raw material for smart card manufacturing
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1
by ‐ Bhupendra Singh
Raw Materials used for Smart Card Manufacturing
There arePETG, PCperforma
Common
• P
• P
• A
• P
• P
• T
• H
• B
• P
Paper:
During inconstructand throkept as lo
e various matC, PLA and once requirem
nly used Car
aper
VC
ABS
ETG
C
eslin®
Holographic F
iopolymers:
VC ABS Blen
nitial days otion, but tow kind of apow as possib
INGREDIE
terial options others. The
ments, machin
d Materials
Foil
PLA and
nds
of card induday plastics
pplications oble.
ENTS FOR
available formaterial sel
ne requireme
Figure
ustries; pap have almos
or very low‐e
A CARD M
r card construlection for cnts and cost
1 A Smart C
per was usest made the
end applicati
MANUFACT
uction e.g. Pacard dependconsideration
ard
d as one oem obsoleteions where c
TURER
aper, Plastics s on variousns.
of the prefee. Papers cancost of the c
such as PVC,s factors suc
rred materin be seen in
cards needs
2
, ABS, ch as
ial of n use to be
PVC:
PVC (Polthermal monome
PVC cardreasons. applicatioPVC card
PVC cardsurface aimprove PVC carddecreasestorage cPVC card
PVC contPVC. Theadvantagaround 7to be add
yvinyl Chlorand chemi
er.
d film is thePVC films f
ons have ded film ranges
d films havea very good further prin
d film to incres over a pecondition. It
d films are pr
tains 57 % be PVC rigid sge over othe75 deg C. In ded which in
ride) is an aical propert
Diagram 1
e most comor cards are
ensity range s from 65 to
e inherent receptor fo
ntability on trease the suriod of time is advisablerinted to che
by mass Chloheets gener
er material oorder to inc
n turn increa
amorphous ties. PVC is
VCM
Polymerizat
mon and pre manufactu
from 1.3 to100 deg C.
surface eneor the printinthe surface. rface energy
e and the rae to check teck the surfa
orine (a halorally pass ULof constructicrease the Vase the cost
thermoplass produced
tion of Vinyl
referred maured by caleo 1.4 gm/cm
ergy of morng inks. PostCorona Discy of the filmte of degradhe surface eace energy o
ogen) whichL‐94; V‐0 ration. PVC homVICAT softenof the film.
stic polymer by polym
PVC
Chloride mo
aterial for candaring pro
m3. The VICA
re than 36 t treatmentscharge Treat
m. The surfacdation depeenergy by usof the film.
h imparts firing / or ASTmopolymer ning point ce
r with excelerization of
onomer
ard construcocess. PVC fiAT softening
dynes/cm, s may also btment (CDT) ce energy ofnds on the sing Dyne te
e extinguishTM D‐635 nohas VICAT soertain additi
lent mechaf Vinyl Chl
ction for valms used intemperatur
which makebe carried ois carried o
f the treatedmaterial andesters befor
h property toorms, which oftening poiives are req
3
nical, oride
arious card
re for
es its out to ut on d film d the e the
o the is an
int of uired
PETG:
PETG is gbackbonebrittlenemoleculereplaces,would. Tloweringvery goosandwichhence wstandard
PETG exhwith respgood prihence is material standardHigh temexhibits l
ABS:
ABS (Acrymolding mechanicare used
glycol basede in place ss and pre
e is much la, it does notThis interfer the polyme
od material h layer. Sinchen PETG is
d card life is e
hibits high mpect to clarintable surfaa preferredfor card p
d card life spmperature rlesser heat d
ylonitrile Buprocess. AB
cal property for making
d PET. Geneof ethylenemature age
arger in sizet fit in properes with cryer's melting for laminate the outer s used as thenhanced.
mechanical ity and tranace. It is recd material foproduction b
an of 5‐7 yeresistance odistortion du
utadiene StyBS is easy ty as well as hg SIM cards.
