ryan rivers rdrivers@eecs.berkeley (510) 809-8627
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July 17th, 2014 1
Ryan Riversrdrivers@eecs.berkeley.edu
(510) 809-8627
Processing
Jeff Clarksonjclarks@berkeley.edu
(510) 809-8628
Richelieu Hemphillrhemp@eecs.berkeley.edu
(510) 809-8615
Kim Chankim@eecs.berkeley.edu
(510) 809-8631
Marilyn Kushnermarilyn@eecs.berkeley.edu
(510) 809-8629
July 17th, 2014 2
Research Community Commitment
Community
AssistanceCommunication Awareness
July 17th, 2014 3
Nanolab Engineers
Process and Equipment engineers are here to assist you
Each tool has assigned engineers
Process/Equipment Engineer 1 is in charge of that equipment
Process Engineer 1 approves special processes on equipment
July 17th, 2014 4
Plan Your Work !
Some tools are heavily reserved
Plan ahead one week – minimize idle time
Time = Money
July 17th, 2014 5
Working in the NanoLab
Nanolab Rule #1:
NEVER WORK ALONE
3rd to last person to leave must go notify the other two!
July 17th, 2014 6
Working in the NanoLab
Entrance Checklist:
Passed the Safety Quiz There are no announcements preventing lab access The HazMat alarm is not active Have blue shoe covers on No food or drink on person
July 17th, 2014 7
Gowning Procedure: Top Down
Shoe Covers Enter Gowning Bouffant Cap Bunny Suit
Shoe Covers Gloves Safety Glasses Complete
De-gowning occurs in reverse order
July 17th, 2014 8
Entering the Lab Area
Gowning Checklist:
No chemicals in storage box Safety Glasses on Name tag visible on coverall Changed damaged or stained coveralls/shoes/other gear Using proper size coverall and shoe cover Log on at the computer terminal before entering lab
July 17th, 2014 9
Equipment Qualification
Read the Manual
Take Equipment Test(520 SDH Front
Desk)
Get Training (Any Qualified
Member)
Complete Prerequisite
Requirements
Oral Qualification(Superuser)
When in doubt – ASK STAFF
July 17th, 2014 10
Complete Prerequisite Qualifications
• Many equipment sets have prerequisite qualifications and/or classes offered by staff
• Evaporation, SEM, E-beam Litho, and confocal microscopy classes are offered periodically
• Some toolsets have gateway tools (e.g. msink 6/8, tystar1-4, Leo SEM)
July 17th, 2014 11
Read the Manual
All major equipment has a lab manual on website
Process engineers update manual – send any suggestions to us!
Manual inconsistencies are reported on Mercury as process faults
July 17th, 2014 12
Training – All qualified can train!
Check reservations for the tool
Find a member using equipment
E-mail: <membername>@silicon.eecs.berkeley.edu
Request to observe run and get training
Each One Teach One – Train someone at least 1x per semester
July 17th, 2014 13
Take Equipment Test
Equipment tests available at 520 SDH (Front Desk)
Usually available online via Mercury
Specific tests are written only – copies at front desk
July 17th, 2014 14
Oral Qualification – Superuser Only
Check Mercury for superuser names/email
E-mail: <membername>@silicon.eecs.berkeley.edu
Request qualification. Make reservation with superuser
Sometimes process staff are the only superusers
July 17th, 2014 15
Quality Monitoring
• Quality Monitor tracks processes
• Data is posted monthly on MercuryWeb
July 17th, 2014 16
Quality Monitoring
• Quality monitor reports show valuable data trends• Reports also show standard process conditions for the monitor
July 17th, 2014 17
Material and Process Compatibility
• The Nanolab is a diverse processing environment
• Nanolab materials restrictions are as open as possible
• Many processes are very sensitive (e.g., Sinks/Furnaces)
• Duplicate process capability allows separation of materials
• Materials restrictions are given by tool and group
• Materials restricted by: • Substrate, Process, and Maintenance
July 17th, 2014 18
The Lab Manual
July 17th, 2014 19
Ch 1 - Material and Process Compatibility
• Chapter 1.7 – Furnace pre-clean & substrate restrictions
• Equipment manuals define material compatibility/cleaning
• Every piece of equipment has specific material restrictions
• Several equipment may have group contamination protocols
• Specific tools and processes require specific cleaning
July 17th, 2014 20
Ch 1 - Material and Process Compatibility
July 17th, 2014 21
Ch 2 - Sink Information /
Restrictions Sink Name (Maximum
Wafer Size)Processes Available
Marvell Lab
Location
Important Comments
msink1 (8")PR strip, tank develop, pre-furnace
metal clean 382 Note 2
msink2 (6")PR strip, tank develop
all metals allowed 382 Metal contaminated sink - Note 1
msink3 (8") Manual Resist Processing 382
msink4 (6") TMAH & KOH etch 382Staff Review required before wafers processed at
this sink returning to msink6, msink7, msink8.
