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Bridges for Building an ARA ModulePresentation Date: January 2015
Presented by: Eugene Chang
AP Bridge - GP Bridge
Agenda
1. Bridge IC specifications Overview – AP Bridge – GP Bridge
2. Switch ASIC 3. Configuration 4. Contactless Interface 5. Bridge IC Revisions 6. Starter Kit
3 Copyright 2015, Toshiba Corporation.
Bridge IC specifications Overview
<Applicable modules>
<Applicable modules>
HOST BUS I/F
I2S master I2C master
HSIC 1.0 HOST
GPIOs EPM
GP Bridge- T6WT2XBG
AP Bridge- T6WT1XBG
Wi-Fi is a registered trademark of Wi-Fi Alliance. / Bluetooth is a registered trademark owned by Bluetooth SIG, Inc. and any use of such marks by Toshiba Corporation is under license.
M -P
“T6WR5XBG” ARA AP Bridge
• Bridges the UniproSM network with ARA modules featuring the Application Processor or Display or Camera
• Supports CSI-2, DSI, HSIC (USB), I2C, I2S and GPIO • Based on an ARM Cortex M3 for fast handling of protocol
conversions • Main features include:
• MIPI® UniPro ver 1.6 UniPort with 2 lane bidirectional capable of 5.8Gbps/lane, -Up to 32 C-ports
• CSI-2 Interface – 2 links with each link having 4 [email protected]/lane
• DSI Interface – 2 links with each link having 4 lanes @1Gbps/lane
• HSIC Device • SPI Master • I2C Master • Audio I2S Interface • 15 GPIOs • Package;
107pin 5.0x5.0x1.0 0.4mm ball pitch BGA
5 Copyright 2015, Toshiba Corporation.
Module
Endoskeleton
4 Lane DSI for Display
Unipro BusTo Switch IC
6 Copyright 2015, Toshiba Corporation.
“T6WR6XBG” ARA GP Bridge
• A general purpose bridge that connects the UniproSM
network with ARA modules featuring application that uses HSIC, SDIO, UART, SPI, I2C, I2S
• Based on an ARM Cortex M3 for fast handling of protocol conversions
Main features include: • MIPI® UniPro ver 1.6 UniPort with
2 lane bidirectional capable of 5.8Gbps/lane -Up to 16 C-ports
• HSIC Host • SDIO Host • SPI Master • I2C Master • Audio I2S Interface • 15 GPIOs • Package;
107pin 5.0x5.0x1.0 0.4mm ball pitch BGA
7 Copyright 2015, Toshiba Corporation.
Module Endoskeleton
GP Bridge
Wi-Fi is a registered trademark of Wi-Fi Alliance. Bluetooth® word mark is a registered trademark owned by Bluetooth SIG, Inc. and any use of such mark by Toshiba Corporation is under license.
8 Copyright 2015, Toshiba Corporation.
“T6WM8BGX” ARA Switch LSI
• Unipro based switch device that resides only on the Endoskeleton and handles data transfer between UniPorts at the L3 level.
• The Switch has 14 UniPorts with each UniPort consists of 2 lane TX and 2 Lane RX M-PORT supporting 5.8Gbps/lane
• A supervisory microcontroller controls and configures the Switch LSI via I2C slave address.
• Other features include: – Data routing from every UniPort to any other UniPort – Configuration through UniPro – Traffic class 0 and 1 with routing and arbitration support for
both traffic classes
Supervisory Controller Block Diagram of Switch ASIC
Switch ASIC
Modules
Routing
* M-PHY, MIPI, UniPro are registered trademarks or service mark of MIPI Alliance, Inc.
10 Copyright 2015, Toshiba Corporation.
Configuration
– AP Bridge: AP/Camera/Display Bridge
– GP Bridge: General-Purpose Bridge
• Switch LSI (residing in Endo)
Wi-Fi is a registered trademark of Wi-Fi Alliance. / Bluetooth is a registered trademark owned by Bluetooth SIG, Inc. and any use of such marks by Toshiba Corporation is under license. / LTE is a trade mark of ETSI.
11 Copyright 2015, Toshiba Corporation.
Contactless inductive interface
Prototype Engineering Sample Commercial Sample
Endo Version Spiral-2 Spiral-3 Spiral-3
M-PHY Coupling DC (contact req’d.) DC / AC Contactless* DC / AC Contactless*
Supported mode ~ HS-G3 (~6Gbps) ~ HS-G3 / PWM1(3~9Mbps), HS-G1,G2,G3
~ HS-G3 / PWM1(3~9Mbps), HS-G1,G2,G3
• M-PHY protocol over contactless inductor
• Wide band data transmission from Mbps to Gbps over channel with limited band width
• Low power operation in low speed mode
12 Copyright 2015, Toshiba Corporation.
Bridge IC Revisions– Key Features Summary
Prototype Engineering Sample Commercial Sample
Availability Sep. 2014 (limited qty)
Feb. 2015 (limited qty) Jul. 2015
Endo Version Spiral-2 Spiral-3 Spiral-3
Part No. AP Bridge: T6WR5XBG GP Bridge: T6WR6XBG
AP Bridge: T6WT1XBG GP Bridge: T6WT2XBG
AP Bridge: TBD GP Bridge: TBD
M-PHY Coupling DC (contact req’d.)
DC / AC Contactless*
DC / AC Contactless*
Package AP Bridge: 5x5 107 BGA GP Bridge: 5x5 107 BGA
AP Bridge: 5x5 109 BGA GP Bridge: 5x5 109 BGA
AP Bridge: TBD GP Bridge: TBD
CPORTs AP Bridge: 32 GP Bridge: 16
AP Bridge: 44 GP Bridge: 16
AP Bridge: 44 GP Bridge: 16
* DC / AC Contactless set prior to shipment
13 Copyright 2015, Toshiba Corporation.
Starter Kit for ARA
• Starter Kit – A simple board with Bridge Chip and USB socket for the 1x2
module form factor – This Starter Kit enables module developers to try their idea or
solution easily.
microUSB socket
14 Copyright 2015, Toshiba Corporation.
Key Features for Starter Kit
• Module to support USB - Type A/B micro receptacle for Data • PCB to support access test points for the following signals that
connect to GP Bridge: – SDIO, UART, SPI, I2S, I2C, PWM, GPIO
Developer’s Application Board
ARA Platform w/ Starter kit ARA Platform w/ Starter kit
Existing USB dongle
15 Copyright 2015, Toshiba Corporation.
Project Ara site in Toshiba Homepage
16 Copyright 2015, Toshiba Corporation.
Contents
Bridge ICs Brochure