gs1011 - lestina · 2016. 7. 8. · gs2011功耗参数 parameter gs2011m comments hibernate current...
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http://www.gainspan.com
Ganspan是Intel 投资的美国半导体公司,专业开发出成熟的低功耗wifi晶片,内置了国际上通用的各种网络协议,并且适应
市场需求,推出了Wifi模组的整体解决方案。
如果使用Gainspan的通用方案开发产品,客户只需要使用串口或其他接口,通过AT命令来控制Gainspan模组即可,大大缩短
wifi功能的开发周期,目前可以支持漫游,自动连接,点对点,LimitAP等功能,支持Deepsleep,Standby的低功耗模式。
GS1011芯片内部方块图
• WLAN ARM 7
- Wi-Fi Radio, PHY, MAC, 128KB Flash
• Networking Services ARM7
- 256KB Flash
• Peripherals
• RTC and Power Management
GS1011M Module Family:
FeaturesLow Power(GS1011MI)
Extended Range(GS1011ME)
802.11b/g/n(GS1500M)
Size 22.8 mm x 32.5 mm 22.8 mm x 36.8 mm 22.8 mm x 36.8 mm
No. of Pins 48 48 48
SMT Solder down Solder down Solder down
RF Output 8dBm 18dBm 18dBm
Antenna Options Trace or Ext Antenna (u.FL) Trace or Ext Antenna (u.FL) Trace or Ext Antenna (u.FL)
Data Rates 802.11 b 802.11 b 802.11 b/g/n
I/O SPI, UART, I2C, GPIO, A/D SPI, UART, I2C, GPIO, A/D SPI, UART, I2C, GPIO, A/D
Certifications FCC, ETSI, IC, Wi-Fi FCC, ETSI, IC, Wi-Fi FCC, ETSI, IC, Wi-Fi
Operating Temp -40 ºC to 85 ºC -40 ºC to +85 ºC -40 ºC to +85 ºC
Host Connection UART, SPI UART, SPI UART, SPI
GS1011M 功耗参数
System State Voltage Current Power Wake up Latency
Standby 1.2V – 3.6V < 5uA < 0.018mW 13 ms
Deep Sleep 1.8V 110uA 0.19mW 10 ms
Processor Sleep 1.8V 7.2mA 13mW <1 us
APP CPU @ 22MHz (FLASH)
1.8V 17.2mA 31mW <0.5us
WLAN CPU @ 22MHz (FLASH)
1.8V 21.5mA 38.8mW <0.5us
Receive 1.8V 144mA 260mW N/A
Transmit (Internal PA +8dBm)
1.8V 192mA 345mW N/A
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Typical Application: Healthcare and Fitness, Audio and Video, Smart Energy, Industrial, Commercial, Smart Home
Transmitter: Wi-Fi Station/client mode, Wi-Fi AP mode, Beacon mode (encrypted data via beacons or probe requests), and Wi-Fi
Direct; Distance: 430meters (Internal PA), 750meters(External PA);
GS2100M Module Family
FeaturesGS2100MIP/MIE
(GS2101MIP/MIE)*Features
GS2100MIP/MIE (GS2101MIP/MIE)*
Size (W x L) Height18mm x 25mm
2.5mmHost Connections UART, SPI, SDIO
No. of Pins 40 Internal Flash 2MB
SMT Solder down Operating Voltage 2.7-3.6V
RF Output15dBm (802.11b) 11dBm
(802.11n)I/O Voltage 2.7-3.6V
Antenna OptionsPCB/Trace – GS2100MIP
External (u.FL) – GS2100MIEVBAT 1.6-3.6V
Data Rates 802.11b/g/n Operating Temp -40℃ to +85℃
I/OSPI, UART,SDIO, I2C,GPIO,
A/D (16 bit)Certifications
FCC, ETSI, IC, TELEC Wi-Fi, WPS 2.0, Wi-Fi Direct, SEP 2.0,
ZigBee IP/SEP 2.0*
GS2000 – Internet of Things Multimode SoC
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GS2011M Module Family:
FeaturesGS2011MIZ/MIE
(GS2012MIZ/MIE)*GS2011MIPS/MIES