msink5 (8")HF, BHF etch
special project etch(check labels at tanks)
382Metal contaminated sink, PR coated wafers allowed-
see Note 1
msink6 (8") Final Piranha - MOS clean sink 386No metals allowed- MOS clean sink
msink7 (6")Hot phosphoric, HF, silicon etch
386 No metals, PR coated wafers allowed
msink8 (8")Piranha clean,
BHF, aluminum etch386
No metals except aluminum in the aluminum etch tank, no PR coated wafers
msink16 (N/A) General clean - beaker process/part clean 582A Metal contaminated sink - Note 1
msink18 (N/A) General clean - beaker process/part clean 582A Metal contaminated sink - Note 1
Note 1 - Wafers processed at this sink are metal contaminated, ARE NOT ALLOWED to return to msink6, msink7, msink8.Note 2 - Gold, copper and or other highly diffusive metals ARE NOT ALLOWED at this sink.
July 17th, 2014 22
Ch 2 - Working at the Sinks• PPE must be worn when working at the sinks!
• Chemically resistant gloves• Face shield• Chemically resistant apron
July 17th, 2014 23
Ch 2 - Working at the Sinks
• Mixing chemistry can get HOT!
• Always use caution when adding chemicals and be aware of exothermic reactions
• Working at general purpose sinks (MSink16/18)
• You MUST be qualified• Describe your processes to each other• Process Tag all work at the station• Do not heat up a solvent directly on the heater chuck
July 17th, 2014 24
Ch 2 - General Wet Chemistry Cabinets
• Located in 582A, 381/383
• Standard chemicals available to members at no charge
• Special chemical storage needs pre-approval and label
• Use partial bottles first!
If empty – ask staff to restock
July 17th, 2014 25
Ch 2 - Changing Organic Bottles
July 17th, 2014 26
Ch 2 - Chemical Waste ManagementLog Sheet
Every pour requires an entry with a volume!
July 17th, 2014 27
Ch 3 - Mask Making at MNL
MNL provides in-house mask making• L-Edit Layout Software• GCA 3600 Pattern Generator• Refer to MNL Chapter 3 for complete details• Contact Process Engineer Jeff Clarkson for assistance
July 17th, 2014 28
Ch 4 - Photolithography Equipment
GCA 8500 5X i-Line StepperTypical Resolution: 0.8 umMinimum Resolution: 0.6 umPE1: Jeff ClarksonEE1: Greg Mullins
ASML 5500/300 4X DUV StepperTypical Resolution: 0.35 umMinimum Resolution: 0.25 umPE1: Jeff ClarksonEE1: Greg Mullins
Crestec CABL 9510 E-BeamTypical Resolution: 40 nmMinimum Resolution :10 nmPE1: Kim ChanEE1: Greg Mullins
Quintel Q4000 Mask AlignerTypical Resolution: 2.5 umMinimum Resolution: 1.0 umPE1: Kim ChanEE1: Greg Mullins
Karl Suss MA6 Mask AlignerTypical Resolution: 2.5 umMinimum Resolution: 1.0 umPE1: Kim ChanEE1: Greg Mullins
Canon 4X Projection MATypical Resolution: 1.5 umMinimum Resolution: 1.0 umPE1: Kim ChanEE1: Greg Mullins
July 17th, 2014 29
Ch 5 - Furnaces – AP and LPCVD
Tystar 1-4, Dry/Wet Ox,Anneal, Sinter, 4” & 6” wafers
Tystar 5-7, Dry/Wet Ox,Dopant Diffusion, Anneal, 4”, 6” & 8” wafers
Tystar 9-12, Nitride,poly-Si, a-Si, Low-Temp Oxide, 4” & 6” wafers
Tystar 13-16, Dopant Diffusion, SiC, poly-Si, a-Si, 4” & 6” wafers
Tystar 17-20, Nitride,Hi-Temp Oxide, Sinter, Si-Ge, 4” & 6” wafers
1. Furnaces are divided into MOS & non-MOS.2. Substrates must be cleaned before furnace use. Last pre-furnace step:
Msink6 for non-metal substrates, and,Msink1 for metal substrates going into metal approved furnaces.
