JAPAPAP Nhttp://web.apollon.nta.co.jp/radtechasia2022/

TSUKUBA

Date: August23[Tue.] -26 [Fri.], 2022Venue: Tsukuba International Congress CenterOrganized by RadTech Asia Organization / RadTech Japan

Date: August23[Tue.] -26 [Fri.], 2022Venue: Tsukuba International Congress CenterOrganized by RadTech Asia Organization / RadTech Japan

Changing the world withRadiation Technologies

The 16th International Conference & Expo on UV/EB Curing in Asia

Call for Papers

Event information

Conference name: RadTech Asia 2022 (The 16th International Conference & Expo on UV/EB Curing in Asia)Date: From Tuesday, August 23 to Friday, August 26, 2022Venue: Tsukuba International Congress CenterOrganizer: RadTech Asia 2022 Organizing CommitteeCo-organizer: RadTech Asia OrganizationAssistance: RadTech Japan

Sponsorship : Japan Printing ink Makers Association The Kinki Chemical Society, Japan Japan Thermosetting Plastics Industry Association Radiation Application Development Association The Society of Polymer Science, Japan Japan Society of Colour Material The Japanese Society of Printing Science and

Technology The Chemical Society of Japan The Adhesion Society of Japan Japan Coating Technology Association

Japan Paint Manufacturers Association Japanese Society of Radiation Chemistry The Japanese Photochemistry Association The Surface Finishing Society of Japan The Technical Association of Photopolymers The Japanese Research Association for Organic

Electronics Materials The Society of Synthetic Organic Chemistry,

Japan The Society for Antibacterial and Antifungal

Agents, Japan

ORGANIZING COMMITTEES

Chairman Masakazu Washio

Waseda UniversityHonorary Chairmen

Kunihiro IchimuraEmeritus Professor, Tokyo Institute of Technology

Masahiro TsunookaEmeritus Professor, Osaka Prefecture University

Masamitsu ShiraiEmeritus Professor, Osaka Prefecture University

Mitsuru UedaEmeritus Professor, Tokyo Institute of Technology

Tokuji MiyashitaEmeritus Professor, Tohoku University

Co-chairmenKimihiro Matsukawa

Kyoto Institute of TechnologyKoji Arimitsu

Tokyo University of ScienceMasayuki Andou

Osaka Organic Chemical Industry Ltd.Eiichi Okazaki

Toagosei Co., Ltd.Jun Nie

RadTech China, ChinaIn Hyo Kim

RadTech Korea, South KoreaNik Ghazali Nik Salleh

RadTech Malaysia, Malaysia

INTERNATIONAL ADVISORY BOARDXavier Allonas

University of Haute Alsace, FranceChristopher N. Bowman

University of Colorado, USA Gray Cohen

RadTech North America, USAKurt Dietliker

SCD GmbH, GermanyAndrew David Harbourne

HCS,LLC N. America, USAIn Hyo, Kim

Radtech Korea and Shinyoung Radchem, KoreaKimihiro Matsukawa

Kyoto Institute of Technology, JapanTokuji Miyashita

Tohoku University, JapanJun Nie

Beijing University of Chemical Technology, ChinaMasamitsu Shirai

Osaka Prefecture University, JapanMasakazu Washio

Waseda University, JapanDavid Engberg

Perstorp AB, SwedenM. Hamzah b. Harun

RadTech Malaysia, Malaysia Teruo Orikasa

NFT Co., Ltd., Japan

TSUKUBA EXPRESS Rapid 45min On foot 10min

By an escalator, pedestrian deckPass and please rise.Please go straight.

On foot 8min60min

80min

100min

「TSUKUBAGO」（From Yaesu South Exit）65min

Airport liner (NATT'S) 55min

JR Joban Line (Limited Express) 45 ～ 60min

JR Joban Line (Special Rapid Service) 50-65min

Bus 25min

Bus 25min

JR＋Bus

Highway Bus

Akihabara Sta. Tsukuba Sta.

Shinagawa Sta.

Tokyo Sta. Tsuchiura Sta.

Hitachinoushiku Sta.

Ueno Sta.

Shinagawa Sta.

Tokyo Sta.

Ibaraki Airport

Tokyo Sta.

Haneda Airport

Narita Airport

Mito Sta.

