basics of multiband ofdm ultrawideband technology semiconductor development and uwb ecosystem
DESCRIPTION
IEEE CCNC January 5, 2005. Basics of MultiBand OFDM Ultrawideband Technology Semiconductor development and UWB Ecosystem. October 27 th , 2004 Roberto Aiello, CTO [email protected]. About Staccato. Headquarters in San Diego, California WUSB Products - PowerPoint PPT PresentationTRANSCRIPT
Confidential & Proprietary (NDA Only) Slide 1
Basics of MultiBand OFDM Ultrawideband Technology
Semiconductor development and UWB Ecosystem
October 27th, 2004
Roberto Aiello, CTO
IEEE CCNC January 5, 2005
Slide 2
• Headquarters in San Diego, California
• WUSB Products• Single-chip all-CMOS PHY module• Single-chip all-CMOS MAC+PHY module• Sampling single-chip, all-CMOS, standard-compliant, 480Mbps, in Q1’05.
• Veteran management and engineering team• Broadcom, Intel, Nokia, Motorola, National, PCSI, Qualcomm Silicon Wave, Texas
Instruments
• Proven technical team• Key author and contributor of the standard (MBOA, WiMedia, 1394TA, Wireless USB).• Several key single-chip CMOS radio designs thru production (Bluetooth in iPAQ,
etc. .11bag, CDMA – Nokia handsets, etc)• Key innovator of UWB technology: impulse-radio → multiband → multiband OFDM
• Blue-chip funding• A-Round (April 2003) - $7.5M by Allegis, Bay Partners, Charles River Ventures• B-Round (March 2004) - $20M by original investors, Intel, InterWest
• Key partnerships and alliances established
About StaccatoAbout Staccato
Slide 3
UWB is spectrumUWB is spectrum
• UWB is about low power transmission and non-harmful co-existence with other services
• Unlicensed use sharing licensed spectrum• Radio systems are smarter than 70 years ago
• Spectrum management based on old assumptions
• Future UWB systems will be different from systems analyzed before rulemaking
• UWB spectrum characteristics allow • high bit rate, short range (MBOA)
• low power, location awareness (IEEE 802.15.4a)
ISM: Industrial, Scientific, Medical
U-NII: Universal National Information Infrastructure
MBOA: Multiband OFDM Alliance
UWB: Ultra-wideband
Slide 4Source: Ed Thomas, FCC, 2003
Slide 5
MBOA(*) specification summaryMBOA(*) specification summary
3432MHz
3960MHz
4488MHz
5016MHz
5544MHz
6072MHz
6600MHz
7128MHz
7656MHz
8184MHz
8712MHz
9240MHz
9768MHz
Band#1
Band#2
Band#3
Band#4
Band#5
Band#6
Band#7
Band#8
Band#9
Band#10
Band#11
Band#12
Band#13
Band Group 1 Band Group 2 Band Group 3 Band Group 4
Band#14
Band Group 5
10298MHz
Mandatory Optional Optional Optional OptionalMandatory Optional Optional Optional Optional
Link Margin Ref. (0 dB). -02.7 dB -04.9 dB -06.5 dBLink Margin Ref. (0 dB). -02.7 dB -04.9 dB -06.5 dB
… …
128tones
… …
128tones
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Band Group 1Length 6 TFC
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Band Group 1Length 6 TFC
MBOA PHY Specification 1.0• Band Switching
• Within Band Set #1• 3.168 – 4.752 GHz
• Bands 1, 2 and 3• Each occupy 528 MHz
• Band Subcarriers• 128 tone OFDM• Tone width: 4.125 MHz• Tone modulation: QPSK
MBOA PHY Specification 1.0• Band Switching
• Within Band Set #1• 3.168 – 4.752 GHz
• Bands 1, 2 and 3• Each occupy 528 MHz
• Band Subcarriers• 128 tone OFDM• Tone width: 4.125 MHz• Tone modulation: QPSK
Global Solution: Flexible band plan and use of OFDM subcarriers allows for “spectrum shaping” which can be used to meet worldwide regulatory requirements
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Band Group 1Length 6 TFC
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Band Group 1Length 6 TFC
MBOA PHY Specification 1.0• Band Switching
• Within Band Set #1• 3.168 – 4.752 GHz
• Bands 1, 2 and 3• Each occupy 528 MHz
• Band Subcarriers• 128 tone OFDM• Tone width: 4.125 MHz• Tone modulation: QPSK
MBOA PHY Specification 1.0• Band Switching
• Within Band Set #1• 3.168 – 4.752 GHz
• Bands 1, 2 and 3• Each occupy 528 MHz
• Band Subcarriers• 128 tone OFDM• Tone width: 4.125 MHz• Tone modulation: QPSK
Global Solution: Flexible band plan and use of OFDM subcarriers allows for “spectrum shaping” which can be used to meet worldwide regulatory requirements
(*) www.multibandofdm.org
Slide 6
RF CMOS for UWBRF CMOS for UWB
Standard CMOS Ultrawideband Single-Chip Solutions
By Dan Meacham and Krishnamurthy Soumyanath
EE TimesMay 17, 2004
Using appropriate design techniques and optimizations an ultrawideband multiband-OFDM analog front end can be implemented in low-cost standard CMOS.
Slide 7
Industry timelineIndustry timeline
Silicon Silicon prototypesprototypes
interop
Interoperability TestingInteroperability Testing
Silicon &Silicon &RF modulesRF modules
BoardsBoards(PCI, mini-PCI, etc.)(PCI, mini-PCI, etc.)
Silicon VendorsSilicon Vendors
IC SamplesIC Samples
3Q033Q03 1Q04 1Q04 3Q-4Q04 3Q-4Q04 1Q05 1Q05 2Q05 2Q05 4Q05– 2Q06 … 4Q05– 2Q06 …
Standards & Standards & Technology Technology
CreationCreation
EcosystemEcosystemFormationFormation
Corporate R&D
TechnologyTechnologyDemonstrationDemonstration
(Intel Developers Forum)(Intel Developers Forum)
Business Groups Engaged
SpecsReqs PC CE Mobile W-USB W-1394
Multi-Vendor Multi-Vendor InteroperabilityInteroperability
IC Development
C&I Program
Components
Develo
pm
ent
Pla
tform
CommercialCommercialDeploymentDeployment
Product Development
End productsEnd products
Slide 8
Staccato CommunicationsStaccato Communications
• UWB is available spectrum
• Ideal for very high bit rate, low power, short range application
• Wireless USB standard is set• First UWB high volume application• Interoperable products to market in 2H 2005
• Staccato is first to market with single-chip• All-CMOS radio implementation• Low cost, small size, efficient power consumption• Single-chip enables volume products