asm solutions in sipapplication solutions in sip application.pdfasm smt solutions: an influential...

ASM Solutions in SiP Application

10.2017

ASM SMT Solutions: An influential part of ASM Pacif ic Technologies

10/10/2017ASM Assembly Systems Page 2

The ASM PT Group is the world‘s largest supplier of assembly and packaging equipment

ASM Materials

� Leadframes� Other Materials� Molded Interconnect Substrate (MIS)

ASM Back End Equipment

� Die & Flip-Chip Bonder� Wire Bonder� Encapsulation Equipment� Tester & Sorter� Laser Dicing� LED Equipment

ASM SMT Solutions

� SMT Line Solution� DEK Printing Solutions� SIPLACE Placement Solutions� ASM Smart Factory Tools & Services

ASM Pacific Technologies (ASM PT) today: Three succ essful business segments

founded in

1975

ASM Pacific Technologies “in a nutshell”:

present in

> 30Countries

headquartered in

Singapore

>1,100patents

>1,700R&D engineers

revenues

1.84 Bn US$In calendar year 2016

6R&D centers

10manufacturing facilities

• Panels, strips or singulated

• Micro SMT

• Balls on component side

Bluetooth Module

Intarsia RF module.

Integrated passives

& wirebondeddie

System in Package

Key capability_ blue light camera for Cu pillar


P

SIPLACE – Intelligent Height Learningfor Standard SMT Application

With Placement force control

� Machine will automatically learn component height and PCB warpage

� Continuous learning from every placement, every PCB

Component HeightLearning

PCB WarpageLearning

Dynamic 3D Terrain generated in machine

+ =


Precondition for soft and reliable component placem entProgrammable z-axis (speed and force)

Page 6 ASM Assembly Systems 10/10/2017

START VIDEO

Safety distance

Targ

et le

vel

First PCB Second PCB

Safety distance

Self earning of placement levelPlacement on upwards wrapped PCB

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Targ

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Safety distance

Targ

et le

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Self earning of placement levelPlacement on downwards wrapped PCB

Page 8 ASM Assembly Systems10/10/2017

START VIDEO


PCB Handling during ProductionPCB Oscillation self-healing

When ∆ > Allowed value, i.e. 0.2mm

� Machine will automati-cally slow down the movement of Z axis

� Or send out a warning message on the screen

� Or, if the process is critical, stop the machine

� Force feedback control� Z movement control� Speed control

∆= ?

Self-Healing Oscillation

� Optimal placement process control

� Avoid defects like, solder beads, short after reflow


SIPLACE “0” Placement Force - ‘touchless’ placementfor Special Application*

“0” Placement force

� Application for very fragile component

� Accurate process control of placement into the flux/solder etc.

Vacuum tooling to make sure PCB is flat positioned and supported

1

2

3

Height measurement for PCB leveling prior to placement

Place component with accurate Z axis height control based on PCB leveling

∆ Controlled



TX Micron_ Key specification

SIPLACE TX Micron

Machine Configuration 2 gantries, 2 heads(TX2i micron / TX2 micron)

Placement heads SpeedStar (CP20M2) Multistar (CPP)

Benchmark 78000 cph@25µm, 71000 cph@20µm, 65000 cph@15µm

Up to 48000 CPH

Accuracy 25/20 or 25/15 µm @ 3 σ

Board size Dual conveyor: 45 x 45 mm to 375 x 260 mm

Component range 0201 metric – 27 x 27 mm

Component Supply Up to 80 x 8 mm tapes, JEDEC tray

Clean Room Class 10000 / ISO 7 (standard)

Power Consumption Typical: 1,9 kW including vacuum pump

Machine Dimensions 1,00m x 2,3 m x 1,45m

TX Micron_ Accuracy measures


SIPLACE TX Micron Standard Package

• Standard accuracy 25/20 µm @ 3 σ

• High resolution glass scales for gantry system (10nm)

• Additional fiducial bar (x)

• Individual accuracy setting on component level

SIPLACE TX Micron 15 µm Package

• High accuracy 25/15 µm @ 3 σ

• High resolution glass scales for gantry system (10nm)

• Additional fiducial bar (x)

• Additional fiducial bars on vacuum tooling (y)