Ueno Sta.Tsukuba Center

Tsukuba International Congress Ceter

Contact UsRadTech Asia 2022 SecretariatNippon Travel Agency Co., Ltd East Japan Corporate Branch2F Nihombashi-Fukawa Building, 10-11, Kodenmacho, Nihombashi, Chuo-ku, Tokyo 103-0001 JapanTEL: +81-(0)3-6892-5104 Fax: +81-(0)3-6892-1830 E-mail: radtechasia_2022@nta.co.jp

Venue・AccessVenue: Tsukuba International Congress Center 2-20-3 Takezono, Tsukuba City, Ibaraki Prefecture 305-0032

Japan TEL: +81-(0)29-861-0001 / FAX: +81-(0)29-861-1209

Access:

Check the website for Accommodation.

About RadTech Asia 2022

The last International Conference & Expo on UV/EB in Asia (RadTech Asia 2019), which was held successfully in Hangzhou, China, had planed to continue to RadTech Asia 2021 in Japan. Although RadTech Asia 2021 had unfortunately postponed by COVID-19, we will meet again in August 2022 in Japan. On behalf of Organizing Committee, It is our great honor and pleasure to announce that the 16th International Conference & Expo on UV/EB in Asia (RadTech Asia 2022), will be held on August 23-26, 2022, at Tsukuba, Japan.

This important international conference and exhibition will provide the opportunities of information exchange and cooperation for scientists, engineers, and end-users in UV/EB-related fi eld from not only Asian countries but around the world.

The UV/EB curing technologies are widely deployed to the various industrial applications such as functional coatings, ink, adhesive, photo-lithography, UV/EB curing equipment, so on. We focus on 1) Materials for mobile network technology, 2) Biomedical applications, 3) Contribution to SDGs, 4) 2D and 3D nano/micro fabrication, 5) Antibacterial and antiviral functional materials, as Conference Special sessions. And the most interesting topics are the area overviews of development and applications of UV/EB related technologies over the world. We also invite some researchers and specialists in academia and industries, who are interested in fundamental and applied aspects of UV/EB curing technologies, to RadTech Asia 2022 conference. The Expo on UV/EB held at the same time as the conference will be an important opportunity for exchanging and collecting the information.

We sincerely welcome to attend RadTech Asia 2022 and hope you enjoy the conference on "Changing the world with Radiation Technologies".

Kimihiro MatsukawaPresident of RadTech Asia

Chairman of Executive committees

Call for papers

If you would like to present research results at RadTech Asia 2022, submit an entry at the RadTech Asia 2022 website (http://web.apollon.nta.co.jp/radtechasia2022/). Papers must be written in English, and presentations can be in either English or Japanese.Simultaneous interpreting is not available for General Session presentations.Participants must register before submitting papers. Papers can be submitted only after registering.

●Important DatesAbstract (100 words) submission deadline: March 15,2022*Participants must register before submitting papers.Acceptance notifi cations: End of March 2022Paper submission deadline: May 10, 2022 (English language papers with oral presentation: 2 A4 sized pages or more. Poster presentation: 1 A4 sized page.)

Session overview

RadTech Asia 2022 is calling for Special Session presentations that contribute to innovations in new markets, supply chains, technology, etc. such as materials for mobile network technology, biomedical applications, technological contributions to SDGs, 2D and 3D nano/micro fabrication, and antibacterial and antiviral functional materials. Additionally, to share potential in various applied fi elds, we are calling for General Session presentations related to subjects such as materials created by UV/EB technology as well as related reactions, processes, and devices. Presenters of approved titles will present their work in an oral or poster presentation format.

●Special SessionsS-1. Materials for mobile network technologyS-2. Biomedical applicationsS-3. Contribution to SDGsS-4. 2D and 3D nano/micro fabricationS-5. Antibacterial and antiviral functional materials

●General SessionsG-1. Radiation and photochemistryG-2. Advanced materials and applicationG-3. Radcure equipment, testing, and measurementG-4. Functional coatingsG-5. Others (Formulations, etc)

See the website for details and submitting. ▶ http://web.apollon.nta.co.jp/radtechasia2022/

Registering Register via the website. Registration is slated to begin in November 2021.

Type（Affi liation） Early(until June 30, 2022)

Standard

Government/Academia 40,000JPY 50,000JPY

Industry 80,000JPY 90,000JPY

Speaker（Government/Academia） 20,000JPY 20,000JPY

Speaker（Industry） 40,000JPY 40,000JPY

Student 10,000JPY 10,000JPY

Group（5 people）※ 300,000JPY No setting

*The Group registration fee is the overall registration fee for a fi ve-member group belonging to one single company. Group registration is not available for groups that are not five-member groups. Additionally, Speakers do not register in Group registration, but instead must register in the Speaker category.

