basic transreciver staion
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BASIC
TRANSRECIVERSTAIONVIPIN MISHRA
08EI58
I.E.T. M.J.P. ROHILKHAND UNIVERSITY
BAREILLY
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ACKNOWLEDGEMENT
The satisfaction that accompanies the successful completion of any task would be
incomplete without the mention of the people who made it possible and whose
constant guidance and encouragement crown all the efforts with success.
It is my proud privilege to express deep sense of gratitude, regards an appreciation
to my guide Mr. SUDHIR SHARMA for his invaluable guidance, deep rooted
interest, inspiration and continuous encouragement throughout our summer
training which helped me to complete my project successfully. I am blissful to pay
my greatest regards to Mr. ANAND for her valuable guidance and advice during
the course of this project. I also wish to thankMr. ANUJ BISWAS for extending
their valuable guidance & help about logical aspects of all practical
implementations of design & support for literature, critical reviews and above all
moral support they provided to me at every stage of training.
I am grateful to those who have directly or indirectly helped me during the projectwork. Finally, I express my heartfelt gratefulness to my parents, teachers and
friends for their wishes and contributions towards carrying out this endeavor.
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Certificate
TO WHOM IT MAY CONCERN
This is to certified that Mr. VIPIN MISHRA, a 4th year(EI) student of Institute Of Engineering & Technology,
M.J.P.Rohilkhand University, Bareilly, has successfullycompleted his training/project on:
BTS:BASIC TRANRECEIVER SATION
in partial fulfilment of the requirement for the award of
Bachelor Of Technology (B.Tech) from ELECTRONICPRODUCT DIVISION,I.T.I LIMITED during the periodof Six weeks (45 Days).
CERTIFIED BY:
MR. M.P.SINGH
ASSTT. MANAGER(EDC)
I.T.I. LIMITEDRAI BARELI
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I.T.I. PROFILEThe Rae-Bareli Unit of ITI set up in 1973, has been
continuously upgrading to new technologies.
Today , the unit produces electronic and mechanical
equipments like :
GSM BTS (Collaboration with ALCATEL FRANCE)
Tower and Shelter for BSNL
Installation and commissioning of CDMA equipments
in Maharastra& Rajasthan.
Installation , commissioning and maintenance of GSM
network of BSNL in Maharastra, Gujrat and MP
&Chattisgarh.
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SURFACE MOUNT TECHNOLOGY
Surface mount technology (SMT) is the practice & method
of attaching leaded & nonleaded electrical components to
the surface of a conductive pattern that does not utilizes
leads in feed through holes. Surface mount technology is
the latest trend in electronics manufacturing. It started
way back in 1986 that has been more than a decade now.
Type of Surface Mount Devices
There are various types of Surface Mount
Components or SMD (Surface Mount Devices)
available in the industry
1. Chip components:These components are very
small size. These consist of resistors, capacitors,
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diodes, LEDs etc.They are available as small as 0.6(l)
x 0.3(w) mm .
.
2. SOTs:These are known as small outline transistors.
This category comprises of components like,
standard transistors, UJT, SCR, Triacs, Diacs, etc.
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3. SOICs:These are known as small outline Integrated
Circuits These are the ICs that can be directly
mounted on the board with no requirement of
insertion
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4. TSSOPs:These are known as Thin Shrink Small
outline Packages These are also ICs that can be
directly mounted on the board but the pitch between
pins very less of order 0.5mm & thickness of the ICs
very thin of order 1.5 mm..
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5. QFPs:These are known as Quad Flat Packages These
are also ICs that can be directly mounted on the boardbut the pitch between pins very less of order 0.5mm &
has pins on all four sides.
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6. PLCC:These are known as Plastic Leaded Chip Carrier
These are also ICs that can be directly mounted on the
board but these have J type leads ie. The leads are bend
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under the body of the IC. A PLCC has J-type leads on all 4
sides & if it has a J-leads on two sided then it is called SOJ
7. BGA:These are known as Ball Grid Array These are
also ICs that can be directly mounted on the board butthese have leads in the form of balls underneath the
body.These BGAs are the latest trend in the SMT. These
BGA have ball size as small as 0.25 mm. Therby reducing
the size of the component to a very minimum size.
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8. Surface Mount Connectors:These are the
connectors which can be directly mounted on the board.
The connectors include connectors in which PLCC, SOJ &
BGA can be mounted, as well as data bus & power cables
etc. can be connected
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SMT: INTRODUCTION
Europlacer Line 1 SMT shop was commissioned in July98.
Resources
Screen Printer : DEK 260 SA
Pick and Place : EP 400 & EP 600 (Europlacer)
Oven : ETS 2545B, USA
Line Speed : 10000 CPH (Max. Rated Speed)
Feeder Capacity : 144 of 8 mm Tape
Placement Capability : 20 mils Fine Pitch ICs
Europlacer Line 2 Screen Printer : DEK Horizon 02 i
Pick and Place : EP 400 & Xpress 50
Oven : XPM 820, VitronicsSoltec, USA
Line Speed : 54000 CPH
Feeder Capacity : 237 of 8 mm Tape + 30
trays
Europlacer Line 3 Screen Printer : DEK Horizon 02 i
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Pick and Place : XP143E & XP243E
Oven : MR 933, VitronicsSoltec, USA
Line Speed : 90000 CPH
Feeder Capacity : 440 of 8 mm Tape + 20 trays
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SMD ASSEMBLY PROCESS MAP
QC
Receipt of material
Kitting
Trolley loading andfeeder programming/
Preparation
Solder Paste
Pick & PlaceAssembly
Inspection and repair onstop conveyor
Reflow Solde
QC Check
Inspection and repair
Card Dispa
QC Check
QC Check
QC Check
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INTERNAL CKT. TESTING
The In circuit tester tests the components &determines the functionality of the components.
