freescales redistributed chip packaging (rcp) … as dan hutcheson, ceo of vlsi research inc....
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TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
FTF-ENT-F0812
Freescales Redistributed Chip Packaging (RCP) Ready for Production
June, 2010
Navjot ChhabraRCP Operations Manager
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 2
Introduction
As Dan Hutcheson, CEO of VLSI Research Inc. recently wrote, “Not far away in Tempe, at Freescale’s Packaging Systems Laboratory, an even more revolutionary packaging technology has been developed. Freescale calls it RCP for Redistributed Chip Package. I think they should rename it to Revolutionary Chip Package because what I’ve seen has led me to believe it will upend the entire way electronics are made in the future.”
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 3
► Understand and apply the RCP package technology toward the following attributes:
• Package size• Package performance• Multi-die in package solutions• Integrated stacked packages• 3D Integrated packaging• System in package• Convergence of 3D IC and RCP technology
Objective
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 4
► Redistributed Chip Packaging (RCP) overview
► RCP roadmap
► Reliability and technology certification
► Development activities underway
► Providing solutions to customers
► Summary
Agenda
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 55
13x13mmMBGA
9x9mmRCP
280-I/O• On average - 30% area reduction• Eliminates wirebonds & substrate• Maintain same ball pitch or smaller• 30% thinner than standard BGA
Three Key Benefits of RCP
►Miniaturization
►Integration
►Elimination
• Multiple die - any device technology• Die PLUS peripherals in package• PoP any packaging technology• SMT components on top• Replace motherboard - PCB
45x90mm
440 peripheral components10 layer PCB
30x30mm
86 Embedded peripheral components36 SMT peripheral components122 total peripheral componentsDoes not include PA or power FETS3-4 layer PCB required for HIF
3G-UMTSRadio
~75% reduction in area~70% peripheral components eliminated!
(animated slide)
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 6
RCP Industry Thrust
►System in package – Addresses a potentially large need in the market and is being recognized as the next industry thrust• Heterogeneous integration
• System miniaturization
• System performance
• System cost
• High speed in package computing
• System flexibility (Chip sourcing, integration)
• Block testability
• Path to integrating with 3D IC
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 77
QFP
Freescale Packaging Technology Landscape
RCP3D Packaging
QFN
Flip Chip BGA
Wire bond BGAs
RF Module-HDI
PQFNMPC8370QAC0703
Com
plex
ity
Integration
TEPBGA II
TBGA
RCP SiP
Stacked DieTSV
PoPRCP
Single Die
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 8
Convergence of 3D IC with RCP Integrated Systems
Substrate Based Module
WL-CSP
Fan out 1LM small pkg. (≤ 8x8)
RCP Multi-die/Modules
3D IC TSV. Integrated with
RCP
3D ICTSV.Differentiated
die
3D IC face-to-face
PoP
Stacked die
3D IC TSV. Stacked memory
RCP (1LM – 6 LM, 3x3 to 40x40mm pkg.)
RCP Stacked multi-die modules (2-5 layers).
RCP Integrated Systems (Sensors,
MEMS, Analog, Digital, Image,
Memory, RF, optical)
Highly integrated,
performance app’s. (3D +
RCP Systems)
RCP Die to Die Integrated Package
-Courtesy of 3D Plus
*
*
*
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 99
Freescale’s Redistributed Chip Package►Cost competitive, high productivity,
large area batch processEliminates package substrateEliminates gold wire bonds / C4 bumps
►High performance packageReduced electrical parasiticsHigher frequency response
►Ultra Low-k Compatible (<90 nm MLM)Compliant with advance Si technology
►Pb-free, Halogen free, ROHS compliant
►Single chip, multiple chip and embedded component capability
►3D IC Enabling with System Integration roadmap
►Certified to JEDEC/FSL Commercial and Industrial Level Reliability
300 mm round panel9 x 9 mm packages
258 IO, 0.5 mm pitch716 packages/panel
2 layer build-up
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 1010
►Process steps• Die placed face down on tape
mounted carrier• Non-compression encapsulant
applied over die• Low temperature cure of
encapsulant and de-tape• Panel buildup with dielectric and Cu
redistribution• Panel bumped after final dielectric
layer applied
Pre-tested dieMold frame
Carrier
Die place onto carrier tape face down prior to encapsulation.
