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SEMICONDUCTORS Copyright 2015, Toshiba Corporation. Bridges for Building an ARA Module Presentation Date: January 2015 Presented by: Eugene Chang AP Bridge - GP Bridge

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  • SEMICONDUCTORS

    Copyright 2015, Toshiba Corporation.

    Bridges for Building an ARA Module

    Presentation Date: January 2015

    Presented by: Eugene Chang

    AP Bridge - GP Bridge

  • 2Copyright 2015, Toshiba Corporation.

    Agenda

    1. Bridge IC specifications Overview– AP Bridge– GP Bridge

    2. Switch ASIC3. Configuration4. Contactless Interface5. Bridge IC Revisions6. Starter Kit

  • 3Copyright 2015, Toshiba Corporation.

    Bridge IC specifications Overview

    • Application Processor• Display• Camera• Mic/Speaker• 2nd Display/Camera• etc

    • Wifi, Bluetooth®, GPS• SIM• Modem• Memory Card• Mic/Speaker• etc

    CSI/DSI

    CSI/DSIHost Bus Interface

    I2C, I2S, GPIOs

    CSI/DSI Tx0 4LaneD-PHYCSI/DSI Rx0

    CSI/DSI Tx1 4LaneD-PHYCSI/DSI Rx1

    HOST BUS I/F

    Toshiba is developing 2 types of Bridge ICs.

    I2S masterI2C master

    GPIOs

    HSIC(HOST)SDIO(MASTER)

    UART, I2C, I2S, EPM, GPIOs

    HSIC 1.0HOST

    HSIC PHY

    SDIO v2 master

    UARTI2S masterI2C master

    GPIOsEPM

    GP Bridge- T6WT2XBG

    AP Bridge- T6WT1XBG

    Wi-Fi is a registered trademark of Wi-Fi Alliance. / Bluetooth is a registered trademark owned by Bluetooth SIG, Inc. and any use of such marks by Toshiba Corporation is under license.

    M-P

    HY

    UniP

    ro

    M-P

    ORTDual Tx, Rx

    5.8Gbps/lane

    M-P

    HY

    UniP

    ro

    M-P

    ORTDual Tx, Rx

    5.8Gbps/lane

  • 4Copyright 2015, Toshiba Corporation.

    “T6WR5XBG” ARA AP Bridge

    • Bridges the UniproSM network with ARA modules featuring the Application Processor or Display or Camera

    • Supports CSI-2, DSI, HSIC (USB), I2C, I2S and GPIO• Based on an ARM Cortex M3 for fast handling of protocol

    conversions• Main features include:

    • MIPI® UniPro ver 1.6 UniPort with 2 lane bidirectional capable of 5.8Gbps/lane, -Up to 32 C-ports

    • CSI-2 Interface – 2 links with each link having 4 [email protected]/lane

    • DSI Interface – 2 links with each link having 4 lanes @1Gbps/lane

    • HSIC Device• SPI Master• I2C Master• Audio I2S Interface• 15 GPIOs• Package;

    107pin 5.0x5.0x1.0 0.4mm ball pitch BGA

  • 5Copyright 2015, Toshiba Corporation.

    Module

    Endoskeleton

    4 Lane CSI-2 for CameraOR

    4 Lane DSI for Display

    Unipro BusTo Switch IC

    ROM

    Audio Codec

    AP Bridge

    AP Bridge showing two possible uses – Display or Camera

  • 6Copyright 2015, Toshiba Corporation.

    “T6WR6XBG” ARA GP Bridge

    • A general purpose bridge that connects the UniproSMnetwork with ARA modules featuring application that uses HSIC, SDIO, UART, SPI, I2C, I2S

    • Based on an ARM Cortex M3 for fast handling of protocol conversions

    Main features include:• MIPI® UniPro ver 1.6 UniPort with

    2 lane bidirectional capable of 5.8Gbps/lane -Up to 16 C-ports

    • HSIC Host• SDIO Host• SPI Master• I2C Master• Audio I2S Interface• 15 GPIOs• Package;

    107pin 5.0x5.0x1.0 0.4mm ball pitch BGA

  • 7Copyright 2015, Toshiba Corporation.

    ModuleEndoskeleton

    Unipro BusTo Switch IC

    ROM

    Audio Codec

    Wi-Fi / BluetoothModule

    Example of GP Bridge w/ Wi-Fi®/ Bluetooth® Module

    GP Bridge

    Wi-Fi is a registered trademark of Wi-Fi Alliance. Bluetooth® word mark is a registered trademark owned by Bluetooth SIG, Inc. and any use of such mark by Toshiba Corporation is under license.

  • 8Copyright 2015, Toshiba Corporation.

    “T6WM8BGX” ARA Switch LSI

    • Unipro based switch device that resides only on the Endoskeleton and handles data transfer between UniPorts at the L3 level.

    • The Switch has 14 UniPorts with each UniPort consists of 2 lane TX and 2 Lane RX M-PORT supporting 5.8Gbps/lane

    • A supervisory microcontroller controls and configures the Switch LSI via I2C slave address.

    • Other features include:– Data routing from every UniPort to any other UniPort– Configuration through UniPro– Traffic class 0 and 1 with routing and arbitration support for

    both traffic classes

  • 9Copyright 2015, Toshiba Corporation.

