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NASA-OR-205037
FINAL TECHNICAL REPORT
MMIC PACKAGE FOR MILLIMETER WAVE FREQUENCY
CONTRACT NO: NAS 3-27813
PREPARED FOR
NASA-LEWIS RESEARCH CENTER
21000 BROOKPARK ROAD
CLEVELAND, OH 44135
Sarjit S BharjSteve Yuan
21st June 1997
PREPARED BY
PRINCETON MICROWAVE TECHNOLOGY INC.
3 NAMI LANE, UNIT C-10
MERCERVILLE. NJ 08619
Distribution limited to U.S. Government Agencies only. Other requests for this document
should be referred to NASA-LeRC, Cleveland, OH 44135
https://ntrs.nasa.gov/search.jsp?R=19970023908 2018-04-28T14:41:23+00:00Z
TABLE OF CONTENTS
SECTION
1.0 EXECUTIVE SUMMARY
2.0 INTRODUCTION
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
Substrate Material Measurements
Package Fan out Design
Fabrication
Mechanical Measurements
Electrical Measurements
MMIC insertion into package
Package Layout
Package Data Sheet
3.0 CONCLUSION
References
2
3
5
7
12
14
18
21
22
23
24
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1.0
EXECUTIVE SUMMARY
Under a previous program sponsored by NASA Lewis Research Center (NASA/LeRC) in Cleveland, a
reliable, high performance, low cost package for high frequency communications electronics was
successfully developed. The package has many unique features which include:
• Broadband capability covering 18 to 36 GHz,
• Hermetically sealable
• Adaptability to accept MMIC's of different sizes• Low cost manufacturability for commercial and military applications.
Taking the next step, NASA Lewis Research Center initiated a program by making use of the existing
18-36 GHz package design as the baseline from which manufacturing, mass production, reliability and
quality assurance issues are addressed and perfected. Princeton Microwave Technology, assembled an
experienced team in microwave technology, monolithic microwave integrated circuit technology, and
ceramics processing technology for the successful transition of the existing package to a commercial
product which was manufactured by one of the leading microwave package manufacturing companies
in the United States.
The MMIC packages developed under this packaging technology were designed to operate over the
frequency range of 18 to 44 GHz. The package design was based on 92% alumina ceramic material
using a high temperature co-fired system. Extensive efforts were used to replicate the dielectric
constant and dielectric loss properties of the original design material. To this end a dielectrometer was
used to verify the properties of materials obtained from major suppliers of HTCC material. It was
quickly determined that the availability of the ceramic material with the desired properties was not
available and that the data supplied by the suppliers were inconsistent and did not take into account the
frequency dispersion of the dielectric constant. The characterization eventually led to the selection of
a tape at Microcircuit Packaging of America Inc., and manufacturing of the package followed soon
thereafter.
The performance of the packages were measured in an Intercontinental Microwave test fixture up to
40 GHz. The package demonstrated repeatable performance from DC to 40 GHz, with an insertion
loss of 1 dB per transition and a return loss of 15 dB at 30 GHz.
The packaging effort performed under this contract was intended to determine the manufacturing
issues associated with the packages. Demonstration of the package performance using single stage
MMIC amplifiers was accomplished from DC to 30 GHz.
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2.0
INTRODUCTION
The objective of the MMIC packaging technology program is to develop a generic packaging scheme
that permits low cost and timely insertion of MMIC devices into NASA communications systems.
The development and design of the original package was well documented. A complete design was
licensed from Hughes Aircraft. PmT visited Hughes Aircraft and talked to the original designers of the
package in order to determine the critical parameters. Their input was to obtain the substrate with a
dielectric constant and dielectric loss consistent with the original design. The objective for the
manufacturing of the package was to replicate the material characteristics. The ceramic substrates to
be used for this program is one of the key elements for the MMIC package. The package designed
under the original R & D program used high temperature co-fired ceramic substrates with a dielectric
constant of 9.5 provided by Kyocera. PInT contacted many US ceramic substrate manufacturers
including MPA, Mistier, Coors, etc. None of the companies had ceramic substrates for co-firing
applications with a dielectric constant of 9.5. For example, Coors Ceramic Company, for their
production packages, has tape cast substrates with a dielectric constant of 9.1 measured at 1 MHz.
The frequency dispersion of dielectric constant was not specified or known.