(GS2012MIPS/MIES)*GS2011MEPS/MEES
(GS2012MEPS/MEES)*
Size (W x L) 22.8 x 32.5x3.63mm (shield) 19.4x 28.7x3.35mm 19.4 x 28.73.35mm
Pins 49 37 37
SMT Solder down Solder down Solder down
RF Output15dBm (802.11b) 11dBm (802.11n)
15dBm (802.11b) 11dBm (802.11n)
20dBm (802.11b) 16dBm (802.11n)
Antenna Options Chip/Ceramic – GS2011MIZ External (u.FL) – GS2011MIE
PCB/Trace – GS2011MIPS External (u.FL) –GS2011MIES
PCB/Trace – GS2011MEPS External (u.FL) – GS2011MEES
Data Rates 802.11b/g/n 802.11b/g/n 802.11b/g/n
I/O SPI, UART,SDIO, I2C,
I2S,GPIO, A/D (12 bit), JTAG SPI, UART,SDIO, I2C, I2S,GPIO, A/D (12
bit)SPI, UART,SDIO, I2C, I2S,GPIO,
A/D (12 bit)
Connections UART, SPI, SDIO UART, SPI, SDIO UART, SPI, SDIO
Internal Flash 4MB 2MB 2MB
Op Voltage 2.7-3.6V 2.7-3.6V 2.7-3.6V
I/O Voltage 1.8V, 3.0V, or 3.3V (±10%) 1.8V, 3.0V, or 3.3V 2.7-3.6V
VBAT 1.6-3.6V 1.6-3.6V 1.6-3.6V
Op Temp -40 ºC to +85 ºC -40 ºC to +85 ºC -40 ºC to +85 ºC
CertificationsFCC, ETSI, IC, TELEC, Wi-Fi, WPS 2.0, Wi-Fi Direct, ZigBee
IP/SEP 2.0*
FCC, ETSI, IC, TELEC, Wi-Fi, WPS 2.0, Wi-Fi Direct, ZigBee IP/SEP 2.0*
FCC, ETSI, IC, TELEC, Wi-Fi, WPS 2.0, Wi-Fi Direct, ZigBee
IP/SEP 2.0*
GS2011功耗参数
Parameter GS2011M Comments
Hibernate Current 0.26μA Event wake up only, 1KB NVSRAM
Standby Current 2.4μARTC wakeup and Alarm/External event wakeup, 1KB
NVSRAM
Standby Current 3.6μARTC wakeup and Alarm/External event wakeup, 5KB
NVSRAM
Standby Current 8μARTC wakeup and Alarm/External event wakeup, 17KB
NVSRAM
Deep Sleep – GEPS 5.1.0 560uA All SRAM, CPU’s, and Crypto block enabled
Deep Sleep – GEPS 5.1.1 440uA All SRAM, CPU’s, and Crypto block enabled
Rx Wi-Fi Current 45mA 1.2-3.6V @ SOC
Rx Total SoC Current 95mA TCP/UDP, 2x CPU’s @80MHz
Tx Current 268mA 17dBm, 1Mb/s, 2x CPU’s @80MHz
Tx Current 220mA 15dBm, 1Mb/s, 2x CPU’s @80MHz
Hostless Start Time ~10ms 2x CPU’s at 80MHz. Serial to Wi-Fi is 14ms
CPU Boot Time ~1.25ms
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GS2200 Series ---- Small size module
Features GS2200MIZ
Size (W x L x H) 14 mm x 18mm x 2.2mm (shield)
Pins 66
SMT Solder down
RF Output14dBm (802.11b 1Mbps) 13dBm (802.11n 6Mbps)12dBm (802.11n MSC0)
Antenna Options Ceramic chip
Data Rates 802.11b/g/n
I/O SPI, UART,SDIO, I2C, I2S,GPIO, 12bitA/D, 16bit AD or DAC,JTAG
Connections UART, SPI, SDIO
Internal Flash 4MB
Operating Voltage 3.0-3.6V
I/O Voltage 1.8V, 3.0V, or 3.3V (±10%)
VBAT 1.6-3.6V
Operating Temp -20 ºC to +70 ºC
Certifications FCC, ETSI, IC, TELEC, Wi-Fi
GS2000 Multimode Connectivity ExampleIP Everywhere (2.4GHz)
802.11b/g/n – Wi-Fi802.15.4 – ZigBee IP
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