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1 Advances in Micro and Nano Manufacturing: Challenges and Opportunities in technology convergence based solutions Stefan Dimov Department of Mechanical Engineering School of Engineering

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Page 1: Advances in Micro and Nano Manufacturing: Challenges and ...euronanoforum2017.eu/wp-content/uploads/2017/06/... · Advanced Manufacturing (Cross-cutting KET) 4M2020 Scope & Focus

1

Advances in Micro and Nano Manufacturing: Challenges and Opportunities in technology convergence based solutions

Stefan Dimov

Department of Mechanical Engineering

School of Engineering

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2

Advanced Manufacturing (Cross-cutting KET)

4M2020 Scope & Focus

Process Chains & Value Chains For Specific Application Areas

Replication

Process Modelling & SimulationTech

nolo

gic

al Rese

arc

h Micro/Nano Structuring

Application/Product Development

Health

Bio

medic

al

Photo

nic

s

ICT

Energ

y

Thin Film Deposition

Inspection

COTECH

MULTILAYER

EUMINAfab

IMPRESS

4M NoE

POLARIC

Cro

ss-f

ert

ilis

ati

on

of

KE

Ts:

Ad

va

nce

d M

ate

ria

ls,

Na

no

tech

no

log

y,

Ph

oto

nic

s,

Mic

ro-/

Na

no

ele

ctr

on

ics

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3What do we „know“ about new emerging products?

Emerging/Future products

✓ will require function (length scale) integration

✓ will be thin and flexible

✓ will consume less energy

✓ will benefit from tailor-made surface properties

✓ will integrate new functional materials

✓ will consist of a mix of different materials in an either hybrid or monolithic manner

✓ will be made extensively from non-IC materials

Customised health monitoring

In-line metrology

Sensors for environment monitoring

Micro sensors integrated in machine tools

µ-connectors

Micro-parts for wearable devices

http://www.4mexpertise.eu/4m2020-library/high-priority-products

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4Talk outlines

Technology convergence: Trends, Challenges and Opportunities

FP7 NMP programme in technology convergence

UoB Micro & Nano Manufacturing Programmes: Latest Findings & Trends

Conclusions

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5Trends: Technology Convergence

Nanoscience and nanotechnologies,

The Royal Society & The Royal Academy of Engineering (www.nanotec.org.uk)

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6Trends: Technology Convergence

Nanoscience and nanotechnologies,

The Royal Society & The Royal Academy of Engineering (www.nanotec.org.uk)

Top down/bottom up “synthesis” (synergistic

effects) through a convergence of technologies for

machining/structuring and material

refinement/deposition

Processing of complementary materials to

silicon, e.g. nanophase metallic materials produced

through refinement or deposition

Applications underpinned by multi-material micro and

nano manufacture

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7

Processing units [μm]

> 10

Multi-grain size (mechanical) processing (>10 μm)➢ grain void range 10-5 – 10-3 [m]➢ specific processing energy 101 - 102 [J cm-3]➢ mechanical processing – brittle cracking/plastic deformation

0.1

Sub-grain size (mechanical) processing (0.1-10 μm)➢ dislocation micro-crack range 10-7 – 10-5 [m]➢ specific processing energy 102 - 103 [J cm-3]➢ mechanical processing – microcracking/dislocation slip

0.001

Atom cluster processing (1-100 nm)➢ point defect range 10-9 – 10-7 [m]➢ specific processing energy 103 - 104 [J cm-3]➢ grinding, lapping and polishing

0.00001

Atomic/molecular-bit processing (0.01-1 nm)➢ atomic lattice range 10-11 - 10-9 [m]➢ specific processing energy 104 - 106 [J cm-3]➢ melting, dissolution, diffusion, evaporation, sputtering

Technology Convergence: “Top down” Challenges & Opportunities

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8

Processing units [μm]