rally cyclohee glycol. Gleing of the e (6 additionerly with theystallization
temperaturion. PETG mlayer of the
he overlay o
Diagram 2
and flexurasparency. Itcyclable andor the constby plastic cears. PETG isf PETG mak
uring the lam
rene) is gento process mhigher thermBenefits of
exane dimetycol modifipolymer, w
nal carbon ae neighborin
and reducere. PETG exhmaterial is u card comes
outer mater
2 CHDM Mo
l propertiest also exhibid has got gotruction of tard majors
s cost effectikes it ideal
mination pro
erally used fmaterial by
mal resistancusing inject
thanol (CHDers are incwhich occuatoms) thang chains the
es the crystahibits high mused as the s in direct coial in the co
lecule
s. This mateits very highood die cutthe cards. P
worldwide.ive as comp
choice in docess.
for making minjection m
ce. Injection tion‐molded
DM) is addedcorporated trs in unmon the ethylee way an ethallinity of thmechanical s
overlay maontact with onstruction
rial exhibitsh surface glotting and puETG is now . PETG baseared to Polydye sublima
monolayer cmolding. ABS
molded ABSd cards are t
d to the polto minimize
odified PET. ene glycol uhylene glycohe polymer stiffness andterial on PVthe environof the card
s better prooss and hasunching pro
widely acceed cards exycarbonates ation printin
cards by injeS exhibits bS card substthat it elimin
4
ymer e the
This nit it l unit thus
d is a VC as ment s the
perty very perty epted xhibit (PC).
ng. It
ection better trates nates
the millinpolymeri
ABS has the VICAper ISO s
PLA:
PLA (Polmaterial.card mamaterialspolymeri
ng process tizing styrene
very high VT softening
standard.
y Lactic Ac. Thus PLA hking (e.g. Ps and comization of lac
hereby simpe and acrylon
Diagram 3 A
ICAT softenipoint of the
id) is madehas lower CaVC, PC, and
mpounds forctide, which
Diag
plifying the pnitrile in the
Acrylonitrile,
ing point; hee PVC. ABS d
e from Cornarbon Footprd PETG etc.r making tis a cyclic di
gram 4 Polym
process of cae presence o
, Butadiene &
ence it is madoes not fulf
n or other rint when co). Many comthe cards. imer of lacti
merization o
ard making. f polybutadi
& Styrene M
any times bill the non‐f
natural souompared to mpanies havPLA is syn
c acid.
of Lactic Acid
ABS is a copiene.
Molecule
lended withlammability
rces, whichthe other mve launchednthesized b
d
polymer mad
h PVC to imprequiremen
is a renewmaterials used the PLA bby ring ope
5
de by
prove nts as
wable ed for based ening
The propbiobasedThe life ogood due
PLA has sin warpathe mate
Even thopotentiaand impl
PC:
The needcard subswith the manufacfrom norhigh dura
Propertie
• H
• V
• G
• V
• Li
• La
• C
• T
perties of PLd and biodegof PLA basee to high sur
some limitatge or twistin
erial with oth
ough this ml to make biementation
d for greaterstrate. This hmanufactu
turers needrmal PVC maability which
es of PC:
High tempera
Very low shri
Good printab
Very good op
ife span of m
aser engrave
onventional
hese films a
LA are quitegradable anded cards is srface energy
tions due tong of the caher suitable
material is inig impact in of strict gov
r security hahas resultedring of the to deliver m
aterial to high can be com
Diagram
ature resista
nkage
ble surface
ptical proper
more than 10
eable securit
l printing tec
re available
e similar to d do not prosimilar to thy exhibited b
o poor heat rds made frpolymer.
