Western Digital, DevelopEX 2017
SGD: select gate at the drain end
SGS: select gate at the source end
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Why 3-D IC
p.34
• P = NI/O↑C↓ f↓VDD2
Less power consumption
• Hetero-integration
More than Moore
Cost effective
• NI/O ↑ + Vertical Interconnect
Higher bandwidth
Size reduction
Lower RC delay
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Hybrid Memory Cube
p.35Ref:2017 VLSI SC
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High Bandwidth Memory
p.36
Source: SK Hynix
•HBM 2.5D, memory dies
packaged TOGETHER with
processor and connected
through silicon interposer.
• Stacked DRAM dies,
connected by TSVs
• Size reduction vs GDDR5
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High Density Memory System with HBM on Si Interposer
p.37Ref:2017 VLSI SC
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Hetero-integration
p.38
Ref:2014 IEDM SC
• 3D-IC is the promising technology for
heterogeneous integration such as RF,
photonics, memories, and logics
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DRAM on Application Processor
p.39
Source: TSMC
• Vertical interconnects in
molding compound (TIV)
• Stacked DRAM dies on
application processor (AP)
• No TSV, no additional substrate
Low cost
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Emerging memory (source: IEEE Solid
State circuit Mag. Col.8 no.43, 2016))
40
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Phase change memory (PCM)
• Large change in resistance > 100X
• But high programming current (~0.1 mA)
IEDM Tutorial, 2017
Kolobov et al., Nature Materials, 2004
Lee et al., Nature Nano, 2007
Chen and Pop, TED, 2009
Phase change induced by Joule heat
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Resistive RAM (RRAM)
• Metal-insulator-metal (MIM) geometry, “I” = e.g. HfO2
• The conducting filament is formed by oxygen vacancies or metal precipitates
Samsung 8 Gb PCM 20 nm w/
integrated diode (IEDM, 2011)
H.-S.P. Wong et al., Proc. IEEE 100, 1951 (2012)
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Spin-transfer torque MRAM (STT-MRAM)
• Magnetic tunnel junctions (MTJ): Two ferromagnetic layers (CoFeB) sandwich a tunnel barrier (MgO).
• The spin polarized current can switch the magnetization of free layers by spin-transfer torque.
FL
MgO
Bit line (BL)
Word line
(WL)
Source line (SL)
MgO
Pinned
layer
Parallel state (P) Anti-parallel state (AP)
MgO
Free layer
Select transistor
Tunnel magnetoresistance (TMR)
= (RAP-RP)/RP x100% = 100%~200%
Magnetization
Perpendicular magnetic anisotropy
(PMA)
PL
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SRAM
• SRAM bit cell area scaling is enabled by
Innovations in process technology
Design solutions of read and write assist techniques
IEDM Short course, 2017
J. Chang et al., VLSI Symp. T2-2, 2017