> 10

Multi-grain size (mechanical) processing (>10 μm)➢ grain void range 10-5 – 10-3 [m]➢ specific processing energy 101 - 102 [J cm-3]➢ mechanical processing – brittle cracking/plastic deformation

0.1

Sub-grain size (mechanical) processing (0.1-10 μm)➢ dislocation micro-crack range 10-7 – 10-5 [m]➢ specific processing energy 102 - 103 [J cm-3]➢ mechanical processing – microcracking/dislocation slip

0.001

Atom cluster processing (1-100 nm)➢ point defect range 10-9 – 10-7 [m]➢ specific processing energy 103 - 104 [J cm-3]➢ grinding, lapping and polishing

0.00001

Atomic/molecular-bit processing (0.01-1 nm)➢ atomic lattice range 10-11 - 10-9 [m]➢ specific processing energy 104 - 106 [J cm-3]➢ melting, dissolution, diffusion, evaporation, sputtering

Each process has its own cost effective processing window

that is determined by its material removal mechanism

(specific processing energy <> material microstructure)

A “toolbox” of processes is required to achieve a length scale

integration in new products (integration of technologies in

innovative processing chains)

Technology Convergence: “Top down” Challenges & Opportunities

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9Technology Convergence: “Top down” Challenges

Length scale integration –

fabrication of structures with meso

(<10 mm), micro (<100 μm) and

nano (<100 nm) functional

features;

Tolerances in the range of 1 to

10% of the nominal dimensions (in

precision machining < 0.01%)

Surface roughness required in the

range of 10 to 50 nm that could be

smaller than the grain size of the

material

Nanotechnology

Norio Taniguchi (1974)

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10Technology Convergence: “Top down” Challenges

Length scale integration –

fabrication of structures with meso

(<10 mm), micro (<100 μm) and

nano (<100 nm) functional

features;

Tolerances in the range of 0.1 to

10% of the nominal dimensions (in

precision engineering < 0.01%)

Surface roughness required in the

range of 10 to 50 nm that is

smaller than the grain size of the

material

Nanotechnology

Norio Taniguchi (1974)

Managing uncertainties in micro/nano scale

manufacturing

New standards and tolerancing methods to

address the scaling issues

Material microstructure becomes an important

process design parameter

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11

Technology Convergence: “Bottom up” Opportunities

Latest development in nano to macro deposition processes, e.g. laser-additive manufacturing and PVD and PECVD (grains down to 5-20 nm)

Significant advances in dislocation-based processes, e.g. SPD: FSP (surface) and ECAP (bulk) for producing UFG (100-500 nm) in metals

Advances in microstructure change processes, especiallytechnologies for producing BMG (e.g. laser processing and vitrification processes), electrolytic processes (ECD) for monolithic bulk metal nanostructures & rapid solidification processing (RSP)

Advances in nanopowders (micro particles with nanocristalinestructure), especially producing nanophase workpieces through sintering and powder extrusion/forging

Hybrid solutions, e.g. explosive welding technology for create bimetallic sandwichs of amorphous foils and Fe-based alloys substrates.

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12

IM, HE, Imprinting

Vol. EDM & ECM, IM, Coining, Forging,…

XY

Z

3D Channel (Volume)

IM & NIL

XY

1D Channel

Milling, SLS, Turning, SLA, FDM

Milling, µs&ns LA&F, wEDM Turning, EDM & ECM milling, SLS,

ps & fs LA, FIB, e-beam

Milling, Turning, SLS

Electroplating, Electroforming

XY

Z

3D Channel (Surface)

PVD & CVD

Meta

lsPoly

mers

Cera

mic

sAN

Y

Bending

Scr. Printing, Tape Casting

Array of 1D Channels

X

Printing

Blanking, Punching

PMLP, Etching, Exc. LA

Photolithogr. SLA

XY

2D Channel

Photolithogr., SLA

1

PMLPtemplate

2

UV Imprint4’’ wafer

3

PVDsputtering

4

EL. FORMINGinsert

5

IMPRINTINGparts

Technology Convergence: Integration Challenges & Opportunities

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13

IM, HE, Imprinting

Vol. EDM & ECM, IM, Coining, Forging,…

XY

Z

3D Channel (Volume)

