camera system technical specification - … system tech spec.pdf · description the camera system...
TRANSCRIPT
Description
The camera system fitted to DEK printing machines consist of custom assemblies of optics,
advanced lighting and CMOS sensor technology.
Function
The camera system provides fiducial finding for substrate and mask alignment. Advanced and
Basic 2Di inspection, and HawkEye 750 and 1700 verification.
Capability
TECHNICAL SPECIFICATIONCAMERA SYSTEM
. . . know the difference
TECHNICAL SPECIFICATIONCAMERA SYSTEM
Page 1 Issue 3 Feb 09
Camera Types
Five camera variants are available (depending upon machine configuration):
The DEK Gold and HawkEye 1700 camera systems provide the largest field of view.
For 2D inspection the inspection window provided is three times larger than the inspection
windows provided with the Green and Graphite cameras. This speeds up 2D inspection times.
The Graphite camera is DEK’s entry-level system, it retains the same field of view as the Green
camera but has reduced software lighting control; two channel control as opposed to the four
channel control of the other cameras in the range.
Each of the DEK camera systems use special optical designs to maximize their capability.
All systems capture the board and stencil images simultaneously in order to minimize any relative
movement between the two targets. All assemblies also benefit from Telecentric lens technology
and custom LED lighting to permit reliable and accurate capture of images across a wide spectrum
of materials and target finishes.
HawkEye 1700;
HawkEye 750; Gold; Green and Graphite.
Part No. 191539
Fiducial finding is (minimum 0.1mm [circles and square fiducials]) and from 0.5mm up to 3mm
fiducials - all other fiducial types; anywhere on the substrate up to 620mm x 508mm.
2Di inspection is capable of reporting Smear, Blockage, Paste on Pad, Bridging, Alignment
and Volume, depending on the inspection type.
HawkEye 750 and 1700 give verification of Paste on Pad.
Lighting
DEK's camera systems have revised lighting geometries which provide a hemisphere of light fromfour channels - two stencil and two board (direct/vertical and indirect/oblique illumination.)This gives much improved diffused lighting through an outer ring of diffused LED’d andinternal direct lighting. This greatly reduces the unwanted shadowing, caused by the ‘HASL’ effect.This was developed for a robust fiducial finding and inspection capable system.
Therefore for high accuracy and reliable image processing, especially in applications with difficultpad finishes as described previously DEK has incorporated a flat lighting design within the cameraassembly. This is achieved by utilizing two light sources:
.
.
Direct Lighting/Vertical
Indirect/Oblique Lighting
2 channel control (Graphite camera) controls both direct and indirect light sources together
4 channel control (all other cameras) provides independant control of each light source
Page 2 Part No. 191539
TECHNICAL SPECIFICATIONCAMERA SYSTEM
Direct Lighting
A bank of LED's shining through a diffuser to produce a very uniform light source achievesdirect lighting. In addition to this the light is passed through a cube beam splitter, which increasesthe illumination and the range of angles reaching the board.
Indirect Lighting / Oblique Lighting
Indirect / Oblique lighting is used in addition to direct lighting to create uniform illumination,eliminating hot spots of light.
An array of LED's sited in a ring around the lens aperture,.
produces a very balanced illuminationwhich is radiated in all directions onto the board
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Page 3
Fiducials
Camera Related Software Options
DEK's range of automatic mass imaging products uses the vision system to capture and processalignment marks or fiducials.
DEK's range of camera related software suites include; 2D inspection and HawkEye 750/1700deposit verification applications
For further information on fiducials visit www.dek.com and navigate to the following:http://www.dek.com/csgweb/techinfo.nsf/csg/CEDFD02CA019CBE6802572E50030FE77/$file/Fiducial_Limits&Best_Practice.pdf
For further information on DEK’s software visit www.dek.com and navigate to the following
A Technical Guide to 2 Dimensional Inspection p/n 178403andHawkEye - a guide to deposit verification p/n 195152
\\Support\Manuals\Technical Publications\Option Manuals\
Part No. 191539
TECHNICAL SPECIFICATIONCAMERA SYSTEM
750/1700
Issue 3 Feb 09
TECHNICAL SPECIFICATIONCAMERA SYSTEM
Page 4 Part No. 191539
GraphiteIEEE1394
CameraType
HawkEye 2D Inspection
Basic Advanced
Capability
11.3 x 8.7(split
betweenviews)
11.3 x 8.7(split
betweenviews)
11.3 x 8.7(split
betweenviews)
Software controlled2 channel
Red LED lighting
Software controlled4 channel
Red LED lighting
Software controlledmulti channel
Red LED lighting(optimised for highspeed aquisition)
Software controlledmulti channel
Red LED lighting(optimised for highspeed aquisition)
Software controlled4 channel
Red LED lighting
2
2
11.3 x 8.7(per view)
11.3 x 8.7(per view)
CameraTechnology
2 x CMOSDigital
detectors withIEEE1394a
interface
2 x CMOSDigital
detectors withIEEE1394a
interface
2 x CMOSDigital
detectors withIEEE1394a
interface
2 x CMOSDigital
detectors withIEEE1394a
interface
2 x CMOSDigital
detectors withIEEE1394a
interface
Field of ViewFOV
26mm2
26mm2
75mm
26mm2
75mm
InspectionWindow
752 x 582mm(split between
views in ‘X’direction)
752 x 582mm(split between
views in ‘X’direction)
752 x 582mm(split between
views in ‘X’direction)
752 x 582mm(per view)
752 x 582mm(per view)
Resolution
Nominal15 microns(per pixel)
Nominal15 microns(per pixel)
Nominal15 microns(per pixel)
Nominal15 microns(per pixel)
Nominal15 microns(per pixel)
Pixel Size
Individual Opticalpaths to dedicatedCMOS detector for
looking upand down
Individual Opticalpaths to dedicatedCMOS detector for
looking upand down
Individual Opticalpaths to dedicatedCMOS detector for
looking upand down
Individual Opticalpaths to dedicatedCMOS detector for
looking upand down
Individual Opticalpaths to dedicatedCMOS detector for
looking upand down
OpticalConfiguration
Lighting
GreenIEEE1394
GoldIEEE1394
HawkEye750IEEE1394
HawkEye1700IEEE1394
750 1700
Issue 3 Feb 09