Invited speakersOverview

Overview for N. America : Dr. Gary Cohen (RadTech—UV+EB Technology Nonprofi t Association)Overview for Europe : Mr. David Engberg (Perstorp AB)Overview for China : Prof. Jun Nie (Beijing University of Chemical Technology)Overview for Japan : Mr.Ichiro Igarashi (TOAGOSEI Co.,Ltd.)

Keynote LectureProf. Xavier Allonas (University of Haute Alsace)Prof. Shigenori Fujikawa (Kyushu University)Prof. Christopher N. Bowman (University of Colorado)

Special SessionsS-1. Materials for mobile network technology

Prof. Tsuyohiko Fujigaya (Kyushu University)Dr. Masao Tomikawa (TORAY Industries, INC.)Dr. Akihiko Happoya (Daicel Corporation)

S-2. Biomedical applicationsDr. Mitsumasa Taguchi (National Institutes for Quantum Science and Technology)Dr. Tomoko G. Oyama (National Institutes for Quantum Science and Technology)Dr. Koichiro Uto (Research Center for Functional Materials (RCFM) National Institute for Materials Science (NIMS))

S-3. Contribution to SDGsProf. Tatsuo Kaneko (Japan Advanced Institute of Science and Technology)Dr. Haruhisa Akiyama (National Institute of Advanced Industrial Science and Technology)Prof. Jun Nie (Beijing University of Chemical Technology)

S-4. 2D and 3D nano/micro fabricationProf. Toshiyuki Oyama (Yokohama National University)Prof. Yohei Kobayashi (THE UNIVERSITY OF TOKYO)Prof. Timothy Long (Arizona State University)Prof. Easan Sivaniah (Kyoto University)

S-5. Antibacterial and antiviral functional materialsDr. Hideki Hirayama (Institute of Physical and Chemical Research)Dr. Takeo Minamikawa (Tokushima University)Mr. Tarou Takei (Iwasaki Electric Co., Ltd.)

General SessionG-1. Radiation and photochemistry

Dr. Stefan van den Branden (IGM COOP B.V.)Dr. Takeo Suga (Waseda University)

G-2. Advanced materials and applicationProf. Jian Ping Gong (Hokkaido University)Prof. Masakazu Washio (Waseda University)Prof. Takahiro Seki (Nagoya University)Prof. Teruaki Hayakawa (Tokyo Institute of Technology)

G-3. Radcure equipment, testing, and measurementProf. Kentaro Taki (Kanazawa University)

G-4. Functional coatingsProf. Nobuhiro Kawatsuki (University of Hyogo)Dr. Mikio Yamahiro (JNC CORPORATION)

G-5. Others (Formulations, etc)

as of December 16, 2021（Please check the website for the latest speakers）

About RadTech Asia 2022

The last International Conference & Expo on UV/EB in Asia (RadTech Asia 2019), which was held successfully in Hangzhou, China, had planed to continue to RadTech Asia 2021 in Japan. Although RadTech Asia 2021 had unfortunately postponed by COVID-19, we will meet again in August 2022 in Japan. On behalf of Organizing Committee, It is our great honor and pleasure to announce that the 16th International Conference & Expo on UV/EB in Asia (RadTech Asia 2022), will be held on August 23-26, 2022, at Tsukuba, Japan.

This important international conference and exhibition will provide the opportunities of information exchange and cooperation for scientists, engineers, and end-users in UV/EB-related fi eld from not only Asian countries but around the world.

The UV/EB curing technologies are widely deployed to the various industrial applications such as functional coatings, ink, adhesive, photo-lithography, UV/EB curing equipment, so on. We focus on 1) Materials for mobile network technology, 2) Biomedical applications, 3) Contribution to SDGs, 4) 2D and 3D nano/micro fabrication, 5) Antibacterial and antiviral functional materials, as Conference Special sessions. And the most interesting topics are the area overviews of development and applications of UV/EB related technologies over the world. We also invite some researchers and specialists in academia and industries, who are interested in fundamental and applied aspects of UV/EB curing technologies, to RadTech Asia 2022 conference. The Expo on UV/EB held at the same time as the conference will be an important opportunity for exchanging and collecting the information.

We sincerely welcome to attend RadTech Asia 2022 and hope you enjoy the conference on "Changing the world with Radiation Technologies".

Kimihiro MatsukawaPresident of RadTech Asia

Chairman of Executive committees

Call for papers

If you would like to present research results at RadTech Asia 2022, submit an entry at the RadTech Asia 2022 website (http://web.apollon.nta.co.jp/radtechasia2022/). Papers must be written in English, and presentations can be in either English or Japanese.Simultaneous interpreting is not available for General Session presentations.Participants must register before submitting papers. Papers can be submitted only after registering.

