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RU30E4BN-Channel Advanced Power MOSFET

Features Pin Description• 30V/4A, RDS (ON) =30mΩ(Typ.)@VGS=10V RDS (ON) =55mΩ(Typ.)@VGS=4.5V• Super High Dense Cell Design• ESD protected(Rating 2KV HBM)• Reliable and Rugged• Lead Free and Green Devices Available (RoHS Compliant)

SOT23

Applications• Load Switch

N-Channel MOSFET

Absolute Maximum RatingsSymbol Parameter Rating Unit

Common Ratings (TA=25°C Unless Otherwise Noted)

VDSS Drain-Source Voltage 30V

VGSS Gate-Source Voltage ±12

TJ Maximum Junction Temperature 150 °C

TSTG Storage Temperature Range -55 to 150 °C

IS Diode Continuous Forward Current TA=25°C 1.1 A

Mounted on Large Heat Sink

IDP① 300μs Pulse Drain Current Tested TA=25°C 16 A

ID② Continuous Drain Current(VGS=10V)

TA=25°C 4A

TA=70°C 3.2

PD Maximum Power DissipationTA=25°C 1

WTA=70°C 0.64

RqJC Thermal Resistance-Junction to Case - °C/W

RqJA③ Thermal Resistance-Junction to Ambient 125 °C/W

Drain-Source Avalanche Ratings

EAS④ Avalanche Energy, Single Pulsed TBD mJ

Ruichips Semiconductor Co., Ltd Rev. C– JAN., 2019 1 www.ruichips.com

G

S

D

G

S

D

RU30E4B

Electrical Characteristics (TA=25°C Unless Otherwise Noted)

Symbol Parameter Test ConditionRU30E4B

UnitMin. Typ. Max.

Static Characteristics

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 V

IDSS Zero Gate Voltage Drain CurrentVDS=30V, VGS=0V 1

µATJ=125°C 30

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.7 - 1.8 V

IGSS Gate Leakage Current VGS=±12V, VDS=0V ±10 µA

RDS(ON)⑤ Drain-Source On-state Resistance

VGS=10V, IDS=4A 22 35 mΩ

VGS=4.5V, IDS=2A 35 55 mΩ

Diode Characteristics

VSD⑤ Diode Forward Voltage ISD=1A, VGS=0V 1 V

trr Reverse Recovery TimeISD=1A, dlSD/dt=100A/µs

11 ns

Qrr Reverse Recovery Charge 4 nC

Dynamic Characteristics⑥

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz 0.8 Ω

Ciss Input Capacitance VGS=0V,VDS=15V,Frequency=1.0MHz

200

pFCoss Output Capacitance 55

Crss Reverse Transfer Capacitance 20

td(ON) Turn-on Delay Time

VDD=15V, IDS=1A, VGEN=10V,RG=4.7Ω

8

nstr Turn-on Rise Time 13

td(OFF) Turn-off Delay Time 21

tf Turn-off Fall Time 5

Gate Charge Characteristics⑥

Qg Total Gate ChargeVDS=24V, VGS=10V,IDS=1A

7.5

nCQgs Gate-Source Charge 1.4

Qgd Gate-Drain Charge 2.5

Notes: ①Pulse width limited by safe operating area.②Calculated continuous current based on maximum allowable junction temperature.③When mounted on 1 inch square copper board, t≤10sec. The value in any given application depends on the user's specific board design.④Limited by TJmax. Starting TJ = 25°C.⑤Pulse test;Pulse width≤300µs, duty cycle≤2%.⑥Guaranteed by design, not subject to production testing.

Ruichips Semiconductor Co., Ltd Rev. C– JAN., 2019 2 www.ruichips.com

RU30E4B

Ordering and Marking Information

Device Marking① Package Packaging Quantity Reel Size Tape widthRU30E4B LXYWW SOT23 Tape&Reel 3000 7’’ 8mm

Ruichips Semiconductor Co., Ltd Rev. C– JAN., 2019 3 www.ruichips.com

① The following characters could be different and means:X =Assembly site codeY =YearWW =Work Week

RU30E4B

Typical Characteristics

Ruichips Semiconductor Co., Ltd Rev. C– JAN., 2019 4 www.ruichips.com

VGS=10V

Ids=4A

100µs

1ms10ms

DC

RD

S(O

N) li

mite

d

TA=25°C

Single Pulse

Duty=0.5, 0.2, 0.1, 0.05, 0.02, 0.01, Single Pulse

RθJA=125°C/W

RU30E4B

Typical Characteristics

Ruichips Semiconductor Co., Ltd Rev. C– JAN., 2019 5 www.ruichips.com

1V

3V

4V

8V10V6V

10V

4.5V

VGS=10VIDS=1A

TJ=25°CRds(on)=22mΩ

TJ=25°C

TJ=150°C

Ciss

CossCrss

Frequency=1.0MHz VDS=24VIDS=1A

RU30E4B

Avalanche Test Circuit and Waveforms

Switching Time Test Circuit and Waveforms

Ruichips Semiconductor Co., Ltd Rev. C– JAN., 2019 6 www.ruichips.com

RU30E4B

Package Information

Ruichips Semiconductor Co., Ltd Rev. C– JAN., 2019 7 www.ruichips.com

SOT23

bD

E1 E

ee1

A1

A2 A

LC

θ

0.25

L1

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