n its initial sfuture due
vernment le
s resulted ind in increase cards there
more securegh quality Pombined with
m 5 Polycarb
ant polymer
rties
0 years
ty features (
chniques can
in Clear, Op
that of theoduce any toat of PVC. T
by this mater
resistance oom this mat
stages of into greater egislation in v
n use of varioin the cost ois a need t
e and highly olycarbonate
high securit
bonate Mole
(e.g. CLI/MLI
n be used fo
paque and sp
PVC but adoxic fumes wThe printingrial, which is
offered by thterial. This c
ntroduction environmentvarious coun
ous technoloof the cardsto make cardurable car
e (PC) materty features to
ecular Struct
I) can be inc
r printing on
pecial colors
dvantage ofwhen recycleg property os similar to P
he material wan be overc
in the cardtal awarenesntries.
ogy intensive. Due to high
rds more durds. This hasial. PC is a po make high
ture
orporated
n the substra
f PLA is thated or incinerof the PLA isPET.
which may rome by blen
industry; itss among pe
e features oh cost assoc
urable. Thus s resulted inolymer with
hly secure ca
ates
6
t it is rated. s also
result nding
t has eople
n the ciated
card shift
h very ards.
7
Due to its high durability, life expectancy and stability towards environment; it has gained importance among more and more card companies. These films are produced and stored in clean environment and are generally available from 50 microns to 650 microns thickness range. Card manufacturers can guarantee 10 years service life for cards made completely from PC card films.
The other advantage of using all PC card is that it does not require any adhesive for lamination bonding. During lamination the PC molecules fuse together to form very strong bonds which cannot be delaminated. The PC cards are personalized using temper proof laser personalization technique which does not require any consumables.
PC card films can be used for making contact, contactless, dual interface and hybrid cards. This material is preferred worldwide for making Machine Readable Travel Documents (MRTD) as per ICAO specifications. e Passports and national ID cards which has stringent requirements of very high durability and security features have been implemented using PC films in various countries worldwide.
TESLIN®:
Teslin® is a proprietary composition offered by PPG industries; USA. It is widely accepted material in card industry worldwide. It is a polyolefin based (with 60 % of its weight comprised of non abrasive filler) micro porous synthetic material which has soft to touch substrate and is used in various Smart Card related applications such as e ‐ Passport inlays, financial Cards, National ID cards, Health insurance cards, Drivers License etc.
Characteristics of Teslin®
• High resistance to cracking and delamination.
• Teslin® can be printed by any conventional printing techniques as well as digital printing techniques.
• Due to its microporous structure Teslin® substrates are highly absorptive to inks.
• The durability of the cards made from Teslin® is improved.
• Teslin® is suitable for various card manufacturing related processes such as perforating, punching, folding, sewing, grommeting, foil stamping and embossing.
PVC/ABS
PVC homApplicatiincrease increase temperatheat resi
Compari
A compacommon
Heat StabFlex ResiUV ResistChemicaResistancResistancagainst delaminaCompatibwith ConChip Compatibwith contchip BiodegraPrice
Table 1: C
S Blend:
mopolymer ons such as the VICAT soin the VICA
ture makes stance. Gen
son of Raw
arative charnly used in ca
bility stance tance l ce ce
ation bility
ntact
bility tactless
adability
Comparison
based card GSM cards
oftening temAT softening
it possible erally PVC/A
Materials:
rt is given bard manufac
PVC
of Raw Mat
films have and Pay TV
mperature og temperatuto use these
ABS blend is
below for ecturing.
= Bes
ABS
terials used
VICAT softcards requirf PVC it is ge
ure to 91 +/e materials preferred fo
easy referen
st; = Go
PETG T
in Card Film
ening tempre high VICAenerally blen/‐ 2 deg C. in card app
or making GS
nce of the
ood;
ESLIN®
s
perature of AT softening nded with ABThe higher
plications whSM cards an
properties
= Average
PC
76 +/‐ 2 detemperatur
BS. This resuVICAT softe
hich requirend Pay TV ca
of the poly
PLA
8
eg C. re. To ults in ening high rds.
ymers
9
About the Author:
The author Mr. Bhupendra Singh is Managing Partner of GRACE TECHNOLOGIES; India For further details:
Email: info@gracetech.in Web: www.gracetech.in
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