altiumlive digital standards and digital samples for rigid-flex technology · samples and examples...

ALTIUMLIVEDIGITAL STANDARDS AND DIGITAL SAMPLES FORRIGID-FLEX TECHNOLOGY

Andreas SchilppJürgen WolfWürth Elektronik CBT

MunichJanuary 17th 2019

Flex-Rigid Layer Stack Design

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Design rules – Design for Manufacturing

Summary

Flex-Rigid Standards and options

Training design „WECube“

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The Advatages of Flex-RigidFlex-Rigid Standards and options

Miniaturisation

Signal Integrity

Reliability dynamicalBending

AltiumLive 2018 Digital Standards and Samples for Rigid-Flex Technology © Würth Elektronik GmbH & Co. KG

USB3 Camera – Miniaturization at it´s best!Flex-Rigid Standards and options

Features USB connector on separate rigid part impedance matched connected with flex part Avoiding connectors, saving Footprint areas Design uses Microvias excellent Assembly excellent Performance excellent Testability excellent Robustness


Important steps prior to Layer Stack Design:Flex-Rigid Standards and options

Design-to-Cost 1: system

! Flex-Rigid is mechatronic

= Mechanic + Electronic !

all electrical and mechanical interfaces must be taken into consideration during the conceptual phase

An optimization could cut costs remarkably



Design-to-Cost 2: interfaces Expensive flexible tails due to weak mechanical design− nesting not possible− optimisation of needed area− combination of interfaces− Option of folding



Design-to-Cost 3: Folding


Flex-Rigid 1F-5Ri / HDI 1-4-1 Flex-Rigid 2Ri-2F-2Ri / HDI 1-4b-1


Design-to-Cost 4: flex-rigid variants


Options for interface designFlex-Rigid Standards and options

ZIF contact with flex flex outside:

Tipp for flex inside:


Options for mechanical design of flexible layersFlex-Rigid Standards and options

„lift-off“- design

no vias allowed in lift-off area no copper design next to flex

layers, ok on all other layers specification in drawing:

„lift-off area, not laminated“


Standard Stack-up Flex-Rigid 1

Standard 1F-xRi stack-up− Rigid: FR4 Tg ≥150°C, halogen free, filled− Flex: Polyimide Tg > 200°C, typ. 50µm thick− soldermask, flexible soldermask partially in bending area− Inner layer copper thickness: 18µm



Standard Stack-up Flex-Rigid 2

Standard xRi-2F-xRi stack-up− Rigid: FR4 Tg ≥150°C, halogen free, filled− Flex: Polyimide Tg > 200°C, typ. 50µm thick− soldermask, Polyimide Coverlay partially in bending area (BIKINI)− Inner layer copper thickness: 18µm



Advanced Stack-ups: NON - Standard

Airgap constructions− 2F + 2F + 2F + ….. not glued− up to 70µm copper on flex material− bending becomes easier− requires a long flex area!

Recommendation: H ≥ 50mm



Advanced Stack-ups: NON - Standard

Airgap constructions− 2F + 2F + 2F + ….. not glued− up to 70µm copper on flex material− bending becomes easier− requires a long flex area!− Recommendation: H ≥ 50mm

Multilayer Flex constructions− 4F / 6F / … flex stack glued− for short bending areas− for impedance matching




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Creation of a flex-rigid Stackup 3Ri-2F-3RiFlex-Rigid Layer Stack Design

EDA Tool: Altium Designer 18Layer Stack Manager - one possible way:

Load „Presets“: Eight Layer Adapt the order of Cores / Prepregs Adapt thickness of copper, dielectric „Add Stack“ in Window „Advanced“ Deselect not used layers in substack „Flex“ „Add Layer“: „Add Flex Coverlays“

Now this becomes much easier!


Digital standard stackupsFlex-Rigid Layer Stack Design

Data formats− Altium AD18 (AD19 will follow soon)− Cadence (OrCAD PCB Designer Professional 17.2)− IPC-2581



Benefits of digital layer stackups Error avoidance & productivity increase− Avoid errors and increase productivity by importing proven stackups into

your EDA tool− always up-to-date on our website

Reliability− Proven stackups ensure the manufacturability and reliability of your

printed circuit board

Safety and security− Use of market-standard and cost-optimized standards− Avoidance of exotic and expensive special constructions and materials− Standards with stocked materials and standardized production processes

enable high quality and cost-effective production with shorter delivery times.



Start layouts faster – thanks to our digital layer stackups

LINK: Internet


https://www.we-online.com/web/en/leiterplatten/produkte_/3d_starr_flexible_leiterplatten/aufbauten/3D_Aufbauten.php


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Samples and ExamplesTraining design „WECube“

Feeling and understanding with hands-on samples 1F-xRi / Semiflex combination 2F-xRi xRi-2F-xRi Semiflex Flex / TWINflex


Samples and ExamplesTraining design „WECube“

Our Service becomes digital digital exercise sample WECube Altium AD18 data format Request for this sample data via

QR code or internet


Training design in Altium18Training design „WECube“

Special features Combination of different variants− Flex-rigid 1F-3Ri− Flex-rigid 1Ri-2F-1Ri− Semiflex 1Ri-3Ri

Lift-off areas Slot and key construction Rigid part as fixing bracket


WebinarTraining design „WECube“

For more information about „WECube“− visit our Webinar Archive



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different rules for for all rigid-flex variantsDesign rules


Flex-Rigid Design Guide

Special rules for flex-rigid most important are:− THT via pads− and also SMD pads, if flex is outside

Design rules


Clearance for THT Via padsDesign rules

General parameter definition

Clearance measurement:related to pad outline!

NOT center of drilling orvia barrel!


Clearance for SMD and THT Via padsDesign rules


Altium parameter setting:

PCB Rules− Board Outline Clearance

• Split Barrier• SMD Pad and TH Pad


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QR codesSummary

Summary of documents for download or important linksDesign rulesfor flex-rigid


Table Top exibitionSummary


Please visit our Table Top exibition get your 50€ coupen get a WE fidget spinner out of pcbs see the WECube as a real sample!

Thank you very much for your attention!

Any questions?

Andreas Schilpp

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