3. III-V compounds are not allowed in any furnace.
July 17th, 2014 30
Ch 5 - Rapid Thermal Processors
RTP1 – III-V, PZT, metals; up to 6” wafersRTP2 – III-V; process up to 6” wafers
RTP3 – Si non-MOS, metals; up to 6” wafersRTP4 – Si MOS, silicidation; up to 6” wafers
RTP8 – Si MOS Gate Oxidation;Process up to 8” wafers
Rapid Thermal Processing has time scales on the order of seconds to reach up to 1100ºC. Applications include thermal oxidation, anneal, dopant activation and metal reflow.
July 17th, 2014 31
Ch 6 - Thin Film Deposition – PECVD/HFCVD
System Name Power Type Temp Materials
oxford2 RF Plasma 100-350C a-Si, SixNy, SiO2
pqecr ECR Plasma 25-300C Al, Cr, Cu, Fe*, ITO, Ni*, SiO2, Ti, W
sp3 Hot Filament 700C Diamond
July 17th, 2014 32
Ch 6 - Thin Film Deposition – ALD
System Name ALD type Temp Materials
cambridge RF Plasma/Thermal 100-500C Al2O3, TiO2, ZrO2, TiN, Ru, SiO2
picosun Thermal 160-300C Al2O3, TiO2
July 17th, 2014 33
Ch 6 - Thin Film Dep – PVD Sputter
All PVD tools require use of light blue “vacuum” gloves
System Name Type Porous Reactive Targets User Changed? Materials
mrc944 RF Magnetron
No No 4 N Al/2%Si, Al/Mn, Ni, NiV, W, Ti
edwards RF/DCMagnetron
Yes Yes 3 Y Al, Cr, Cu, Fe*, ITO, Ni*, SiO2, Ti, W
randex DC Diode Yes Yes 2 N
gartek DC Magnetron
No No 3 N Al, Nb
aln2 AC/DC Magnetron
No Yes 4 N Mo, AlN, Al
Topgun DC Magnetron
No Yes 4 N Al, Cu, Si, Ti
July 17th, 2014 34
Ch 6 - Thin Film Dep – PVD Evaporation
Evaporators require Evaporation Training Workshop Qualification
System Name Type Temp Porous Dielectrics Magnetics Sources Materials
cha E-beam High Yes No No 6 Ag, Al, Au, Cr, Cu, Nb, Pd, Pt, Sn, Ti
tescal Thermal High Yes No Yes 3 Ag, Al, Au, Cr, Nb, Pd, Pt, Ir, Ru
nrc Thermal Low-High Yes No (TBD) Yes 2 Ag, Al, Au, Co, Cr, Cu, Fe, In, Ni, Pd, Pt, Si, Sn, Ti, ITO, TCO
ultek E-beam High No No No 3 Al, Au, Cr, Cu, Pd, Pt, Ti
edwardseb3 E-beam Mid-High No Yes No 4 Ag, Al, Mn, Mg, Si, SiO2
dw E-beam Low-High No Yes No 4 Ag, Al, Mn, Zn
July 17th, 2014 35
Ch 7 – Etching Systems – Plasma
System Name Type Chemistry He cooling Materials Group
Lam6 RIE Fluorine Yes SiN, SiO2, BARC
Lam7 TCP/Bias Cl2/BCl3 Yes Al, Ti
Lam8 TCP/Bias HBr/Cl2 Yes Silicon, SiC, SiGe
Technics-c RIE SF6/He No SiN, SiO2, Si
Centura-3-5 ICP/Bias Various, Cl2 Yes III-V Nitrides
Centura-met ICP/Bias Cl2/BCl3 Yes Al, Ti, W
Centura-mxp RIE CF4/CHF3/CH3F Yes SiN, SiO2
Matrix-etch RIE CF4/SF6/O2 No Si, SiN, SiO2, Mo
Semi RIE CF4/O2 No Nb, SiO2
Ptherm RIE Various No Various
Sts2 DRIE SF6/O2, C4F8 Yes Si
Sts-oxide DRIE C4F8, H2 Yes SiO2
July 17th, 2014 36
Ch 7 – Etching Systems – Other
System Name Type Chemistry Materials Group
Primaxx Vapor Anhydrous HF SiO2
Xetch Vapor XeF2 Si
Ionmill Ion Mill Physical Ar Sputter Various
July 17th, 2014 37
Ch 8 -Testing and Inspection Equipment
MNL has a wide range of test and inspection equipment. See Chapter 8 in the MNL Manual for a complete list. Contact MNL Process Engineer Jeff Clarkson for assistance.
July 17th, 2014 38
Thank You for your attention!
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