bluetooth 2001: enabling the star trek generation

EUS/KM 01/16.01 Kjell Westerlund COMMUNICATION COMPONENTS AND MODULES

Bluetooth 2001:

Enabling the Star Trek Generation

Kjell Westerlund

February 15, 2001


AGENDA

Overview Uses & Benefits Competing Technologies Target Markets & Applications Roll-out of Products & Forecast Roll-out of Silicon & Forecast Summary


What is Bluetooth? Short-distance wireless technology

–Open, global specification for voice and data

communication

–Nearly worldwide 2.4GHz ISM band

–Short-range radio (2.402-2.480GHz, 1Mhz ch.width) Some companies also considering 5GHz ISM band for future technology Frequency hop spread spectrum Physical layer and low-level communications protocol:

Circuit & packet switching Supports point-to-point & point-to-multi-point


What is Bluetooth?

A radio system (not a radio)...– Hardware description– Software framework– Interoperability requirements

…which links mobile information appliances


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Bluetooth Network Topology

Radio Designation– Connected radios can be master or slave– Radios are symmetric (same radio can be

master or slave)

Piconet– Master can connect to 7 active and 200+

parked slaves per piconet– Each piconet has maximum capacity (1

shared Mbps)Unique hopping pattern/ID per piconet

Scatternet– High capacity system

Minimal impact with up to 10 piconets within range

– Radios can share piconets!


Personal Ad-hoc Personal Ad-hoc NetworksNetworks

Cable Cable ReplacementReplacement

Landline

Data/Voice Data/Voice Access PointsAccess Points

Basic Uses of Bluetooth

And More!!


Basic Specs

30 feet (10 m) proximity (Class3), with mobility allowed–0 dBm nominal part (low-cost, low-power solution)

–Receiver sensitivity: -70dBm (many vendors >-70)

300 feet (100 meters) with amplification (Class1)–20dBm version (PC Cards, cordless phone bases, data access

points, printers)

–Receiver sensitivity: - 85dBm

1Mbps symbol rate (next generation 2 - 12Mbps?)

Connect w/standard interfaces: USB, RS-232, UART,

PCMCIA (PC Card)


Profiles overview.

Device A Device B

Serial Port Profile

Local Dev Remote Dev

Service DiscoveryApplication Profile

Terminal Gateway

Cordless TelephonyProfile

Terminal

Intercom Profile

TCS Binary

L2CAP

SDP

L2CAP

RFCOMM

L2CAP

DT Terminal LAN Acc P

LAN Access Profile

Client Server

Generic Object ExchangeProfile

Audio GW Headset

Headset Profile

DT Terminal Gateway

Dial-up NetworkingProfile

DT Terminal Gateway

Fax Profile

A-Party B-Party

Generic Access Profile(MANDATORY)

Push Client Push Server

Object Push Profile

Client Server

File Transfer Profile

IrMC Client IrMC Server

Synchronization Profile

BluetoothProtocols

BluetoothProfiles

Based onAT Commands


Bluetooth defined Profiles.

Profile dependencies

Generic Access Profile

Service DiscoveryApplication Profile

TCS-BIN-based Profiles

Cordless PhoneProfile

Intercom Profile

Serial Port Profile

Dial-up NetworkingProfile

Fax Profile

Generic Object ExchangeProfile

Headset Profile

LAN Access Profile

File TransferProfile

Object Push Profile

SynchronizationProfile


Who Started Bluetooth?

The Bluetooth Special Interest Group (SIG): 9-member

promoter Group–Ericsson, Nokia, IBM, Intel & Toshiba (Founders) 1998

–3Com, Lucent, Microsoft and Motorola 2000

Now over 2,164 members–All of the industry segments are represented: Semiconductors,

telecom, Computing & Peripherals, Consumer, Networking,

Automotive & Industrial

Many working groups with special focus automotive,

instrumentation, sensors, medical, etc.


Benefits of Bluetooth: Business

Increases value & functionality of their products

Replace multiple ports with one Bluetooth port, lowering

costs

Potential to increase air time used for mobile data

transfer by making it easier

Has the potential for creating other recurring revenue

streams via consumer access points


Benefits of Bluetooth: Consumer

Offers customers increased value, flexibility, and

functionality of everyday communication–Information exchange w/o cords

–Automatic data synchronization w/o cords

(remove items from your to-do list)–Leave cables/cords behind (can’t be lost, stolen, broken, or

forgotten)

Mobile while connected (not with IrDA)

Communicate through solid objects (not with IrDA)


Target Markets

Initially,

The road warrior

Other mobile workers

High-End Consumer

Early adopter


Target Applications

Portable & Handheld devices–Cellular/PCS phones, digital cordless phones

–Notebook PCs, HHPCs, Palm Companies

–Digital Still Cameras

Adapters, Dongles, PC Cards

Headsets–Cell phone, cordless phone, PBX


Target Applications

Desktop PCs & Peripherals–Desktops

–Printers and fax equipment

–Other PC peripherals

Voice & data access points

–Home PSTN access point

–Business LAN access point

–Home networking equipment

–Airports, shopping malls, other public locations


Target Applications

Automotive–Audio

–Communication devices: Mic and speakers for hands-free

operation

Wearable devices–Senior assisted living applications

–Penal system applications

–Monitoring of children


Target Applications

Industrial–Manufacturing plants, monitor processes

–Reduce wiring/ease installation

–Power metering, home and businesses

Medical–Hospital & other medical applications

–Cord-free monitoring/measuring

–Administration, duty rosters

Security–Computer, banking, government, purchase transactions


Roll Out of Products

The 1st Wave: Adapters/dongles, high end mobile phones,

notebook PCs, headsets, desktop PCs, access points

The 2nd Wave: mid-range mobile phones, HHPCs/Palm

companions (integrated), cordless phones, home

networking, auto, industrial

The 3rd Wave: Lower-end mobile phones & portable

computing, Internet applications, STBs

Future: Smart appliances and ???