●Important DatesAbstract (100 words) submission deadline: March 15,2022*Participants must register before submitting papers.Acceptance notifi cations: End of March 2022Paper submission deadline: May 10, 2022 (English language papers with oral presentation: 2 A4 sized pages or more. Poster presentation: 1 A4 sized page.)

Session overview

RadTech Asia 2022 is calling for Special Session presentations that contribute to innovations in new markets, supply chains, technology, etc. such as materials for mobile network technology, biomedical applications, technological contributions to SDGs, 2D and 3D nano/micro fabrication, and antibacterial and antiviral functional materials. Additionally, to share potential in various applied fi elds, we are calling for General Session presentations related to subjects such as materials created by UV/EB technology as well as related reactions, processes, and devices. Presenters of approved titles will present their work in an oral or poster presentation format.

●Special SessionsS-1. Materials for mobile network technologyS-2. Biomedical applicationsS-3. Contribution to SDGsS-4. 2D and 3D nano/micro fabricationS-5. Antibacterial and antiviral functional materials

●General SessionsG-1. Radiation and photochemistryG-2. Advanced materials and applicationG-3. Radcure equipment, testing, and measurementG-4. Functional coatingsG-5. Others (Formulations, etc)

See the website for details and submitting. ▶ http://web.apollon.nta.co.jp/radtechasia2022/

Registering Register via the website. Registration is slated to begin in November 2021.

Type（Affi liation） Early(until June 30, 2022)

Standard

Government/Academia 40,000JPY 50,000JPY

Industry 80,000JPY 90,000JPY

Speaker（Government/Academia） 20,000JPY 20,000JPY

Speaker（Industry） 40,000JPY 40,000JPY

Student 10,000JPY 10,000JPY

Group（5 people）※ 300,000JPY No setting

*The Group registration fee is the overall registration fee for a fi ve-member group belonging to one single company. Group registration is not available for groups that are not five-member groups. Additionally, Speakers do not register in Group registration, but instead must register in the Speaker category.

Invited speakersOverview

Overview for N. America : Dr. Gary Cohen (RadTech—UV+EB Technology Nonprofi t Association)Overview for Europe : Mr. David Engberg (Perstorp AB)Overview for China : Prof. Jun Nie (Beijing University of Chemical Technology)Overview for Japan : Mr.Ichiro Igarashi (TOAGOSEI Co.,Ltd.)

Keynote LectureProf. Xavier Allonas (University of Haute Alsace)Prof. Shigenori Fujikawa (Kyushu University)Prof. Christpher N. Bowman (University of Colorado)

Special SessionsS-1. Materials for mobile network technology

Prof. Tsuyohiko Fujigaya (Kyushu University)Dr. Masao Tomikawa (TORAY Industries, INC.)Dr. Akihiko Happoya (Daicel Corporation)

S-2. Biomedical applicationsDr. Mitsumasa Taguchi (National Institutes for Quantum Science and Technology)Dr. Tomoko G. Oyama (National Institutes for Quantum Science and Technology)Dr. Koichiro Uto (Research Center for Functional Materials (RCFM) National Institute for Materials Science (NIMS))

S-3. Contribution to SDGsProf. Tatsuo Kaneko (Japan Advanced Institute of Science and Technology)Dr. Haruhisa Akiyama (National Institute of Advanced Industrial Science and Technology)Prof. Jun Nie (Beijing University of Chemical Technology)

S-4. 2D and 3D nano/micro fabricationProf. Toshiyuki Oyama (Yokohama National University)Prof. Yohei Kobayashi (Tokyo University)Prof. Timothy Long (Arizona State University)Prof. Easan Sivaniah (Kyoto University)

S-5. Antibacterial and antiviral functional materialsDr. Hideki Hirayama (Institute of Physical and Chemical Research)Dr. Takeo Minamikawa (Tokushima University)Mr. Tarou Takei (Iwasaki Electric Co., Ltd.)

