nxp rf front-end solutions for 5g mmimo systems...5g mmimo solutions highlights •full rf...

PUBLIC

NXP RF Front-End Solutions

for 5G mMIMO Systems

April 2019

PUBLIC 1

5G Benefits and Key Pillars

• High speed, high capacity

− Faster data transmission than previous generations

• Supports interactive multimedia, voice, streaming

video

− 5G will be more effective, attractive

• Better reliability

− More clarity and quality than previous generations

• Increased throughput

− Capable of handling the huge increase expected with 5G

data usage

PUBLIC 2

5G Cellular Market Challenges

• Capacity, data rates, subscribers

− Smart devices increasing Internet traffic

• Reduce equipment size

− Smaller footprint to reduce installation costs

• Network infrastructure evolution

− Active antenna rise

− Power consumption

• Multiple standards to support

− 2G to 4G advanced

• Reduce CAPEX/OPEX

PUBLIC 3

NXP is Enabling Cost Effective mMIMO Active Antenna Systems

• NXP RF has developed a series of RF front-end components for use in 4G and

5G mMIMO TDD network equipment covering various cellular bands

− Family of low power Doherty PA pre-driver modules

− Family of high efficiency LDMOS Doherty PA modules

− Integrated TR-Switch and LNA module

With shield and

without shield

PUBLIC 4

NXP Front-End SolutionsPre-Driver Amplifier

• 3x4 mm2 package

Rx Front-End Module

• 4x4 mm2 package

PA Module

• 6x10 mm2 package

Low Cost Small Size

• 21x35 mm2 solution

NXP has developed a family of

fully integrated High Efficiency

Power Amplifiers

• Power levels up to 38 W Peak

• Roadmap covering bands 2.3 GHz to 5 GHz

• Easy implementation – 50 Ω input and output

• Pin-compatibility between all frequency bands and

power levels

• LDMOS – low cost solution

PUBLIC 5

NXP Integration Strategy:Performance, Smaller Size, BOM reduction

• Integration using a combination of SiGe, GaAs and LDMOS technologies into 50 Ω in/out modules reduces the number of components on PCB and decreases total system cost

• RF Front-End assembly is less than 21 x 35 mm2 in size and provides excellent RF performance

• NXP is executing its integration strategy:

− Performance

− Smaller size

− BOM reduction by utilizing NXP’s unique position in system expertise by supplying high voltage power amplifiers and low noise amplifiers

21 mm

35 mm

PUBLIC 6

NXP Front-End Solutions Overview

PAM 10x6 mm2

Solution 15x11 mm2

Pre-Driver Amplifier

• 3x4 mm2 package

Rx Front-End Module

• 4x4 mm2 package Family of fully integrated

High Efficiency Power Amplifiers Modules

• Power levels 2.5 – 5 Watt devices

• Covers cellular frequency bands 2.3 GHz to 5 GHz

• Easy implementation

• Footprint and pin-compatibility between all frequency bands and

power levels

• LDMOS – low cost solutions

PCB < 30 x 20 mm2

Rx

Pre-Driver

Power Amplifier Module Power Amplifier Module

PUBLIC 7

mMIMO Portfolio

PUBLIC 7

PUBLIC 8

mMIMO PA Front-End Solutions – NXP Advantage

NXP has developed a family of fully integrated power amplifiers

Applications

• Communications

• Radar

• massive MIMO systems

• Outdoor small cells

Semiconductor Technologies

• GaN, LDMOS

• GaAs, SiGe

Power levels

• 1-5 Watt devices

Roadmap frequency bands

• 1.8 GHz to 5 GHz

Value Proposition

• Easy implementation – 50 Ω input and

output

• Highly integrated form factor – smallest

size in the industry at 6 x 10 mm

• High efficiency Doherty PA

• Lowest circuit and DPD complexity in

the industry

• Lowest overall OEM system and

development cost

• Compatible multilayer FR4 board

• Pin-compatibility between all frequency

bands and power levels

PUBLIC 9

5G mMIMO Modules

• NXP to release 6 PAMs at IMS

Ref circuits Smart Demo

23D34 x

23D37 x

26D37 x x

35D35 x

35D37 x x

37D37 x

PUBLIC 10

Family of fully integrated High Efficiency Power Amplifiers Modules

• Power levels 2.5 – 5 Watt devices

• Covering cellular frequency bands from 2.3 GHz to 5 GHz

• 50 Ω in/out easy implementation

• 6x10 mm2 footprint and pin-compatibility between all frequency bands and power

levels

• LDMOS = low cost solutions

PUBLIC 11

Family of fully integrated modules of

Doherty pre-drivers and TR-Switch & LNA

• Pre-drivers (3x4 mm2)

−Wideband performance, covering multiple cellular bands, fully

integrated, 50 Ω in/out, footprint and pin-compatibility between all

frequency variants

−25/29 dBm P1dB, 32 dB gain

− Id = 50 mA, 3.3 / 5 V operation, 1.8 V logic enable

• TR-Switch & LNA (4x4 mm2)

−2.3 GHz – 5 GHz, fully integrated, 50 Ω in/out

−NF < 1.2 dB, gain ~33dB

−0.8 µsec switching speed, 2nd stage bypass

−100mA at 5 V, 1.8 V logic

PUBLIC 12

5G mMIMO Solutions

Highlights

• Full RF Integration

• Small form factor

• Wide range of power and frequency variants

• Footprint and pin compatibility of variants

Customers

• Global traction for NXP solutions

• Winning majority of sockets

Fast growing RF Front-End portfolio

• Majority of products are in production now

• Full portfolio by end of 2019

Critical ramp programs on track

• Established manufacturing capacity

• Critical programs developed in collaboration with customers

PUBLIC 13

5G Network Development | Carriers Turning on mMIMO

• 5G field trials are now underway

• With 70+ trials underway worldwide, the 5G push is gaining momentum

• Sprint’s massive MIMO service launched in April 2018 in select U.S. markets

− https://www.fiercewireless.com/tech/sprint-to-turn-massive-mimo-6-cities-april

• NXP’s innovative mMIMO products are generating significant customer demand

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