The limited availability of a substrate with a dielectric constant of 9.5 forced PInT to look at the
redesign of the package feed through transition to adapt to a dielectric constant of 9.1. The transition
was analyzed using a simple model in Touchstone and confirmed [1], by 3D electromagnetic simulator.
The simulations indicated that a dielectric constant of 9.1 for the ceramic substrate will provide a good
electrical performance which was very close to the original design. The change in the dimensions of
the transition due to the change of the dielectric constant was within the manufacturing tolerance and
therefore required no modifications. The only other issue left was to determine if the manufacturer
supplied dielectric constant was accurate fbr our application when frequency dispersion is taken into
account.
To determine the accuracy of the value of dielectric constant and its dispersion with frequency we
contacted GDK Products Inc., to conduct the appropriate measurements. The GDK measurements
Princeton Microwave Technology Inc. 2
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NASA MMIC PACKAGE
system uses a non-destructive method of determining the dielectric constant and loss factor. All
samples received from the substrate manufacturers were subject to measurements and it was
determined that substrate specified at 1 MHz with a dielectric constant of 9.1 exhibited a dielectric
constant of 8.3 GHz at 15 GHz. The frequency of measurement is determined by the thickness of the
sample. This was consistent with the majority of the substrate vendors. For example Mistler procured
the raw material from Coors and used the ! MHz values for his formulation. The measurements of
Mistler substrate exhibited similar characteristics to that of Coors. The measured properties of the
various substrates are documented in section 2.1
To speed up the overall measurement procedure Princeton Microwave utilized a GDK products
dielectrometer. This enabled PInT to test a large array of ceramic substrates at a faster rate and
provide appropriate feedback to MPA.
Following the selection of the green tape material, MPA was asked to proceed with the manufacture
of the package with their standard high temperature co-fired ceramic process. The selected substrate
exhibited a dielectric constant of 9.063 at a frequency of 11.484 GHz with a loss tangent of 0.00189.
The only other change to the original package design was a change in the layout of the bias ports due
to a discrepancy in the earlier design. The modifications are detailed in section 2.2.
2.1 Substrate Material Measurements
A number of substrates were received from Microcircuit Packaging of America, MPA. All of the
substrates were processed internally by MPA. The substrates were sent to GDK Products in
Cazenovia, NY, by PInT for characterization. Following is the summary of the measurements on the
first batch of substrates.
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1 8.664 .0015 13.0736
2
3
3*
3**
* Tight Coupling
8.657
8.775
8.830
8.889
** Loose coupling
.0022
.0031
.0026
.0028
13.0376
13.0417
13.0213
13.0194
during measurement in test cavity [2].
Princeton Microwave Technology Inc.
NASAMMICPACKAGE
Due to the low dielectric constant,MPA sentmoresubstratesfor characterization.The following
propertiesweremeasured.
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2 (White)
3 (White)
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2 (Black)
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8.690
7.875
7.450
8.928
9.063
8.932
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13.0968
13.5457
14.0669
11.5141
11.4840
11.5510
None of the substrates received from MPA achieved the desired dielectric constant of 9.5.
Subsequently a substrate from MPA with a dielectric constant of 9.063 (#2, Black) was selected.
Other vendors were not able to provide a substrates with the desired dielectric constant.
In order for our manufacturing to be successful and to meet RF performance requirement with the
new substrate a 3D electromagnetic simulation of the package was conducted [1], with a lower
dielectric constant. The results of this analysis is detailed in Figure 1. The change of the dielectric
constant did not cause a significant of the RF performance. Since the loss tangent was close to the
design value, it was decided to place an order with MPA for the package manufacture with the
.elected tap e.
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18 20 22 24 26 28 30 32 34 36 38 40
Frequency [GHz]
Figure 1: 3D Analysis of the Ceramic Package
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Princeton Microwave Technology Inc. 4
NASA MIVIIC PACKAGE
2.2 Package Fan-out Design
The mechanical layout of the original package was conducted by MPA before manufacture. A flaw
was discovered in the fan-out pattern associated with the bias lines at the corner. The flaw, detailed in
Figure 2, was due to the slant lines having an angle that interfered with the stress relieving circles at
the corners of the cavity. To alleviate this problem without affecting the RF performance of the
package, the following modifications were agreed upon with MPA. Basically, the dimension 0.015 has
been changed to 0.040 as shown in Figure 3. This change will not affect the location of the visa which
are critical to the tLF performance of the package.
There were some inconsistencies also with the dimensions of the transition as shown in Figure 4. The
first inconsistency was the length of the transmission lines at the inside edgeofthe substrate next to
the cavity. If we subtract 0.064 from 0.076, the length should be 0.012 instead of 0.016. The second
inconsistency was the length of the transmission lines at the outer edges of the substrate. This
dimension, shown in Figure 4, was 0.026 whereas in Figure 3 it was 0.030. It was ascertained that
0.026 was the correct dimension and therefore it was modified as shown in Figure 3.
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Figure 2: Package Corner Detail
Princeton Microwave Technology Inc. 5
NASA MMIC PACKAGE
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Figure 3: ]Package Corner Detail Showing Modified Corner
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Figure 4: Transition Design
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2.3 Fabrication
The existing baseline package designed by Hughes Aircraft Company (Hughes package) takes
advantage of the maturity of the co-firing process technology for hermetically sealable MMIC
packages. However, the co-fired ceramic process does have limitations on resolution associated with
printing process and co-firing process. With the Hughes package, such problems have already been
addressed and resolved satisfactorily.
The W/Ni/Au Metallization on system used for the Hughes package is generally accepted as a good
choice for this application. PInT instructed MPA to use the same Metallization or the conductors, the
ground planes and to fill the RF vias. The High Temperature Co-fired Ceramic process flow used by
MPA is detailed below. The process is very similar to that used by Kyocera for first package. Figure 5
is a typical process flow diagram for ceramic package fabrication. Understanding the co-fire ceramic
process enables the designer to appreciate the dynamics and complexities inherent in the technology.
The details below provides an Overview in terms of process which will be expanded to specific design
parameters.
Ceramic Slurry
The Co-fire multilayer process begins by milling precise amounts of raw materials into a homogenous
slurry. This mixture, which has the consistency of latex paint, is principally Alumina (aluminum oxide,
Al203), and fluxes with small amount of organic binders and solvents.
Ca iing
The shtrry is poured onto a mylar sheet and then passed under a doctor blade to produce a uniform
strip of specified thickness. When dried this strip becomes a ceramic filled plastic tape with the look
and feel of thick vinyl.
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Cutting
The sheets of"green" (unfired) ceramic tapes are cut into cards. Alignment holes are punched in each
card to ensure accurate layer to layer alignment dtuiug subsequent operations. Exact registration
becomes more critical as circuits densities increase.
Princeton Microwave Technology Inc. 7
NASAMMICPACKAGE
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Figure 5: Flow Process for Ceramic Package Manufacture
Princeton Microwave Technology Inc. 8
NASA MMIC PACKAGE
Punching and Filling
Via holes, cavities and notches are filled in the cards as required. The vias are filled with tungsten
paste, a mixture of metal powder and organics that become conductive when fired. Although other
metals, such as copper, are better electrical conductors, their melting points are lower than +1600 °C
necessary to co-fire alumina ceramics. Tungsten combines a satisfactory level of electrical conductivity
with a sintering point and shrink rate compatible with alumina.
The standard filled via will carry the electrical signal from one metaUized layer to the next. When
densities dictate via diameters of 0.010" or less, process precision is essential. The bore-coated via, a
large open via with a metallized ID coating, can fimction either as a castellation or as a receptacle for
interconnecting wires or pins. These vias are punched in the same manner as standard vias but coated
by a proprietary process.
The diameter of via holes in this package will be 0.008_+0.001 although MPA has a capability Of 0.005
inch.
Screening
Conductive circuits are printed onto the ceramics tape by forcing tungsten paste through an open mesh
metal screen. The circuit pattern for each artwork layer is made into a screen by the same
photolithographic process used in thick film and other screen printing techniques. The artwork, is
adjusted by interamics to allow shrinkage during firing. MPA uses a 325 mesh/inch screen. The
straight line width is with in 0.125 rail after thick inks are filled. The ink is 0.005 inch away from any
edge of the substrate. The tolerance on printing linear lines is _+0.005 nch.
Assembly and Lamination
Screened layers are inspected, aligned and laminated under high pressure and low temperature into one
assembly. This assembly may be comprised of a single unit, or include multiple repetitions of the same
product. The multiple units are processed as a single assembly from punching through lamination.
Princeton Microwave Technology Inc.
NASAMh,flC PACKAGE
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Scoring and Side Screening
A high precision score tool is used to form single units or to separate multiples. This tool is also used
to partially score green ceramic structures to allow plating interconnects to be snapped off after firing.
When conductor pads are required on the side of the product, additional screening operations are
performed on the laminated, trimmed units.
Firing and Flattening
The ceramic structure is cofired at approximately 1600 °C in a carefully controlled reducing
atmosphere. During the firing process the product shrinks approximately 20 percent (linear) for a total
volume reduction of 40 percent. A subsequent high temperature operation may be used to achieve
.002 inches per inch flatness or better. MPA has a _+0.8% dimensional control using the HTCC.
Base Plating
Base finish material, nickel, was electrochemicallyl applied to all exposed tungsten Metallization to
improve performance, prepare the surface for subsequent braze operations and prevent oxidation of
conductors pads.
Brazing
Brazing is used to join metal components to the nickel plated ceramic structure. Carbon or ceramic
braze fixtures are utilized to properly position metal components in relation to the ceramic structure as
it is processed through a braze furnace. Copper-silver eutectic is the most widely used material for
brazing. It forms a strong hermetic joint. When thermal expansion mismatch between alumina ceramic
and the metal component (Kovar or Alloy 42) being significant, an indium-copper-silver eutectic was
used.
Final Plating
Electrolytic plating requires that all exposed circuits be connected electrically by means of a lead
frame, plating bus or a combination of the two. Gold was used as the final plating material.
Princeton Microwave Technology Inc. 10
NASAMMICPACKAGE
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Final Inspection
A product specification is used to define sample size and testing procedure and supplement inspection
parameters included in a product drawings. A certificate of compliance, test reports and first article
documents were provided.
All packages delivered are checked for hermeticity. The packages achieve typically 1 x 10 .8 cc/sec of
Helium.
Since the ceramic package has Kovar material for the package base, and the size is of the same order,
it will no change in thermal resistance significantly. However, the ceramic substrate offers a very close
match in thermal coefficient of expansion (TCE = 6.7 PPM per degree C). Therefore, the stress level
will be acceptable even for the larger size package. For high power dissipation (higher than 2 watts),
copper-tungsten material is perfectly matched with ceramic in term o£ thermal coefficient of expansion
and provides much lower thermal conductivity.
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Princeton Microwave Technology Inc. 11
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2.4 Mechanical Measurements
Two hundred packages were received from MPA. Incoming inspection of the packages were
performed. Each package has been given a serial number. Dimensional measurements were performed
on more than 10 % of the packages. The samples were randomly chosen. The following dimensions
were measured.
A - Package external width
B - Package external length
C - Package cavity length
D - Package cavity width
E - Cavity depth
F - Package height
Figure 6: Package Dimension Measurements
Princeton Microwave Technologic Inc.12
NASA MIvIIC PACKAGE
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PAl( No. A
0006 0.285
0007 0.285
0008 0.285
0009 0.285
0011 0.284
0012 0.284
0013 0.283
0014 0.285
0015 0.285
0016 0.285
0017 0.286
0018 0.284
0019 0.285
0020 0.284
0031 0.286
0032 0.285
0041 0.285
0042 0.285
0051 0.285
0052 0.285
0061 0.285
0062 0.285
0071 0.285
0072 0.285
Max A 0.004
B C D E
0.284 0.168 0.107 0.032
0.285 0.169 0.107 0.031
0.285 0.162 0.106 0.030
0.285 0.169 0.110 0.031
0.285 0.165 0.110 0.032
0.285 0.169 0.108 0031
0.283 0.166 0.109 0.034
0.285 0.167 0.108 0.032
0.285 0.168 0.106 0.031
0.285 0.169 0.107 0.032
0.286 0.169 0.107 0.032
0.284 0.168 0.108 0.030
0.285 0.169 0.105 0.031
0.284 0.167 0.107 0.031
0.285 0.167 0.106 0.031
0.285 0.167 0.106 0.033
0.285 0.168 0.105 0.032
0.286 0..169 0.105 0.034
0.285 0.170 0.110 0.030
0.285 0.169 0.107 0.035
0.285 0.167 0.106 0.032
0.285 0.169 0.109 0.035
0.285 0.169 0.106 0.035
0.285 0.167 0.106 0.035
0.003 0.008 0.005 0.005
F
0.044
0.043
0.043
0.043
0.043
0.042
0.041
0.043
0.043
0.044
0.045
0.043
0.043
0.042
0.042
0.043
0.043
0.043
0.042
0.044
0.043
0.044
0.042
0.043
0.004
Based on the measurements, the mechanical dimensions for the package were within the full design
dimensions.