General SessionG-1. Radiation and photochemistry

Dr. Stefan van den Branden (IGM COOP B.V.)Dr. Takeo Suga (Waseda University)

G-2. Advanced materials and applicationProf. Jian Ping Gong (Hokkaido University)Prof. Masakazu Washio (Waseda University)Prof. Takahiro Seki (Nagoya University)Prof. Teruaki Hayakawa (Tokyo Institute of Technology)

G-3. Radcure equipment, testing, and measurementProf. Kentaro Taki (Kanazawa University)

G-4. Functional coatingsProf. Nobuhiro Kawatsuki (University of Hyogo)Dr. Mikio Yamahiro (JNC CORPORATION)

G-5. Others (Formulations, etc)

as of December 16, 2021（Please check the website for the latest speakers）

JAPAPAP Nhttp://web.apollon.nta.co.jp/radtechasia2022/

TSUKUBA

Date: August23[Tue.] -26 [Fri.], 2022Venue: Tsukuba International Congress CenterOrganized by RadTech Asia Organization / RadTech Japan

Date: August23[Tue.] -26 [Fri.], 2022Venue: Tsukuba International Congress CenterOrganized by RadTech Asia Organization / RadTech Japan

Changing the world withRadiation Technologies

The 16th International Conference & Expo on UV/EB Curing in Asia

Call for Papers

Event information

Conference name: RadTech Asia 2022 (The 16th International Conference & Expo on UV/EB Curing in Asia)Date: From Tuesday, August 23 to Friday, August 26, 2022Venue: Tsukuba International Congress CenterOrganizer: RadTech Asia 2022 Organizing CommitteeCo-organizer: RadTech Asia OrganizationAssistance: RadTech Japan

ORGANIZING COMMITTEES

Chairman Masakazu Washio

Waseda UniversityHonorary Chairmen

Kunihiro IchimuraEmeritus Professor, Tokyo Institute of Technology

Masahiro TsunookaEmeritus Professor, Osaka Prefecture University

Masamitsu ShiraiEmeritus Professor, Osaka Prefecture University

Mitsuru UedaEmeritus Professor, Tokyo Institute of Technology

Tokuji MiyashitaEmeritus Professor, Tohoku University

Co-chairmenKimihiro Matsukawa

Kyoto Institute of TechnologyKoji Arimitsu

Tokyo University of ScienceMasayuki Andou

Osaka Organic Chemical Industry Ltd.Eiichi Okazaki

Toagosei Co., Ltd.Jun Nie

RadTech China, ChinaIn Hyo Kim

RadTech Korea, South KoreaNik Ghazali Nik Salleh

RadTech Malaysia, Malaysia

INTERNATIONAL ADVISORY BOARDXavier Allonas

University of Haute Alsace, FranceChristopher N. Bowman

University of Colorado, USA Gray Cohen

RadTech North America, USAKurt Dietliker

SCD GmbH, GermanyAndrew David Harbourne

HCS,LLC N. America, USAIn Hyo, Kim

Radtech Korea and Shinyoung Radchem, KoreaKimihiro Matsukawa

Kyoto Institute of Technology, JapanTokuji Miyashita

Tohoku University, JapanJun Nie

Beijing University of Chemical Technology, ChinaMasamitsu Shirai

Osaka Prefecture University, JapanMasakazu Washio

Waseda University, JapanDavid Engberg

Perstorp AB, SwedenM. Hamzah b. Harun

RadTech Malaysia, Malaysia Teruo Orikasa

NFT Co., Ltd., Japan

TSUKUBA EXPRESS Rapid 45min On foot 10min

By an escalator, pedestrian deckPass and please rise.Please go straight.

On foot 8min60min

80min

100min

「TSUKUBAGO」（From Yaesu South Exit）65min

Airport liner (NATT'S) 55min

JR Joban Line (Limited Express) 45 ～ 60min

JR Joban Line (Special Rapid Service) 50-65min

Bus 25min

Bus 25min

JR＋Bus

Highway Bus

Akihabara Sta. Tsukuba Sta.

Shinagawa Sta.

Tokyo Sta. Tsuchiura Sta.

Hitachinoushiku Sta.

Ueno Sta.

Shinagawa Sta.

Tokyo Sta.

Ibaraki Airport

Tokyo Sta.

Haneda Airport

Narita Airport

Mito Sta.

Ueno Sta.

Tsukuba Center

Tsukuba International Congress Ceter

Contact UsRadTech Asia 2022 SecretariatNippon Travel Agency Co., Ltd East Japan Corporate Branch2F Nihombashi-Fukawa Building, 10-11, Kodenmacho, Nihombashi, Chuo-ku, Tokyo 103-0001 JapanTEL: +81-(0)3-6892-5104 / Fax: +81-(0)3-6892-1830E-mail: radtechasia_2022@nta.co.jp

Venue・AccessVenue: Tsukuba International Congress Center 2-20-3 Takezono, Tsukuba City, Ibaraki Prefecture 305-0032

Japan TEL: +81-(0)29-861-0001 / FAX: +81-(0)29-861-1209Accommodation:Check the website

Access: