fpc1011f introduction of a new sensor package. summary: fpc has invested + 1 000 kusd high quality...

FPC1011FIntroduction of a new sensor package

Summary:

FPC has invested + 1 000 KUSD

High quality design

Electrically compatible with FPC1011C

Available as solderable component

New high quality supplier chain

Production start June 2008

FPC1011F

Product improvements:

BT substrate

+ High quality FR4

+ No silver migration or oxide

- May need mechanical support from underneath

FPC1011F

Product improvements:

BT substrateFilm Assisted Moulding

+ Standard mould method

+ Embedded passives

+ Protects silicon edges

FPC1011F

Product improvements:

BT substrateFilm Assisted Moulding

Flex film contact

+ Custom design of flex film (length etc.)

- Sourced by customer

FPC1011F

Product improvements:

BT substrate Film Assisted Moulding

Flex film contactAvailable for soldering with BGA

+ Enables automated assembly process

+ Low cost

FPC1011F

Product improvements:

BT substrate Film Assisted Moulding

Flex film contactAvailable for soldering with BGA

New hard coating

+ Mass production process, applied on wafer

+ Not sensitive to scratches,

- May give ESD footprint under extreme conditions

FPC1011F

Product improvements:

BT substrate Film Assisted Moulding

Flex film contactAvailable for soldering with BGA

New hard coating

- May give ESD footprint under extreme conditions:

FPC1011F

Strong ESD discharge from test electrode (>7.5KV) => Coating surface may be affected by oxygen plasma reaction => May be detected in image from extremely wet fingers.

Disappears over time (typically by 30% after 3 days)

Conditions for possible appearance: & Low humidity, typically northern China (may bring high voltage ESD discharges), & High humidity, typically southern China (may bring wet skin properties), & Electrode approach from top & discharge via sensor surface.

Not observed by live finger discharge.

Product improvements:

BT substrate Film Assisted Moulding

Flex film contactAvailable for soldering with BGA

New hard coatingMetal frame

+ More robust versus plastic frame in FPC1011C

+ Available in different forms

+ Colour and surface conditions (default Satine finish metal colour)

- Needs minimum order quantity

FPC1011F

Product improvements:

BT substrate Film Assisted Moulding

Flex film contactAvailable for soldering with BGA

New hard coatingMetal frame available in different forms

FPC1011F

Production improvements:

Assembly managed by Amkor+ No. one package supplier world wide

Full automated production process+ High volume capacity+ Repeatable high quality process

Well defined qualification process+ High product quality- Longer product change time

New Supplier chain

Production process:

Silicon production

New Supplier chain

Production process:

Silicon production

Coating

New Supplier chain

Spin coating process

Production process:

Silicon production

Coating

Packaging

New Supplier chain

Wafer dicing Die attach Wire bonding Passives FIM mould Frame assembly Flex contact assembly Test & outgoing inspection

Customer feedback:

Questions?

Acceptable product?

Thank you for your attention !

FPC1011F