Panel encapsulation
CarrierTape
Mold frame removed, panel separated from carrier, ready to de-tape
Solder bumpCu interconnect
Encapsulant Die
Cu via
Panel cross-section after build up process and bump applied Animated Build-up Process
RCP Process
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 1111
►Process steps• Die placed face down on tape
mounted carrier• Non-compression encapsulant
applied over die• Low temperature cure of
encapsulant and de-tape• Panel buildup with dielectric and Cu
redistribution• Panel bumped after final dielectric
layer applied
Pre-tested dieMold frame
Carrier
Die place onto carrier tape face down prior to encapsulation.
Panel encapsulation
CarrierTape
Mold frame removed, panel separated from carrier, ready to de-tape
Solder bumpCu interconnect
Encapsulant Die
Cu via
Panel cross-section after build up process and bump applied Animated Build-up Process
RCP Process
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 1212
►Process steps• Die placed face down on tape
mounted carrier• Non-compression encapsulant
applied over die• Low temperature cure of
encapsulant and de-tape• Panel buildup with dielectric and Cu
redistribution• Panel bumped after final dielectric
layer applied
Pre-tested dieMold frame
Carrier
Die place onto carrier tape face down prior to encapsulation.
Panel encapsulation
CarrierTape
Mold frame removed, panel separated from carrier, ready to de-tape
Solder bumpCu interconnect
Encapsulant Die
Cu via
Panel cross-section after build up process and bump applied Animated Build-up Process
RCP Process
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 1313
►Process steps• Die placed face down on tape
mounted carrier• Non-compression encapsulant
applied over die• Low temperature cure of
encapsulant and de-tape• Panel buildup with dielectric and Cu
redistribution• Panel bumped after final dielectric
layer applied
Pre-tested dieMold frame
Carrier
Die place onto carrier tape face down prior to encapsulation.
Panel encapsulation
CarrierTape
Mold frame removed, panel separated from carrier, ready to de-tape
Solder bumpCu interconnect
Encapsulant Die
Cu via
Panel cross-section after build up process and bump applied Animated Build-up Process
RCP Process
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 1414
►Process steps• Die placed face down on tape
mounted carrier• Non-compression encapsulant
applied over die• Low temperature cure of
encapsulant and de-tape• Panel buildup with dielectric and Cu
redistribution• Panel bumped after final dielectric
layer applied
Pre-tested dieMold frame
Carrier
Die place onto carrier tape face down prior to encapsulation.
Panel encapsulation
CarrierTape
Mold frame removed, panel separated from carrier, ready to de-tape
Solder bumpCu interconnect
Encapsulant Die
Cu via
Panel cross-section after build up process and bump applied
Animated Build-up Process
RCP Process
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 1515
►Process steps• Die placed face down on tape
mounted carrier• Non-compression encapsulant
applied over die• Low temperature cure of
encapsulant and de-tape• Panel buildup with dielectric and Cu
redistribution• Panel bumped after final dielectric
layer applied
Pre-tested dieMold frame
Carrier
Die place onto carrier tape face down prior to encapsulation.
Panel encapsulation
CarrierTape
Mold frame removed, panel separated from carrier, ready to de-tape
Solder bumpCu interconnect
Encapsulant Die
Cu via
Panel cross-section after build up process and bump applied Animated Build-up Process
RCP Process
Rotate 180 Degrees
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 1616
►Process steps• Die placed face down on tape
mounted carrier• Non-compression encapsulant
applied over die• Low temperature cure of
encapsulant and de-tape• Panel buildup with dielectric and Cu
redistribution• Panel bumped after final dielectric
layer applied
Pre-tested dieMold frame
Carrier
Die place onto carrier tape face down prior to encapsulation.
Panel encapsulation
CarrierTape
Mold frame removed, panel separated from carrier, ready to de-tape
Solder bumpCu interconnect
Encapsulant Die
Cu via
Panel cross-section after build up process and bump applied Animated Build-up Process
RCP Process
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 1717
►Process steps• Die placed face down on tape
mounted carrier• Non-compression encapsulant
applied over die• Low temperature cure of
encapsulant and de-tape• Panel buildup with dielectric and Cu
redistribution• Panel bumped after final dielectric
layer applied
Pre-tested dieMold frame
Carrier
Die place onto carrier tape face down prior to encapsulation.
Panel encapsulation
CarrierTape
Mold frame removed, panel separated from carrier, ready to de-tape
Solder bumpCu interconnect
Encapsulant Die
Cu via
Panel cross-section after build up process and bump applied Animated Build-up Process
RCP Process
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 1818
►Process steps• Die placed face down on tape
mounted carrier• Non-compression encapsulant
applied over die• Low temperature cure of
encapsulant and de-tape• Panel buildup with dielectric and Cu
redistribution• Panel bumped after final dielectric
layer applied
Pre-tested dieMold frame
Carrier
Die place onto carrier tape face down prior to encapsulation.
Panel encapsulation
CarrierTape
Mold frame removed, panel separated from carrier, ready to de-tape
Solder bumpCu interconnect
Encapsulant Die
Cu via
Panel cross-section after build up process and bump applied Animated Build-up Process
RCP Process
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 1919
►Process steps• Die placed face down on tape
mounted carrier• Non-compression encapsulant
applied over die• Low temperature cure of
encapsulant and de-tape• Panel buildup with dielectric and Cu
redistribution• Panel bumped after final dielectric
layer applied
Pre-tested dieMold frame
Carrier
Die place onto carrier tape face down prior to encapsulation.
Panel encapsulation
CarrierTape
Mold frame removed, panel separated from carrier, ready to de-tape
Solder bumpCu interconnect
Encapsulant Die
Cu via
Panel cross-section after build up process and bump applied Animated Build-up Process
RCP Process
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 2020
►Process steps• Die placed face down on tape
mounted carrier• Non-compression encapsulant
applied over die• Low temperature cure of
encapsulant and de-tape• Panel buildup with dielectric and Cu
redistribution• Panel bumped after final dielectric
layer applied
Pre-tested dieMold frame
Carrier
Die place onto carrier tape face down prior to encapsulation.
Panel encapsulation
CarrierTape
Mold frame removed, panel separated from carrier, ready to de-tape
Solder bumpCu interconnect
Encapsulant Die
Cu via
Panel cross-section after build up process and bump applied Animated Build-up Process
RCP Process
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 2121
►Process steps• Die placed face down on tape
mounted carrier• Non-compression encapsulant
applied over die• Low temperature cure of
encapsulant and de-tape• Panel buildup with dielectric and Cu
redistribution• Panel bumped after final dielectric
layer applied
Pre-tested dieMold frame
Carrier
Die place onto carrier tape face down prior to encapsulation.
Panel encapsulation
CarrierTape
Mold frame removed, panel separated from carrier, ready to de-tape
Solder bumpCu interconnect
Encapsulant Die
Cu via
Panel cross-section after build up process and bump applied Animated Build-up Process
RCP Process
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 2222
►Process steps• Die placed face down on tape
mounted carrier• Non-compression encapsulant
applied over die• Low temperature cure of
encapsulant and de-tape• Panel buildup with dielectric and Cu
redistribution• Panel bumped after final dielectric
layer applied
Pre-tested dieMold frame
Carrier
Die place onto carrier tape face down prior to encapsulation.
Panel encapsulation
CarrierTape
Mold frame removed, panel separated from carrier, ready to de-tape
Solder bumpCu interconnect
Encapsulant Die
Cu via
Panel cross-section after build up process and bump applied Animated Build-up Process
RCP Process
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 2323
►Process steps• Die placed face down on tape
mounted carrier• Non-compression encapsulant
applied over die• Low temperature cure of
encapsulant and de-tape• Panel buildup with dielectric and Cu
redistribution• Panel bumped after final dielectric
layer applied
Pre-tested dieMold frame
Carrier
Die place onto carrier tape face down prior to encapsulation.
Panel encapsulation
CarrierTape
Mold frame removed, panel separated from carrier, ready to de-tape
Solder bumpCu interconnect
Encapsulant Die
Cu via
Panel cross-section after build up process and bump applied Animated Build-up Process
RCP Process
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 2424
►Process steps• Die placed face down on tape
mounted carrier• Non-compression encapsulant
applied over die• Low temperature cure of
encapsulant and de-tape• Panel buildup with dielectric and Cu
redistribution• Panel bumped after final dielectric
layer applied
Pre-tested dieMold frame
Carrier
Die place onto carrier tape face down prior to encapsulation.