Princeton Microwave Technology Inc. 13
NASA MMIC PACKAGE
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2.5 Electrical Measurements
An Intercontinental Microwave Test fixture was used to conduct RF measurements. Fifteen mil
alumina substrates with 50 Ohm lines were soldered in the packages. After full calibration of the
Network Analyzer with the Intercontinental test fixture, the insertion loss and return loss of the
packages were measured. The packages showed good performance characteristics. Basically, the
return loss was better than 15 dB from DC to 35 GHz, This means that the match provided by the
transitions is extremely Broadband. The insertion losses including both the input and output ports
averaged less than 1 dB from DC to 18 GHz, or less than 0.5 dB per transition. The insertion loss
increased above 32 GHz. The measurements were repeatable.
Princeton Microwave Technology has successfully demonstrated the manufacturability of the package,
which was the primary objective of this program. The measured performance of the package is detailed
in Figures 7 to Figures 12.
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Figure 7 and 8 detail the insertion loss and return loss of package 001. The insertion loss includes the
loss associated with a 15 rail alumina, 0.110 inch long, bond wires and the two transitions. The
measurements were conducted in the Intercontinental Microwave test fixture.
Figures 9 and 10 detail the insertion loss and return loss of package 002.
Figures 11 and 12 detail the insertion loss and return loss of package 003.
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Princeton Microwave Technology Inc. 14
NASA MMIC PACKAGE
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Figure 7: Forward Transmission of package 001
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_, , : _, ] _] J1iz _11 1 L_.__.._.__:_._J .... ± .... -_.... --
o.o_oooo ., _._ ,40.000000
Figure 8: Forward Reflection of package 001
Princeton Microwave Technology Inc.15
NASA MMIC PACKAGE
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LOG F.Af;,_ITL_F. RE,_- 0.000 fl;] ._.000 d3/DiV
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, . . . ) " .:t i t i " . .; ..... - .......... _....._- ......................; _.......... i ....... ;---- -7 --_ i • "] -
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i _ i i i _ _ ......_.V...'__0.040000 GHz _0,000000
Figure 9: Forward Transmission of package 002
S:li FOR_A_ FLEr'3..ECTIC_
l ..................i...........i........'.........._-'"..............I..........i..........I .......1! ! i ] i ! i !I
! I t ,-" t ; _ I" .,_ ; _ I ; _ ,
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l t t i
Y77-7:,,:i-i........]........i i /Ii---", - ,"'--i 7.... --r--......'--i .......' ! " •
.t.1.-/----!]I---Ii --tl....... r-:----'-i ...... 2.1 i . !,---/---71i_......... -r .... _"--_ ;
_ __ _ . _ " _ i i _ i ,_;/..... L....... I........ 7 ..L..:.._..__ ............. ..:,._i ..... 7--..I..... ,..... .,.,,-,
0.040000 , 6h_ 40.000000
Figure 10: Forward reflection of package 002
Princeton Microwave Technology Inc. 16
NASA MMIC PACKAGE
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2.000 dB/DIV
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LOGNAGNITUDE REF=0.000 dB "
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0.040000 GHz 40.000000
Figure 11: Forward Transmission of package 003
LOG _AGXITUI)Z RT._=0.000dB !0.000dB/DIV
............7......."---7--_ .......{----_
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I _ i i I...................._ ..........."_...... _............................ .._....... _........ .-.........
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0.040000 61_ _0.000000
Figure 12: Forward reflection of package 003
Princeton Microwave Technology Inc. 17
NASA MMIC PACKAGE
2.6 MMIC Amplifier insertion into Package
Three different MMIC amplifiers were assembled into the MMIC package. The first NIMIC was a 2.4
dB noise figure, low noise amplifier made by Texas Instruments. The amplifier requires a single bias
for operation. The second amplifier was LMA422 fom Litton Industries, with a gain of 20 dB. Both
amplifiers are designed for the 28 GHz LMDS bands. The third amplifier measured was a HP
distributed amplifier which has a gain of 8 dB from 2 to 26.5 GHz.
