win ic designs principles of field applications and sales engineering introducing the book,
Post on 14-Dec-2015
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Many books have been written about IC design, but no book has been written about the before and the after IC design; namely, how to determine what ICs to design in the first place and subsequently how to design these ICs into systems. These before and after activities are mainly field applications and sales engineering functions.
This book combines two decades of author’s diverse experience in the IC industry. The purpose of the book is to make field applications and sales engineers more successful by formulating a winning methodology for the practice of their profession.
Purpose of the Book
Chapters
1. The role of the field applications and sales engineer
2. The six stages of the design-win
3. Determining the IC requirements of an application
4. Win ASIC designs
5. Win memory designs
6. Win microcontroller and microprocessor designs
7. How to use quality and reliability engineering to win designs
8. Price negotiation
9. Supporting distributors and representatives
10. Making customer visits more effective
opportunity identified
TO
DO
TO
PR
OV
IDE
Establish FAE, Rep, & PME team
Identify customer decision makers and email invitation
Email promotional agenda
Sales makes corporate presentation
FAE makes engineering presentation
Show samples & starter kits
Get commitment for follow up visit for a firm reason. E.g., demo tools
MCU/MPU selection guide
PowerPoint Presentations
General product catalogue (non-MCU products customer could use in this or other applications)
1st visit 2nd visit 3rd visit
FAE writes engineering customer visit report
Rep writes business visit report & provides pricing info.
Email “thank you” & list of action items
Set up internal meeting to establish strategy & assign action items
FAE creates comparison table vs. Competitions
Additional literature w/more detail
More promotional info such as press release & articles to keep visibility high
Email promotional agenda
FAE demos tools
Bring high-level people if sticky business or technical issues
Discuss software development issues
Offer MCU training
Tools & tools documentation
Evaluation kit
Comparison table & benchmarks generated by CAE (Central Application Eng.)
Application notes
More MPU promotional material. E.g., info on existing systems using same processor
FAE & rep write visit report & raise red flags
Marketing & CAE write business & engineering proposal
Update & adapt design–win strategy
Invite corporate executives if needed
More promotional items. E.g., gifts w/ corporate logo
Component engineering information. I.e., die & packaging photo & info
Implement vertical sales by having high-level people from both sides
General engineering & business proposal
vendor selection
FAE & rep to be present for any questions or concerns when vendor selection is being made
Have
NDA signed Q/A
Submit microcontroller support proposal
Take customer to lunch & get info on competition & further understand motivating factors
Email promotional agenda
Confirm final decision date
Get commitment that you will have the last look
between visits
Microcontroller Design-Win Management First Level Information
Specific engineering & business proposal
Offer tools training
Inform your prospects that if they would like the proposed microcontroller/microprocessor benchmarked, you would provide this service to them. The benchmark could be for large parts of the customer’s code or for a critical part of their code that needs to be processed within a specific time. The code could be in either C (or any high level language) or assembly. If in C, customer can also evaluate the C compiler’s efficiency. (C compiler efficiency is the size of the assembly code the compiler generates compared to the size of the assembly code if it was hand-written by an expert assembly language programmer).
If the customer’s application is highly interrupt driven, you could also benchmark multiple interrupts, nested or not nested, from various sources, to benchmark interrupt latency times.
It is said that there are lies, damn lies, and benchmarks. In order for the benchmarks to be credible and meaningful, your company should ideally belong to a third party consortium that does independent, objective, and unbiased benchmarking. One such organization is The Embedded Microprocessor Benchmark Consortium* (eembc.org). EEMBC’s benchmarks are for commonly used algorithms in consumer, automotive, and networking applications.
If there are benchmarks you can provide to your customer that were performed by EEMBC, provide it.
(*Similar independent benchmarking organizations exist for ASICs. Instead of running code, they design circuits using libraries from various ASIC suppliers and benchmark / simulate the speed and power consumption of these circuits.)
Third Level Information
Code Benchmarking
16 entities FAEs interact with
15 ways to find design-win opportunities
6 stages of the design-win and how to execute each
5 ways to use quality and reliability engineering to win designs
12 types of IC prices
16 ways to obtain a lower price from IC marketing
5 ways to convince a customer to accept a higher price
Examples of Types of Information
Background
IC test engineer, FAE, PME
IC Types
MCU/MPU, ASIC, Memory
Companies
Hitachi, Xerox, Siemens, Mitsubishi, Toshiba, NEC
Sasan has written about ICs in Electronic News and NASA Tech Briefs. Sasan used to write software to test hardware. He wrote this book the way software is written; namely, structured and orderly, thus easy to read and follow.
Writer
Sasan Khajavi gained his IC engineering and business experience working for a systems company. He was an IC test and qualification engineer at Xerox where he selected and qualified ICs and IC vendors. Being on the other side of the fence, he learned firsthand how system companies make complex IC and IC vendor selection decisions, and created criteria and strategy for making these decisions.
Thank You
Buy / More Information
© 2012 winicdesigns.com
amazon.com/gp/product/1440425671
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