Panel encapsulation
CarrierTape
Mold frame removed, panel separated from carrier, ready to de-tape
Solder bumpCu interconnect
Encapsulant Die
Cu via
Panel cross-section after build up process and bump applied Animated Build-up Process
RCP Process
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 2525
►Process steps• Die placed face down on tape
mounted carrier• Non-compression encapsulant
applied over die• Low temperature cure of
encapsulant and de-tape• Panel buildup with dielectric and Cu
redistribution• Panel bumped after final dielectric
layer applied
Pre-tested dieMold frame
Carrier
Die place onto carrier tape face down prior to encapsulation.
Panel encapsulation
CarrierTape
Mold frame removed, panel separated from carrier, ready to de-tape
Solder bumpCu interconnect
Encapsulant Die
Cu via
Panel cross-section after build up process and bump applied Animated Build-up Process
RCP Process
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 2626
►Process steps• Die placed face down on tape
mounted carrier• Non-compression encapsulant
applied over die• Low temperature cure of
encapsulant and de-tape• Panel buildup with dielectric and Cu
redistribution• Panel bumped after final dielectric
layer applied
Pre-tested dieMold frame
Carrier
Die place onto carrier tape face down prior to encapsulation.
Panel encapsulation
CarrierTape
Mold frame removed, panel separated from carrier, ready to de-tape
Solder bumpCu interconnect
Encapsulant Die
Cu via
Panel cross-section after build up process and bump applied Animated Build-up Process
RCP Process
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 2727
►Process steps• Die placed face down on tape
mounted carrier• Non-compression encapsulant
applied over die• Low temperature cure of
encapsulant and de-tape• Panel buildup with dielectric and Cu
redistribution• Panel bumped after final dielectric
layer applied
Pre-tested dieMold frame
Carrier
Die place onto carrier tape face down prior to encapsulation.
Panel encapsulation
CarrierTape
Mold frame removed, panel separated from carrier, ready to de-tape
Solder bumpCu interconnect
Encapsulant Die
Cu via
Panel cross-section after build up process and bump applied Animated Build-up Process
RCP Process
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 2828
►Process steps• Die placed face down on tape
mounted carrier• Non-compression encapsulant
applied over die• Low temperature cure of
encapsulant and de-tape• Panel buildup with dielectric and Cu
redistribution• Panel bumped after final dielectric
layer applied
Pre-tested dieMold frame
Carrier
Die place onto carrier tape face down prior to encapsulation.
Panel encapsulation
CarrierTape
Mold frame removed, panel separated from carrier, ready to de-tape
Solder bumpCu interconnect
Encapsulant Die
Cu via
Panel cross-section after build up process and bump applied Animated Build-up Process
RCP Process
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 292929
Metal 1 layer
RCP Build-Up Process
Metal 2 layer
BGA
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 30
3030
►Multiple redistribution layers• Allows for higher routing complexities, greater I/O
►Package Shrink• Improved via/line/spacing over HDI substrate
►Performance• Low contact resistance via structure (Rvia<25mOhm)
►Die shrink• Design for RCP
►Decrease in iterative design cycle• RCP build up pizza mask
►Integration• Multi-Die SiP • 3D Double sided build up• Stacked• Integrated passives
Attributes of the RCP Technology
RCP-LTE29x9mm-I.275BB
Single die versionI/O = 280
LTE213x13mm
Pad Compatible with BGA version
2ML
3ML
4ML
1ML
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 31
RCP and HDI Design Rule Comparison
*Current released rules (12MPK10001G-ENG01) 70um min. Expect to revise min via size in a next release pending additional reliability data received, from 70um to 65um (after built: 65um top with 60um bottom). For actual “built” bias dimension, see RCP standard notes).
**Widen line width to as much as possible for low line resistance nets.
Label FeatureRCPStd/Min
FC-HDI Substrate Std/Prem
A Via hole diameter 75um/65um* 200um/80um
B Via pad diameter 100um/95um 350um/150um
C Line width* 25um/25um** 50um/45um
D Line to line space 25um/25um 50um/45um
E Line to via pad space 25um/25um 50um/45um
FVia pad to via pad space 25um/25um 50um/45um
GVia pad to package edge space -/300um 250um/150um
HLine to package edge space -/300um 250um/150um
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 32
Die Design for RCP
•Design for RCP allows full array die I/O•Die size can be reduced, fewer power and ground connections
Potential Die Pad Configurations
Die Pad Design Rules
Potential for Die Shrink
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 33
RCP Thermal Improvements
Thermal Performance
Package Type
Junction-to-air Thermal Resistance, Rja (°C/W)
Natural Convection
Forced Convection at 1 m/s
(200 ft/min)
RCP, 4 layers, Die Size: 8.5 x 9.9 mm, no lid on die backside 21.4 14.5
FC-PBGA, 6-layer HDIDie Size: 7 x 9 mm, no lid on die backside 24.2 20.4
FC-CBGA, 6 layersDie Size: 6.8 x 7.9 mm, no lid on die backside 14.0 11.0
RCP with 0.5 mm thick 25x25 mm Cu lid on die/encapsulant backside 15.8 10.2
RCP with 1.0 mm thick 25x25 mm Cu lid on die/encapsulant backside 15.5 10.1
RCP with 1.0 mm thick 25x25 mm Cu lid on die/encapsulant backside, along with a plate-fin
heatsink5.6 2.33
360 I/O, 25x25 mm, 1.27 mm pitch on a 4-layer PCB
•Exposed Si Backside•Attach of heat spreader•Improved thermal performance
RCP With Exposed Die and Attached Heat Spreader
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 34
RF Test Vehicle
PA Test Vehicle
TV1 TV2 TV3
3G Baseband
2G Baseband
XTR
PowerQuicc-3
Power Management i.275 RiP
i.300 RiP
PTV-C65
NetworkProcessor
19
RCP Test Vehicles & Assembled Products
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 35
Certification Vehicles9mm x 9mm 0.5mm P 12mm x 12mm 0.4mm P
6mm x 6mm 0.5mm P
12mm x 12mm 0.4mm PVertical probe125um pad pitch
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 3636
RCP Reliability – M2 Technology Certification 300mmTest Item JEDEC/FSL
CommercialJEDEC/FSL Industrial
Customer Requirement
Extended Stress
Pre-con: Customer-F* NA NA Pass Pre-con: Customer-B** NA NA Pass Pre-con: MSL3/260ºC Pass Pass Pass Temp Cycle (-55 to 125ºC) w/Customer-F* Pre-con
NA NA Pass 100cyc
Temp Cycle (-55 to 125ºC) w/Customer-B** Pre-con
NA NA Pass 100cyc
Temp Cycle (-55 to 125ºC) w/MSL3/260ºC Pre-con
Pass 400cyc
Pass 700cyc
NA Pass 1000cyc
HTOL 125ºC Pass 504hrs
Pass 1008hrs
Pass 1008hrs
HTB 150ºC Pass 504hrs
Pass 1008hrs
Pass 1008hrs
THB 85ºC/85% w/Customer-F* Pre-con
NA NA Pass 1008hrs
THB 85ºC/85% w/Customer-B** Pre-con
NA NA Pass 1008hrs
THB 85ºC/85% w/MSL3/260ºC Pre-con
Pass 504hrs
Pass 1008hrs
NA
PCT 121ºC/100%RH 29.7psia w/Customer-F* Pre-con
NA NA Pass 96hrs
PCT 121ºC/100%RH 29.7psia w/Customer-B** Pre-con
NA NA Pass 96hrs
Board Level SJR Temp Cycle (-55 to 125ºC) w/Customer-F* Pre-con
NA NA Pass 480cyc
JEDEC Drop Test 30 Drops, 1500G
Pass
Pass NA
* F Precon consists of 3 cycles of moisture load (30ºC/70%RH for 96hrs) and reflow at 260ºC** B Precon consists of 2 cycles of moisture load (30ºC/70%RH for 96hrs) and reflow at 260ºC
M2 Tech Cert Achieved using
Spirytus-S(6x6mm, 105 I/O, 2ML 0.5mm pitch)
JEDEC and customer specific reliability requirements met
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 3737
RCP Reliability – LTE2 300mm
RCP – LTE2 Demonstrated Reliability(9x9mm, 2ML, 258 I/O, 0.5mm pitch)
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 38
A Few Applications Targeted for RCP
Package 2
Package 1
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 39
39
U1
U2
Multiple Redistribution LayersFan-Out Packaging
Multi-Die, Embedded Passives, Integrated Structures
2ML
4ML
1ML
M1M2M3M4
Inductors in Build-up
Module with two die and 8 embedded passives
