aml overview

AML – Wafer Bonding Machines & Services

AML Overview


• Company founded 1992

• MEMS Design, Manufacture & Process Development background

• Founders made first in-situ aligner-wafer bonder in 1985

• AML focus on & Provide Wafer Bonding equipment & Wafer bonding

services (BONDCENTRE)

•Worldwide installed base of machines

AML- Company History

From MEMS background not Mask Aligner for IC


Basic features of AML bonders


AML AWB04 Aligner Bonder


Schematic of Unique in-situ Activation, Alignment & Bond

T <560 C

HV <2500V• Heat + Pump + Align• Independent platen T• Flexible•• 2 to 8 inch wafers2 to 8 inch wafers•• Fast cycles timesFast cycles times


AML Wafer Bonders

• Anodic Bonding Si-Glass• Direct Bonding e.g. Si-Si• Glass Frit Bonding• Eutectic Bonding• Thermo-compression• Adhesive Bonding• Aligned Embossing

In bond chamber alignment & bonding

in one machine = higher throughput

Wafer bonding capabilities:-


AML Advantages• In-bond chamber alignment at bond temperature

• No alignment shiftage between align & bond

• No mask aligner required

• NOTE:-You are free to choose the best mask aligner for your ‘mask aligning’- not tied to one needed by the wafer bonder system

• Small footprint

• No alignment jig required (smaller mass) *

• Simultaneous alignment and vac pump-down *

• No flags in contact with bond surfaces

• In chamber RAD activation option

• Forced cooling *

* = faster throughput


Commercial benefits of the In-situ AML Wafer bonders

•Lowest cost per bond & ownership

•Easy to install, (2-3 days) use/ maintain/ service – minimal training

needed.

•Very high reliability.

•Small footprint

•No time required on customer’s mask aligner

•Standard machines & custom options to suit customer needs

•Excellent technical process support – fast response

•System is complete – no other equipment required

•Extensive machine & bonding process experience.

•Worldwide Machine base UK, Europe, USA , India & Far East.


New system features, now and planned


New Processes on AML Wafer Bonders• Hot Embossing – Characterisation has just started

New Developments on AML Wafer Bonders• Inclusion of RAD in-situ surface activation for low temperature bonding (available for new orders) see pages 19-24

• Addition of Pattern recognition software

• Improvements for sub-micron alignment accuracy

• Upgrading of manipulators from manual to stepper motor control

• Motorised Z DriveDevelopment pipeline:- System Automation


Outline SpecificationForce up to 5000N Stroke up to 750 micronsT up to 500 C (cooling) up to 6” wafersOperation in Vacuum 2 micron alignment between

stamp & substrate

New Polymer Micro Hot Embossing & Nano Print tool

• Applications: e.g. Bio-sensors & Microfluidic devices

• Polymers: SU8, PDMS, PMMA..• Tool fits AML bonder platform or

stand alone machine


Radical Activation Tool

Experimental set-up using glass vacuum chamber – showing electrical discharge confined between the ring electrodes


IR transmission Image150mm RAD activated

bond

Void free in situ activated bond – annealed at 200C for 1 hr


Radical Activation Benefits

Produces less roughening of the surface than plasma activation

Uniform activation (no edge effects as typically seen for plasmas)

Wider process time window for activation

In situ process eliminates variation in activation strength withtime

No exposure of wafers to energetic ions

Bond can be heated and contacted at bonding temperature = significant advantage for dissimilar substrates or “hard to bond”substrates


AML Wafer Bonding Machines

One System does it all!


BONDCENTRE

Wafer Bonding Services


AML’s Strengths

• Very strong MEMS design & process background –especially with respect to Wafer Bonding

• Relevant customer base• Strong network of partners built up over many years • Equipment supplier – transfer the process onto a machine• Selected by UK government to be best to provide the

service


BONDCENTRE SERVICES OFFERED

• Wafer Bonding Process Development e.g. for many novel materials;silicon, glass, sapphire, strained silicon, InP, GaAs,…

• Wafer Bonding process selection & design for your application

• Commercial Wafer Bonding Service prototype to production

• Wafer Bonding Technology Transfer (inc Equipment) & Training

• Associated Processes (Pre & Post Bond)

• Applications knowledge for:MEMS Smart cut layer transfer Advanced Substrates Wafer Level Packaging 3D integration Vacuum EncapsulationTemporary Bonding LEDs


Associated Pre & Post Bond Services:

• Wafer Cleaning & Activation • Wafer Characterisation e.g. Profiling & Surface

Roughness• Wafer Structuring: e.g. Channels, Holes &

Conducting Vias• Wafer Processing: e.g. Deposition, Electroplating• Wafer Preparation: Thin to required Thickness &

Surface Finish - Planarisation (CMP)• Inspection of bonded assemblies - SAM & IR


• WAFER ALIGNER BONDERS 4 machines in Class 10• METROLOGY; AFM, Ra, PROFILE, TTV• MEGASONIC WAFER CLEANING • NEW ‘RAD’ ACTIVATION• INSPECTION: ACOUSTIC MICROSCOPE (SAM) & IR• ELECTROPLATING • SCREEN PRINT - GLASS FRIT/ADHESIVE• POWDER BLASTING E.G. GLASS MACHINING• WAFER THINNING • CMP

• Also access via long term collaboration with CMF @ Rutherford to:• PHOTOLITHOGRAPHY DEPOSITION- PVD & CVD & FURNACES• ETCHING – DRY & WET• WAFER SAW WIRE & BUMP BONDING• METROLOGY: THIN FILM, LINE WIDTH, SEM

Equipment Set Available:Equipment Set Available:


AML Wafer Bonding Machines & Services

One Company does it all!

aml overview

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