• Highly rigid conveyor system for substrate stabilization

• Special vacuum tooling with interchangeable vacuum plate

• Easy exchange via integration of positioning pins

• Individual accuracy setting on component level

SIPLACE TX Micron fiducial bar (x)

Vaccum tooling with fiducial bar (y)

ASM Assembly Systems 10/10/2017

Independent Operation with i-mode

� Improvement on OEE

� Dynamic editing on one head, the rest of the line are still running; works for NPI, mass production as well

Independent operation

• Teaching of - fiducial- barcode - component shape- pickup/placement position- component tray, feeder pocket- etc

SIPLACE BulkFeeder XOverview


CartridgePick up window

EDIF

Camera

Control panel� 7 segment display� Forward Button� Backward Button� Cartridge removal

SIPLACE BulkFeeder XCartridge overview


Pick up window with shutter

Refill

RFID

Container

0402 0201 01005

Container Capacity Up to 110.000 Up to 500.000 Up to 1.500.000

SIPLACE BulkFeeder XComponent analysis


Legend

Pickable components are marked green

Tiled components are marked orange

Component clusters are marked blue

Components laying too close are marked red

Always enough components for 20 pick up’s

#1 supply form for high volume applications

� Reduce Manual work

� No reels – No splicing – No waste

� Up to 90% less material logistics

� Higher pickup reliability

� Better placement quality, especially for narrow gap placement

SIPLACE BulkFeeder X


Bad Mark Recognition with SIPLACE Machine

PCB bad mark detection in the productionBad marks (or Inkspots) on PCBs are required to avoid placing expensive components on a defect board

Inkspot detection with SIPLACE machine

� Inkspot is programmed in SIPLACE Pro and assigned to each sub-panel of a board

� Inkspots are read by the PCB camera prior to placement in each machine

� Only the good panels (with good inkspot recognition) will be populated

� Time needed for inkspots reading is added to cycle time

SIPLACE Virtual Inkspot Handling – System Overview

System workflow (from Station SW 707)� External system provides Virtual Inkspot file that describes the circuits to be produced per board

identified by a barcode

� 1st SIPLACE machine scans barcode of board (scanner or camera)

� Barcode is send via OIB Interface of SIPLACE Board Gate Keeper (BGK) to external system

� External system returns inkspot data with the circuits to be produced (name of subpanels defined in SIPLACE Pro)

� Inkspot data are transferred to the next SIPLACE machine by the Whisper Down The Line option

Board ID + Inkspot Data

Board ID + Inkspot Data

SIPLACE Line Controller

BGK

ExternalSystem(MES)

InkspotData

Board ID

Product overview

Page 20ASM Assembly Systems 10/10/2017

Model Name: XXXX-601402-XXXXSide: TopSize: 260x100mmPlacements: 9450Panels: 105

Dipping Component Qty : 10

SiP Assembly Line Overview


Proposed Line Configuration:

2*NeoHorizon03iX and 3*X4iS-M

Current Line Configuration

Alternating modeResults - Dipping Process vs Flux Printing Process

Increased ~ 20% productivity


Performance

Feeder demand

Nozzle demand

SIPLACE CA


Accuracy

� Chip shooter with integrated wafer system � Supports SMT, flip chip (DCA) & die attach (COB)

on a single platform

SIPLACE Wafer System (SWS)Standard


� Handling of wafers from 4” up to 12”

� Hoop ring handling capability

� 8”/12” Wafer Expansion Unit / Stretcher

� Automatic wafer exchange

� Multi Die Capability

� Wafer magazine for up to 25 wafers

� Supports Linear Dipping Unit

� ALPS electronic wafer map

� Setup verification for SWS

New products or changed packaging (e.g. wafer, T&R) can easily be adopted.

Introduction


SIPLACE CA

� For Advanced Packaging market

� Flip Chip & Die Attach from wafers combined with SMD

� Suitable for

� High Placement Accuracy, High Volume Production.

eWLB� FC� FC+ SMD

Chip 2 Wafer� FC� DA with DAF� Cap wafer

with DAF

Embedded PCB� FC� FC + SMD� DA with DAF

SiP / Hybrid� DA with SP + SMD� FC + SMD� Multi DA with SP + SMD� Multi FC + SMD

LED� large Panel� FC (LED) + SMD

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asm solutions in sipapplication solutions in sip application.pdfasm smt solutions: an influential...

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