    Supervisory ControllerBlock Diagram of Switch ASIC

    Switch ASIC

    Endopoint

    M-PH

    Y

    M-PO

    RT

    UniPro Module 8

    Endopoint

    M-PH

    Y

    M-PO

    RT

    UniPro Module 9

    Endopoint

    M-PH

    Y

    M-PO

    RT

    UniPro Module 10

    Endopoint

    M-PH

    Y

    M-PO

    RT

    UniPro Module 11

    Endopoint

    M-PH

    Y

    M-PO

    RT

    UniPro Module 12

    Endopoint

    M-PH

    Y

    M-PO

    RT

    UniPro Module 13

    Endopoint

    M-PH

    Y

    M-PO

    RT

    UniPro Module 14

    ModulesEndopoint

    M-P

    HY

    M-P

    OR

    T

    Uni

    Pro

    Module 1

    Endopoint

    M-P

    HY

    M-P

    OR

    T

    Uni

    Pro

    Module 2

    Endopoint

    M-P

    HY

    M-P

    OR

    T

    Uni

    Pro

    Module 3

    Endopoint

    M-P

    HY

    M-P

    OR

    T

    Uni

    Pro

    Module 4

    Endopoint

    M-P

    HY

    M-P

    OR

    T

    Uni

    Pro

    Module 5

    Endopoint

    M-P

    HY

    M-P

    OR

    T

    Uni

    Pro

    Module 6

    Endopoint

    M-P

    HY

    M-P

    OR

    T

    Uni

    Pro

    Module 7

    Modules

    Routing

    * M-PHY, MIPI, UniPro are registered trademarks or service mark of MIPI Alliance, Inc.

  • 10Copyright 2015, Toshiba Corporation.

    Configuration

    • Two Bridge LSIs (residing in modules)

    – AP Bridge:AP/Camera/Display Bridge

    – GP Bridge:General-Purpose Bridge

    • Switch LSI (residing in Endo)

    Wi-Fi is a registered trademark of Wi-Fi Alliance. / Bluetooth is a registered trademark owned by Bluetooth SIG, Inc. and any use of such marks by Toshiba Corporation is under license. / LTE is a trade mark of ETSI.

  • 11Copyright 2015, Toshiba Corporation.

    Contactless inductive interface

    Prototype Engineering Sample Commercial Sample

    Endo Version Spiral-2 Spiral-3 Spiral-3

    M-PHY Coupling DC (contact req’d.) DC / AC Contactless* DC / AC Contactless*

    Supported mode ~ HS-G3 (~6Gbps) ~ HS-G3 / PWM1(3~9Mbps), HS-G1,G2,G3

    ~ HS-G3 / PWM1(3~9Mbps), HS-G1,G2,G3

    [Key Features]

    • M-PHY protocol over contactless inductor

    • Wide band data transmission from Mbps to Gbps over channel with limited band width

    • Low power operation in low speed mode

  • 12Copyright 2015, Toshiba Corporation.

    Bridge IC Revisions– Key Features Summary

    Prototype Engineering Sample Commercial Sample

    Availability Sep. 2014(limited qty)Feb. 2015(limited qty) Jul. 2015

    Endo Version Spiral-2 Spiral-3 Spiral-3

    Part No. AP Bridge: T6WR5XBGGP Bridge: T6WR6XBGAP Bridge: T6WT1XBGGP Bridge: T6WT2XBG

    AP Bridge: TBDGP Bridge: TBD

    M-PHY Coupling DC(contact req’d.)DC / AC Contactless*

    DC / AC Contactless*

    Package AP Bridge: 5x5 107 BGAGP Bridge: 5x5 107 BGAAP Bridge: 5x5 109 BGAGP Bridge: 5x5 109 BGA

    AP Bridge: TBDGP Bridge: TBD

    CPORTs AP Bridge: 32GP Bridge: 16AP Bridge: 44GP Bridge: 16

    AP Bridge: 44GP Bridge: 16

    * DC / AC Contactless set prior to shipment

  • 13Copyright 2015, Toshiba Corporation.

    Starter Kit for ARA

    • Starter Kit– A simple board with Bridge Chip and USB socket for the 1x2

    module form factor – This Starter Kit enables module developers to try their idea or

    solution easily.

    microUSBsocket

    GPBridge PHY

  • 14Copyright 2015, Toshiba Corporation.

    Key Features for Starter Kit

    • Module to support USB - Type A/B micro receptacle for Data• PCB to support access test points for the following signals that

    connect to GP Bridge:– SDIO, UART, SPI, I2S, I2C, PWM, GPIO

    Developer’s Application Board

    ARA Platform w/ Starter kit ARA Platform w/ Starter kit

    Existing USB dongle

    Schematics and Layout data will be available upon request

  • 15Copyright 2015, Toshiba Corporation.

    Project Ara site in Toshiba Homepage

  • 16Copyright 2015, Toshiba Corporation.

    Contents

  • 17Copyright 2015, Toshiba Corporation.

    Bridge ICs Brochure

  • 18

    TOSHIBA CONFIDENTIAL

    Copyright 2015, Toshiba Corporation.