gtk cooling summary of frame and cooling plate shear tests alessandro mapelli michel morel jerome...

GTK Cooling Summary of frame and cooling plate

Shear tests

Alessandro MapelliMichel MorelJerome NoelGeorg Nüßle

Paolo PetagnaGiulia Romagnoli

GigaTracKer Working Group MeetingOctober 9th , CERN

Pictures taken in ambient environment between 24°C and 28°C

Baseline Frame

Silicon Heater – Painted Black

Pictures taken in ambient environment between 24°C and 28°C

Baseline Frame

Silicon Heater – Painted Black

Baseline Frame

Mass flow 10 g/sMass flow 8 g/s

40°C

15°C

Silicon Heater – No Power

Baseline Frame

Mass flow 10 g/sMass flow 8 g/s

40°C

15°C

Silicon Heater – No Power

Baseline Frame

Mass flow 10 g/sMass flow 8 g/s

40°C

15°C

Silicon Heater – Nominal Power

~ 25 °C

Baseline Frame

Mass flow 10 g/sMass flow 8 g/s

40°C

15°C

Silicon Heater – Nominal Power

Baseline Frame

Mass flow 10 g/sMass flow 8 g/s

40°C

15°C

Silicon Heater – Full Power

Silicon Heater – Full Power

Baseline Frame

Mass flow 10 g/sMass flow 8 g/s

40°C

15°C

(b)R/O chips

Sensitive Area

Silicon

R/O chips

DT with respect to INLET temperature

BANANA FRAME

BANANA:

+ Better thermal performance:Central sensor area has lowest temperatureAll sensor area @ Tin< 0 °C already at Tin= -15 °C(worst case scenario)

+ Can stand much higher “analog power” if needed

o Works well with 100 mm thick chip (total Si in sensitive area = 430 mm )

- Higher cost- More difficult construction- More difficult integration with “Sensor

Assembly” (chip/sensor planarity issues)- Higher hydraulic pressure (factor ~ 2)

FRAME:

- Poorer thermal performance:Central sensor area has highest temperatureRequires Tin< -25 °C to keep sensor @ T< 0 °C

(worst case scenario)- Cannot stand higher “analog power” if needed

o Works with 200 mm thick chip (total Si insensitive area = 400 mm )

+ Lower cost+ Easier construction+ Easier integration with “Sensor Assembly”

(chip/sensor planarity issues much less relevant)+ Lower hydraulic pressure (factor ~ 2)

Frame and Banana - Pros and Cons

PT100 sensors

Mass flow 7 g/sNominal power

Baseline – Long Run

~ 7 hours

Shear test with irradiated samples NA62 - DIPTEM Genova – UCL

5-09-2012

Shear tests with four different adhesive types:

Adhesive tape

NITTO DENKO 30 µm thick

Adhesive tape

3M 9461P – 30 µm thick

Liquid glue

Araldite 2020

Adhesive film

FastelFilm 30 µm thick

• Polyester film double coated by acrylic adhesive

• Polyester = 0.13-0.15 W/m K

Acrilyc = 0.2 W/m K

• 3M Adhesive 100 (Acrylic adhesive)

• 3M Adhesive 100 = 0.178 W/m K

• Two components epoxy liquid glue

• Epoxy = 0.188 W/m K

• EVA (Ethylene - vinyl Acetate) adhesive film

• EVA = 0.34 W/m K

⁻ Surface cleaning with acetone

⁻ 1 Kg for 65 hours

- Surface cleaning with acetone

- 1 Kg for 3 minutes- 80 °C in the oven (weight

and plate already hot)

⁻ Surface cleaning with acetone

⁻ Vacuum outgassing after mixing the component

⁻ Dispensing with a slice

⁻ Surface cleaning with acetone

⁻ 1 Kg for 65 hours

Silicon samples

Silicon samples 10 x 10 mm with wafers 525 µm thick

Silicon

glue

Silicon

Araldite: 25 samplesFastelFilm: 25 samplesNittoDenko: 25 samples3M: 25 samples

IrradiationIrradiation levels (1 MeV eq. neutron/cm^2):

- No irradiation- 3 x 10 13 : 27 seconds- 1 x 10 14 nominal : 91 seconds- 1 x 10 15 : 910 seconds

Heated a few degrees but no temperature mesurement!

Stainless steel tool to performe the shear force on the samples

Working set up

The tool has been inserted between the two plates of the machine

NittoDenko

3M

Fastelfilm

Araldite

New scale for the graphs! Values

higher than for the other adhesives!!!

Always tested the silicon!!!!

Results:

- Nitto Denko OUT (no resistence at the highest radiation) - FasterlFilm OUT (melts at the highest radiation)

- Araldite IN (it’s the best solution)

- 3M IN (back-up in case Araldite will be too rigid)

Future tests:- Thermal tests with temperature cycles to see the stresses in the glues (Araldite and 3M)

Coming up…

- Long run test (cycled) for Banana e Frame

- Thermal test with separated chip mock-ups for Frame (irrelevant for Banana) 200 micron thick

- Thermal test with separated chip mock-ups for Frame 150 micron thick [is 150 micron enough for Frame in NOMINAL condition (NOT max power)?]

- Launch wirebond tests (check of Jig1, production of Jig2 and Jig3: pending technical help to replace Jerome. Discussion ongoing inside PH/DT)

- Request: obtain from IZM prototype assemblies with correct thickness (chip and sensor) in order to work “hands-on” on cold assembly integration!

Supply of silicon micro-fluidic devices

• Price Enquiry DO-27627/PH was sent out on July 26th and closed on August 22nd

• IceMOS was selected on September 2nd

• On September 17th, IceMOS went from 5th to 2nd in terms of price due to an internal error. The cost dropped from $54’125 to $43’575.

• Purchase order CA5067134 was sent on October 2nd

• We are now defining the layout and fabrication process with Adele Gilliland, who is the Applications Engineering Manager. She will be leading the engineering work on the NA62 project at IceMOS.