All three MMICs were epoxy attached in the package and connected to the package input and output
using 0.8 nail gold wire.
Figure 13 shows the measured performance of the TI low noise amplifier.
Figure 14 shows the measured performance of the Litton MMIC amplifier.
Figure 15 shows the measured performance of the HP MMIC amplifier.
The measured performance of the amplifiers demonstrate the wideband performance of the MMIC
package.
The photograph below shows a MMIC mounted into a package.
Princeton Microwave Technology Inc. 18
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NASA MMIC PACKAGE
2.7 t)ackage Layout
The drawing below details the package layout.
I
t
t
.
_o
_i_ ¸W_ _ Z
_ _Z
_ WMMM
_ v
!,!i-7"_i
.(
3
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"1_io !13! +"_ 171
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Princeton Microwave Technology Inc. 21
NASAMMICPACKAGE
2.8 Package Data Sheet
Princeton Microwave Technology has begun the marketing of the MM]C package. The preliminary
data sheet is detailed below.
PRINCETON MICROWAVE TECI_NOLOGY, _NC.3Nami Lane, Unit C-10, Mercerville, NJ 08619
Tel: (609 586-8140)
FAX: (609) 586-1231
C [P,._flC WALL CC_R,_£O
LMDS PACKAGE _a_ w,_:c_Jg_T[
FEATURES: _c_PRCC_._E0
• Low Cost coN_croas
• DC-32.GHz Operation• Insertion Loss < 1.0 dB/Transition• Remm Loss > 15 dB
• 50-ohm Input/Output Ports• lODCI/OPorts
• Hermetically Sealable _p_c \\\\ _v'//_.• High Thermal Efficiency _wr_u _-_V/r// '\
_I_T._L• Cavity Size (125 x 70 mils)* a_
• Low RE Leakage/Radiation 0.044 o.o160.034• Gold Plated Copper Tungsten Base 4, 4 4,
• Cavity size can be customized -f--Ii," c.:_,._ ,I/
PMT-401125 Transmission Characteristics (Both I/O Transitions)
--7 j i7---i
0.040000
'.. _FEF_
OPTIONS:
• More Than Two RF Ports
• Locations of RF/dO Ports
• Multi-Cavity Package with High RF Isolations
• Multichip Module Configurations with High RF Isolations
• Thickness and the material of the cover can be specified
Princeton Microwave Technology Inc. 22
NASA MMIC PACKAGE
3.0
CONCLUSIONS
Princeton Microwave Technology has successfully demonstrated the transfer of technology for the
MMIC package developed under contract No. NAS3-25486. During this contract the package design
was licensed from Hughes Aircraft Company for manufacture within U.S. A low cost hermetically
sealable, high performance package has been manufactured with a typical insertion loss of less than 1
dB per transition up to 32 GHz and a return loss better than 15 dB. The low cost package can
encompass a large number of existing MMICs with a size of 100 mils by 50 mils. The performance of
the package has been demonstrated by assembling three different MMIC amplifiers into the package
and measuring their performance. Two of the MMIC amplifiers, designed for the Local Microwave
Distribution System, LMDS, at 26 GHz to 30 GHz exhibited measured data consistent with the device
data. The third MMIC amplifier was a broadband distributed amplifier for the DC to 26 GHz
bandwidth. The measured performance of the amplifiers showed good performance upto 27 GHz.
The measured performance of the package, when used with an alumina 50 Ohm line, does show
resonances within the band, as detailed in Figures 7 through 12. However in the broadband amplifier
measurements the resonances were not observed, and maybe due to the loading of the cavity with a
higher dielectric constant of CraAs.
Preliminary prices from the manufacturer for a higher quantity has been obtained. In quantities of
25,000 pieces the package price will be under $2.00. For a quantity of 1000 pieces the price of the
package will be under $5.00. In conclusion a low cost MMIC package has been manufactured. The
main effort in this program was focused on procuring the ceramic material with the right
characteristics. The continuing development and manufacturing of the MMIC package will involve this
type of interaction, between the package manufacturer and design center.