Bluetooth-EnabledEquipment Forecast

About 1.4 Billion

Bluetooth-enabled

products

–Largest Market:

Digital mobile phones

–2nd largest:

Desktop PCs

–3rd largest: Portable

Computing Devices

–Primary Catalysts:

Mobile phones & notebooks

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0.4

0.6

0.8

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1.2

1.4

2001 2002 2003 2004 2005

B Units


Equipment Roll-Outs

WIDCOMM: Bluetooth-ConnectTM (fits Visor’s Springboard

slot) design kit–USB/serial adapter & PC Card SDKs

Acer NeWeb: Manufacturing Blue-Connect, MSRP <$100,

& USB dongle–PC adapter, other palm computing & cell phone device adapters

will follow

TDK: +20dBm version PCMCIA Type II card, USB adapter,

& CompactFlash card–Combo LAN/Bluetooth PC Card, GSM mobile phone kits, LAN

& modem access points


Equipment Roll-Outs

3Com: PC card for notebooks, $100-$139

Psion Connect: WIDCOMM PC Card & adapter

Proxim: Combo HomeRF/Bluetooth PC Card, (later Home

RF-only card)

Digianswer/Motorola: USB dongle & PC Card, auto

kit, accessory mobile phones

Axis Communications: Access points

Intel, WLPO: Access points & PC adapters


Equipment Roll-Outs

Socket Communications: CompactFlash CF+ card

Windows CE

Dell & Compaq: Agreement w/Psion

Toshiba: Tecra notebook line first $50,

Portege line later, PC Card for notebooks <$200

IBM: PC Cards (Motorola & TDK)

NEC: prototype notebook PC

TROY: Printer/PC adapters, demo/develop product,

product, consumer later


Equipment Roll-Outs

Alcatel: OneTouch 700/500 GSM phones

Ericsson: GSM mobile phones

–Tri-band: T36, R520

–Headset & Bluetooth adapter for T28, T28 World, $320 phones

–PC Card Type II

–Home Base prototype (mobile handset at home)

Nokia: handset adapter, handset


Other Roll-Outs

Nomad Networks & HP–BlueStreakTM TWA clubs & gate areas

Red-M–Wireless Internet Server

–Bluetooth environment


Challenges Silicon availability

Software availability

Must be VERY easy for the user - must be ready out of

the box with no installation

Convince mass consumers of the benefits & value to drive

demand

Branding: Create demand as with the “Intel Inside”

campaign

Version 1.0b & upcoming 1.1


Roll-out of BluetoothSolutions

Early 2001: Announcements continue

Increased focus on offering total solutions

& partnering

Late 2001: Embed Flash into baseband

Single-chip solutions

Host processing of protocol stack

2002: Some ROM

2004: Average complete solution dips <$5


Solution Challenges

Reduce costs to enable ubiquitous integration into

products

Antenna placement, Packaging

Interoperability: Unplugfests

Integration of radio and baseband

–CMOS, BiCMOS, SiGe Bipolar & SiGe

BiCMOS, SOI BiCMOS

Partitioning - host processing


Silicon Roll-Outs

Alcatel Microelectronics–CMOS single chip

Atmel/TEMIC

–Radio, Class 1 PA

–BB controller

Broadcom/Innovent

–Radio sample now, BB controller

–Single chip

Broadcom/Pivotal–Single-chip Radio & BB w/o control


Silicon Roll-Outs

Cambridge Silicon Radio–Multichip Radio & BB

–Single chip

Conexant/Philsar–2-chip Radio & BB

–Single chip

Ericsson radio & module, first to sample solution

Hitachi

–H8S (16-bit MCU) next version optimized for Bluetooth

Infineon

–Power Amps


Silicon Roll-Outs

Intel: Ambler module & software

Lucent Technologies

–Radio limited production now, full production

–BB controller

Mitel

–BB Controller

Motorola

–Radio


Silicon Roll-Outs

National–RF chip, now; Link Controller, now

–2 chip radio & BB

OKI

–Radio

Philips

–VWS2600x BB

–BGB100 & 110 TrueBlue Radio, Blueberry BB

–RF IC


Silicon Roll-Outs

SiGe Microsystems–Power Amp

Silicon Wave

–Radio, production

ST Microelectronics

–Radio

–Single chip radio & BB


Summary

Ramp up for Silicon–1Q2001 and 2Q2001

Technology challenges

–Cost, Host processing partitioning, Integration

–Interoperability

Ramp up for Bluetooth-enabled equipment

2Q2001 and 2H2001

Tremendous opportunity: Equipment, silicon, other

services

Convey benefits & value to mass consumers

bluetooth 2001: enabling the star trek generation

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