ansys icepak r18 update - fluid · pdf fileicepak r18 highlights ... transient option for...
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1 © 2016 ANSYS, Inc.
ANSYS Icepak R18 Update
2 © 2016 ANSYS, Inc.
Icepak R18 Highlights• Enhancements to SIwave <-> Icepak solution
Added automated iterative loop
• Improved Via handling capabilities Individually modeling vias – no K averaging Via Drill holes imported
• RedHawk CTM import with back annotation of Temps into RH
• Meshing Improvements
• Solver Improvments Vacuum -> enable radiation control in fluid zones Support for Streamwise Periodicity
• Inputs for Mass Flow or Pressure Gradient
• SpaceClaim Direct Modeler incorporates DME “Simplify Functions”
• ECXML support for data exchange
• Improved HPC performance
• Arbitrary Board Outline Imports using IDF
• Improved Krylov ROM for efficient network modeling
• Post Processing LED – Efficiency as a function of temp. Solar Heat Flux reporting Improved Surface Probing Smooth 3D Contours Optimized Manhattan displays Transient option for “Full Reports” Node-weighted interpolation for accurate facet-based post-processing
Cu-brass
3 © 2016 ANSYS, Inc.
SIwave-Icepak Workflow Improvements
Joule Heating
Thermal Cut-Planes• From ANSYS SIwave:
Conduction only analysis
Natural convection analysis
Forced convection (fan) analysis
Multi-phase VRM design support
IDF boundary conditions & Heat Sink creation
Geometry pre-processing for stand-alone Icepak
Component power (Watts) allocation during setup
Joule heating power mapping into Icepak & Mechanical
Cut plane temperature monitoring in XY-, XZ-, and YZ-planes
Ability to “Open” and perform more detailed analysis & reporting in stand-alone Icepak!
4 © 2016 ANSYS, Inc.
SIwave-Icepak Workflow ImprovementsIcepak Setup in SIwave
• ANSYS Icepak is solved directly in SIwave for ‘conduction only’ and basic convection models
• After setting up in SIwave, an Icepak project is built and run in the background and the temperatures are post-processed in the SIwave GUI
• Automation of iterative loop until DC convergence
5 © 2016 ANSYS, Inc.
SIwave-Icepak Workflow ImprovementsIcepak Setup in SIwave
• Filter added to delete all RLC components below a certain power
• Helps reduce number of components in Icepak
6 © 2016 ANSYS, Inc.
SIwave-Icepak Workflow ImprovementsIcepak Setup in SIwave
• Button added for convection to auto-size the Cabinet in the ANSYS Icepak project
7 © 2016 ANSYS, Inc.
SIwave-Icepak Workflow ImprovementsIcepak Setup in SIwave
• Updated Mesh settings for improved robustness
• Spatial Profile implementation for the power dissipation map has resulted in major improvements in overall turnaround time and robustness
• If available, most generic setups (old Automatic setup in ANSYS Icepak) can be run directly in the SIwave project setup
8 © 2016 ANSYS, Inc.
SIwave-Icepak Workflow ImprovementsIcepak Enhancements
• Improved usability and robustness Spatial Profile implementation
(using PCB primitive in Icepak) for the power dissipation map has resulted in major improvements in overall turnaround time and robustness
Boards can be offset or rotated from their original location
9 © 2016 ANSYS, Inc.
SIwave-Icepak Workflow ImprovementsIcepak Enhancements
• Support for Multiple Boards Boards of same setup can
point to the same initial SIwave project
The macro will launch the initial run, create the individual sitemp files and then queue the individual launches of new SIwaveprojects
Each board/substrate must have a separate SIwaveproject
10 © 2016 ANSYS, Inc.
SIwave-Icepak Workflow ImprovementsIcepak Enhancements
• Improved Usability Macro now only requires pointing to the board in Icepak and the project file for the
SIwave project
11 © 2016 ANSYS, Inc.
Chip Package System Workflow Enhancements
CTM View in Icepak
• ANSYS Redhawk CTM Import into Icepak
12 © 2016 ANSYS, Inc.
Chip Package System Workflow Enhancements
• Back annotation from Icepak to Redhawk− Main Menu/Report/Export/RedHawk Back Annotation
− Export the temperature at each tile to RedHawk
Select the die block.
Select the CTM file
Select location for output
13 © 2016 ANSYS, Inc.
MCAD to Icepak Enhancements
• ANSYS SpaceClaim is the new de facto CAD Cleanup Tool for all ANSYS products
• Geometry simplification, repair, and modification is significantly streamlined compared to ANSYS DesignModeler
• At v18, several of the “DesignModeler Electronics Utility” capabilities have been incorporated into ANSYS SpaceClaim.
SpaceClaim Icepak
14 © 2016 ANSYS, Inc.