The MMIC package is presently being marketed in the US and will be made available to NASA and
other users.
Princeton Microwave Technology Inc. 23
NASA MMIC PACKAGE
• ::?
REFERENCES:
[1] Private communication between Mr. Steve Yuan and University of Michigan
[2] Non-Destructive Permittivity Measurement of Substratcs.
G. Kent. GDK Products .1995 Stanley Road, Cazenovia, NY 13035
Princeton Microwave Technology Inc. 24
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Form ApprovedREPORT DOCUMENTATION PAGE OMBNo.0704-0188
Public reporting burden for this collection of information is estimated to average 1 hour per response, including the time for reviewing instructions, searching existing data sources,
gathering end maintaining the data needed, and completing and reviewing he collection of information. Send comments regarding this burden estimate or any other aspect of this
collection of information, including suggestions for reducing this burden, to Washington Headquarters Services, Directorate for Information Operations and Reports, 1215 Jefferson
Davis Highway, Suite 1204, Arlington, VA 22202-4302, end to the Office of Management end Budget, Paperwork Reduction Project (0704-0188), Washington, DC 20503.
1. AGENCY USE ONLY (Leave blank) 2. REPORT DATE
JULY 25, 1997
4. TITLE AND SUBTITLE
MMIC Package for Millimeter Wave Frequency
6. AUTHOR(S)
Sarjit Singh Bharj and Steve Yuan
7. PERFORMING ORGANIZATION NAME(S) AND ADDRESS(ES)
Princeton Microwave Technology, Inc.
3 Nami Lane
Unit (2-10
Mercerville, NJ 08619
9. SPONSORING/MONITORING AGENCY NAME(S) AND ADDRESS(ES)
National Aeronautics and Space Administration
Lewis Research Center
Cleveland, Ohio 44135-3191
3. REPORT TYPE AND DATES COVERED
Final Contractor Report5. FUNDING NUMBERS
WU-323-79-02
C-NAS3-27813
8. PERFORMING ORGANIZATION
REPORT NUMBER
E-10801
10. SPONSORING/MONITORING
AGENCY REPORT NUMBER
NASA CR-204131
11. SUPPLEMENTARYNOTES
Project Manager, Gerald J. Chomos, Communications Technology Division, NASA Lewis Research Center, organization
code 5640, (216) 433-3485.
12a. DISTRIBUTION/AVAILABILITY STATEMENT
Unclassified - Unlimited
Subject Category 33
This publication is available from the NASA Center for AeroSpace Information, (301) 621--0390.
12b. DISTRIBUTION CODE
13. ABSTRACT (Maximum 200 words)
Princeton Microwave Technology has successfully demonstrated the transfer of technology for the MMIC package
developed under contract No. NAS3-27813. During this contract the package design was licensed from Hughes Aircraft
Company for manufacture within the U.S. A major effort was directed towards characterization of the ceramic materialfor its dielectric constant and loss tangent properties. After selection of a ceramic tape, the high temperature co-fired
ceramic package was manufactured in the U.S. by Microcircuit Packaging of America, Inc. Microwave measurements of
the MMIC package were conducted by an intercontinental microwave test fixture. The package demonstrated a typicalinsertion loss of 0.5 dB per transition up to 32 Ghz and a return loss of better than 15 db. The performance of the package
has been demonstrated from 2 to 30 Ghz by assembling three different MMIC amplifiers. Two of the MMIC amplifiers
were designed for the 26 Ghz to 30 Ghz operation while the third MMIC was a distributed amplifier from 2 to 26.5 Ghz.
The measured gain of the amplifier is consistent with the device data. The package costs are substantially lower than
comparable packages available commercially. Typically the price difference is greater than a factor of three. The packagecost is well under $5.00 for a quantity of 10,000 pieces.
14. SUBJECT TERMS
MMIC package; Millimeter wave
17. SECURITY CLASSIFICATION 18. SECURITY CLASSIFICATION
OF REPORT OF THIS PAGE
Unclassified Unclassified
NSN 7540-01-280-5500
19. SECURITY CLASSIFICATION
OF ABSTRACT
Unclassified
15. NUMBER OF PAGES
25
16. PRICE CODE
AO3
20. LIMITATION OF ABSTRACT
Standard Form 298 (Rev. 2-89)
Prescribed by ANSI Std. Z39-18298-102
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