Inductor Coils with Shielding Structure for Isolation
Robust RCP 2D Dimensional Packages –Building a Foundation for 3D
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 40
PCB
Die A
Die/Package B
Stacked Fan-Out with side metal interconnect
Stacked Chip-to-Chip
Multiple Laminated Package Layers
RCP 3D Building Blocks – Multi Layer Fan-Out Packages
-Courtesy of 3D Plus RCP Module with Sensor
RCP multi-die layer
10 die, multi-layer package built for Medtronic (Pacemaker application)
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 41
Die 2
Die 1
Package A
Package B
Package C
Package D
Embedded in Base PackageAssembled on Top
Package B
Die 1 Die 2
Package A
Package A
BasePackage
Through Package Vias
2D Fan-outSMD
Stacked TSV
Double-Sided Build up
Back-to-Back Die
Single dieE-Plane
Through ViasBlind Via
Common Power/Ground
RCP 3D Building Blocks –Through Package Via-Double Sided Buildup
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 42
New RCP Potential
G-Cell
Back-to-Back Die
Single die E-Plane
Wirebond to RCP
►Allows system integration of mixed technologies:
• MEMS• WB Die
►Wirebond on Cu RCP pad possible over:
• Die Region• EGP• Encapsulation
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 43
Footed HS
Underfill
RCP on Interposer Requiring ≥ 0.8mm BGA Pitch
► Devised as low cost alternative to low-mid range FC packages► Combines smaller RCP packaged device stacked on low cost substrate to
accommodate 1mm and larger pitch► Key Attributes of Concept
• Allows for smaller RCP package size• Low cost Interposer substrate provided by vendor
RCPInterposer
Interposer routing out to 1.0mm (29mm x 29mm)
8156 die mapped into a 0.4mm RCP Package (17mm x17mm)
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 44
Summary: Borrow Architecture from Nature – Adapt it for RCP
To main computer
BOX
BOXInGaAs
BOX
Metal1Metal2
Metal3
Visible IR
Imager layer
Cones (day/color)Rods (night vision)
Ganglion cells(multi-pixel processing)
Bipolar cellsAmacrine cellsHorizontal cells
Light inputTo optic nerve
(output)
Smart processing
Electrical output
Parallel Vertical Imager/Processor Stack
Retina
►RCP provides a diverse set of solutions for heterogeneous integration.
►Interest in mounting within the industry to utilize this capability for integrated, compact systems
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 45
Technology Development
Proposed Model
JDA Activity with Nepes
Multi-Die3D Integrated Packages
High I/O, High performance packagesIntegrated Sensors
Prototyping Freescale NPI’s
Freescale initiated external customer support
Prototyping Nepes initiated non-Freescale product support
Internal Freescale Non JDA related opportunities(ex Sensors)
Nepes Manufacturing
Site
External Freescale System level or package level opportunity
(i.e. Medical, Robotics, Imaging, Smart Card, etc.)
External Freescale Test hardware development
Develop Freescale integrated system level package solution using Freescale resources (design, modeling,
package development, manufacturing)
Use established opportunities to integrate Freescale IP/ Chips as well as build a comprehensive solution
Nepes Manufacturing
Site
Partner Manufacturing
Site
Freescale Manufacturing
Site
Tempe RCP Development
and Prototyping
Lab
Freescale Development Activities Outside of Nepes framework
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 46
Foundry Technology Offerings Across Markets
CMOS Technology (Low Power, RF CMOS, SOI, NVM and Cores)180nm, 130nm and 90nm
NetworkingInfrastructure
WirelessHandsetsConsumerIndustrialAutomotive
Silicon Germanium RF BiCMOS0.35um and 0.18um
MEMs, Backend and Post Process Modules (Cu Ind, Power Cu and Bump)150mm and 200mm Wafer Services
SmartMOS (BCD Smart Power Technology0.35um, 0.25um and 0.13um (voltage tiers up to 105v)
RCP – Advanced Redistributed 3-D Packaging TechnologyMulti Die, Multi Technology Systems in a Package
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