Auto-Identify Simple Icepak Shapes in SpaceClaim
• After initial geometry cleanup is complete, the Identify Objectscommand can automatically create simple Icepak shapes
Input Geometry Structure Tree Icons are Updated
Before After
Icepak block icon
MCAD to Icepak Enhancements
15 © 2016 ANSYS, Inc.
Icepak Simplification Levels in SpaceClaim
Level 0 Level 1
Level 2 Level 3
• Level 0: Converts geometry to a bounding box prism
• Level 1: Converts geometry to a collection of prisms and cylinders
• Level 2: Converts geometry to a polygonal approximation
• Level 3: Keeps the geometry as-is (use only when needed)
MCAD to Icepak Enhancements
16 © 2016 ANSYS, Inc.
Modify Icepak Object Type in SpaceClaim
• Sometimes it makes sense to change the object type, some examples are− Icepak Plate → Source, Wall, Opening
− Icepak Block → PCB
Icepak Block Icepak PCB
The geometry remains the same, but the object options
are different in Icepak
Structure tree icon is updatedLevel 2 simplification already done
MCAD to Icepak Enhancements
17 © 2016 ANSYS, Inc.
ECXML: Icepak – Flotherm Data Exchange Format
• Supported Features:
• Cabinet, Plates, Blocks, Walls, Sources, PCBs, Grilles, Resistances, Enclosures, Heatsinks, 2R Network Blocks, 2D & 3D Fans
• Materials: Solid
• Assemblies
• Monitor Points
• Implemented cross-platform encryption algorithm
• Joint testing effort with Mentor
18 © 2016 ANSYS, Inc.
• Icepak Model highlights: MCAD, ECAD, Non-conformal Assemblies, 734 objects
• Icepak Mesh highlights: ~11 M cells using unstructured, non-conformal, multi-level, hex-dominant meshing scheme
• Icepak Solution highlights: Steady state, Turbulent Flow, Conjugate Heat Transfer, Double Precision.
Solver Enhancements – Improved HPC Performance
Desktop Server Setup in Icepak
19 © 2016 ANSYS, Inc.
• System Information
– Intel Xeon CPU E5-4650L 2.6 GHz processors, 512 GB RAM
– 4 processors, 32 cores
– Running Windows Server 2012 R2 Standard.
• HPC Test Summary
– Trials were run using ANSYS Icepak v18.0 and ANSYS Icepak v17.0.
– Each trial was run for 250 iterations.
– Solution time tracking:
• Overall Run Time: Includes Case Setup and Computational Effort.
Solver Enhancements – Improved HPC Performance
20 © 2016 ANSYS, Inc.
Icepak R17 vs R18
• Overall Run Time vs Number of Cores
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1 2 4 8 12 16 20 24 28
Ove
rall
Ru
n T
ime
(Hrs
)
Number of Cores
R17 - Overall Run Time R18 - Overall Run Time
Solver Enhancements – Improved HPC Performance
21 © 2016 ANSYS, Inc.
• Speed-up vs Number of Cores
• Overall run time for 1 core taken as reference to calculate Speed-up
0.00
2.00
4.00
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0 2 4 6 8 10 12 14 16 18 20 22 24 26 28
Spe
ed
-up
Number of cores
Speed-up - v17 Speed-up - v18
Icepak R17 vs R18
Solver Enhancements – Improved HPC Performance
22 © 2016 ANSYS, Inc.
• Enable facet-based post processing for object face contours
• Temperature, Heat flux, Heat transfer coefficient variables available
• Export values to profile files
• Option to display contours on wall and wall-shadow
Solver Facet-based Post Processing: Object Faces
23 © 2016 ANSYS, Inc.
• ANSYS product information is highly confidential and proprietary. By proceeding with ANSYS product discussions, recipients agree not to use or disclose this information for any purpose.
• ANSYS product information is not a binding commitment, and is subject to change in ANSYS’ sole discretion. ANSYS undertakes no obligation to update product information.
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Legal Disclaimer
24 © 2016 ANSYS, Inc.
Icepak Vision -> R18.1 & Beyond
Create an Automated, Streamlined Electro-Thermal Multi-Physics Solution that utilizes Native MCAD/ECAD for First Pass Mesh/Solve Success
Key Drivers/Mandates
• Modern UI, Ease-of-Use
• Integration into AEDT
• Rapid Release Cycles
R18.1 First release
• Initial exposure with most common feature set
• CPS with Enclosure
• Steady-state thermal
Improved Workflow
• Native MCAD Modeler
• ECAD-MCAD Assembly
• Integrated Electro-Thermal Workflow
• Geometry Clean Up & Simplification
ANSYS Electronics Desktop (AEDT)• AEDT-Icepak