But this testing is done in a particular sequence so
that whole circuitry is not effected due to a faulty
component or an improper joint. The sequence is
as mentioned below.
n Preshort Test: The tester prepares & initializes for
testing. During this process the tester verifies thatthe fixture & board are properly mounted on the
tester. It checks that the probes of the fixtures sits
on the board smoothly.
n Short: It checks for unexpected shorts & Opens in
the circuit ot make sure that the components are not
missing & if not missing then it checks that the
components are not short due to any manufacturing
process. If it finds any short it gives alarm & stops
the testing, in order to avoid the failure of the
circuitry.
n Analog In circuit: During this process first the
analog components are checked unpowered then
powered testing is done as explained earlier.n Digital In Circuit: During this process the digital
components are checked as described earlier.
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Functional Testing
This is the type of testing which is done to check the
functionality of whole of the circuitry. During this testing
all the power supplies inputs & output processors are
connected to the board. Then the input processors giveinput to the circuit & output processor reads output &
analyzes how the circuit is behaving according to the
input.
This process is performed after all the types of
Inspection & testing discussed earlier.This is the final
testing to check if the board is good or not. The boards
which are passed through this are marked Tested OK. &
then are shipped.
As we have seen that the inspection has some
limitations so has the testing. So we can say that the
inspection & testing process can be combined together so
that the board can be 100% inspected for all type of
possible defects. The next page shows the types of faultsthat may be present in a board & capability of the
inspection & testing process to diagnose it.
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BTS: BASIC TRANRECIEVER
STATIONThe BTS provides two-way radio communication between thePSTN, andMobile Stations located in a single GSM cell. It also provides a similarlink between the Mobile Stations and the rest of the PLMN. via the TC.The BTS thus interfaces the digital baseband signals used by the land-
based networks and the GSM radio signals used by Mobile Stations.
TYPE OF BTS
INDOOR (AC,DC) OUTDOOR (AC,DC)
(mbi5)(mbo2)
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Various card used in MBI5 cabinet are as given below:
SUMAprovides the central management and control of all the
BTS A9100 modules. It has responsibility for the following
functional areas:
Digital transmission
Timing and clock generation
Management of the BTS internal digital interfaces
O&M functions
RI
Control of the AC/DC converters and check of the
battries.
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TRE combines digital baseband and analog RF functionality in
one module. The architecture is split into three functional blocks:
Digital part TRED
Analog part TREA
(TRED and TREA are realized on TREDA)
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Power amplifier TEPA.
Power supply TREPS.
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ANC provides the intermediate RF stage between the TREs and
the antenna. On the downlink, the ANC connects two TRE
transmitters to two antennas. On the uplink, it splits the received
signals and passes them to the TRE receivers.
FACB monitors the fans and provides power and digital speed
control of the FANUs. A FANU consists of a moulded-plastic
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frame containing two fan blowers. Three FANUs are controlled by
one FACB.
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RACK / CABINET DESCRIPTION ofBTS
EVOLIUM BTS A9100 INDOOR MBI5
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Quality of MBI5 BTS
1. Very high radio performances, in particular.
RACK -one
SUB-RACK -
five
CONNECTION AREA -
one
DIMENSIONS AND
WEIGHT
HIGHT -
1940mm(6.36)
WIDTH -
600mm(1.96)
DEPTH -
450mm(1.47 )
WEIGHT - 270 kg
(595p)
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* Reception sensitivity, -111 dBm,
* Improved Output Power, (Standard 45 W).
2. Radio (synthesizer) Frequency Hopping,
3. Antenna Diversity (as standards option),
4. Minimum Service Interruption
5. Very High BTS availability
*Due to Module Reliability
*Due to System Architecture,
6. Optimized software release migration.
Flexibility of MBI5 BTS
1. Wide possibilities of extensions and sectorization,
within the same cabinet, e.g., the MBO2 cabinet can
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accommodate up to six sectors with a twelve-TRX
total capacity,
2. Outdoor BTS modularity provides flexibility for other
equipments (Transmission Equipment, Batteries,
Microwave, DDF etc.),
3. System Architecture and Cabinet for GSM 850, GSM
900, GSM 1800 and GSM 1900 remains the same,
4.High modularity,
5. Reduced set of modules and a common interface.
Future Proof BTS
1.GPRS Ready
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2.EDGE Ready by add TRE operation
3.UMTS Ready: the MBI5 and MBO2 outdoor
cabinet allow mixed configurations GSM + UMTS.
GPRS: GENERAL PACKET RADIO SERVICE
EDGE: ENHANCED DATA FOR GSM EVOLUTION
UMTS:UNIVERSAL MOBILE TELICOMMUNICATIONSYSTEM
IMT INTERNATIONAL MOBILE TELECOMMUNICATION.
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ABREVIATION:
1. MBI5 MULTISTANDARD BTS INDOOR WITH 5SUBRACK
2. SMT SURFACE MOUNT TECHNOLOGY
3.SOIC SMALL OUTLINE IC
4. SOT SMALL OUTLINE TRANSISTOR
5. SSOP SHRINK SMALL OUTLINE PACKAGE
6.QFP QUAD FLAT PACK IC
7. PLCC PLASTIC LEADED CHIP CARRIER
8. BGA BALL GRID ARRAY
9.FANU FAN UNIT
10.FACB FAN CONTROL BOARD11.BTSRI BTS REMOTE INVETOR
12.XIBM EXTERNAL ALARM INPUT BOARD
MULTISTANDARD
13.TRE TRANS RECEIVE EQUIPMENT
14.ANC ANTENNA NETWORK COMBINER
15.SUMA STATION UNIT MODULE ADVANCED
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