IM & NIL

XY

1D Channel

Milling, SLS, Turning, SLA, FDM

Milling, µs&ns LA&F, wEDM Turning, EDM & ECM milling, SLS,

ps & fs LA, FIB, e-beam

Milling, Turning, SLS

Electroplating, Electroforming

XY

Z

3D Channel (Surface)

PVD & CVD

Meta

lsPoly

mers

Cera

mic

sAN

Y

Bending

Scr. Printing, Tape Casting

Array of 1D Channels

X

Printing

Blanking, Punching

PMLP, Etching, Exc. LA

Photolithogr. SLA

XY

2D Channel

Photolithogr., SLA

1

PMLPtemplate

2

UV Imprint4’’ wafer

3

PVDsputtering

4

EL. FORMINGinsert

5

IMPRINTINGparts

Technology Convergence: Integration Challenges

The depth of our knowledge in 4M component

technologies varies and concerted actions are required to

integrate them;

The technology and application breakthroughs can come

only from the development of novel integrated proceeding

chains;

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14

CMM Levels:

1 - Initial

2 - Repeatable

3 - Defined

4 - Managed

5 - Optimised

0

1

2

3

4

5Quality & Accuracy

Part size and complexity

Material

Efficiency

Processing

Fixturing & set-up

X-Ray Lith.

Electroforming

Process Pair

0 20 40 60 80 100

Maturity level Process1: X-Ray

Maturity Level Process2:

Electroforming

Maturity Level-Pair

Initial Repeatable Defined Managed Optimised

Process Pair:

XRay -

Electroforming

%

• Very well characterised pair. The

capability maturity hexagons are

symmetrical and similar in shape

for both processes.

• The pair is suitable for utilization

in a process chain (LIGA)

• ‘Fixturing and set-up’ are more

compatible than complementary.

Maturity assessment of processes and process pairs

Technology Convergence: Integration Challenges

Vella P., Dimov S., Minev R., Brousseau E. (2016) Technology Maturity Assessment of Micro and Nano Manufacturing Processes and Process Chains, IMechB Part B (in-press)

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154M2020 R&D Agenda: Challenges & Opportunities

Electro Discharge Machining

Laser Ablation

Micro-milling

Ion Beam MachiningRD

2 :

Mic

ro/N

an

o S

tru

ctu

ring

Te

ch

no

log

ies

RD 4: Integrated

Processing Chains for

Specific Applications

RD 1: Material Refinement &

Deposition Technologies

PVD ECAP BMG …

Processing Chain A

(1st level)

Processing Chain B

(1st level)

RD 3: Modelling of process-material interactions

RD 5: Uncertainties of Integrated Process Chains

Process Chain A-B

(2nd level)

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164M2020 R&D Agenda: Challenges & Opportunities

Electro Discharge Machining

Laser Ablation

Ion Beam MachiningRD

2 :

Mic

ro/N

an

o S

tru

ctu

ring

Te

ch

no

log

ies

RD 4: Integrated

Processing Chains for

Specific Applications

RD 1: Material Refinement &

Deposition Technologies

PVD ECAP BMG …

RD 3: Modelling of process-material interactions

RD 5: Uncertainties of Integrated Process Chains

Synergistic

Effects: Micro-

Milling & ECAP

Micro-milling

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17

Levels 1 ∩ 2

1st Level: process parameters

2nd Level: Machining strategies

Optimisation potential

Synerg

istic

Effect

sProcess-Material interactions: Optimisations’ Options

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18μMilling Strategies: Optimisation issues

Objectives:

To study factors influencing the

resultant surface quality during micro

milling

To verify experimentally the effect of

different machining strategies on

surface quality

Tool Path Generation

Resulting Surface Finish in Copper

Micro-Milling

Varying Machining Strategies & Keeping the Same Process Parameters

Micro-Structure

Dimov S, Pham D T, Ivanov A, Popov K, Fansen K (2004)

Micro-milling strategies: optimization issues, Proc. IMechE,

Part B, Vol 218, 731-736

Results: strategy type - surface finish (Ra)

Type 1.2, 3 0.44 µm

Type One Direction 0.23 µm

Type Spiral 0.28 µm

Type 1 Connect 0.17 µm

Spiral Maintain Cut Direction 0.14 µm

Spiral Maintain Cut Type 0.21 µm

Follow Hardwalls 0.13 µm

Constant load 0.13 µm

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19Micro-milling of thin features (ribs & webs)

Objectives:

To study the main factors affecting the machining of thin ribs and webs.

To propose new machining strategies for micro-milling of thin ribs and webs.

Conclusions:

1. Machining from leastsupported to best supportedthin features in a component.

2. Machining with cutters without corner radius.

3. Removing the bulk of material layer by layer and then the resulting steps with ball-nose cutters at low speed.

1 “Standard”

Heidenhain

cycles

2 A layer-

based

strategy

3 Two stage

strategyDimov SS, Pham DT, A. Ivanov A, Popov K (2006)

Micro milling strategies for machining thin features,

Proc. IMechE, Part C, Vol 220(11), 1677-1783

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20

Levels 1 ∩ 2 ∩ 3

Levels 1 ∩ 2

1st Level: process parameters

2nd Level: Machining strategies

3rd Level: Material refinement/deposition

Optimisation potential

Synerg

istic

Effect

sProcess-Material interactions: Optimisations’ Options

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21Material Microstructure Effects in μMilling

3 Ultra Fine Grained (UFG) Al 5083 resulting from four Equal Channel Angular Pressing (ECAP) passes - grains of ~ 150-200 nm

Are

aRaAR (μm) RaCP (μm) RaUFG (μm)

A B A B A B

1 0.49 0.45 0.30 0.39 0.09 0.10

2 0.64 0.62 0.26 0.60 0.12 0.16

3 0.47 0.51 0.46 0.56 0.16 0.18

4 0.33 0.49 0.45 0.47 0.15 0.17

AV 0.48 0.52 0.37 0.51 0.13 0.15

Experimental Set-up

1 “As Received” (AR) AI 5083 - grains of ~ 200 μm

2 Conventionally Processed (CP) Al 5083 -grains of ~ 450-600 nm

200 nm

ResultsArea 1

Area 2

Area 3

Area 4

Popov K, Dimov S, Pham DT, Minev R, Rosochowski A, OlejunikI (2006) Micro-milling: Material Microsturucture Effects, Proc. IMechE, Part B, Vol 220 1807-1813

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22Modelling Surface Generation Process in Micro-milling

Microstructure mapping for multi-phase materials

1. Micrograph of the

AISI1040 sample

2. Grey-scale

picture

3. Binary picture

4. Grain boundaries’

picture

AM Elkaseer, SS Dimov, KB Popov, M Negm, R Minev (2012) Modeling the Material Microstructure Effects on the Surface Generation Process in Microendmilling of Dual-Phase Materials, ASME J. of Manufacturing Science and Engineering, 134, 4, 044501 (10 pages)

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234M2020 R&D Agenda: Challenges & Opportunities

Micro-milling

Electro Discharge Machining

Ion Beam MachiningRD

2 :

Mic

ro/N

an

o S

tru

ctu

ring

Te

ch

no

log

ies

RD 4: Integrated

Processing Chains for

Specific Applications

RD 1: Material Refinement &

Deposition Technologies

PVD ECAP BMG …

RD 3: Modelling of process-material interactions

RD 5: Uncertainties of Integrated Process Chains

Laser Ablation

Synergistic

Effects: Laser

Ablation & BMGs

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24BMGs: Ultimate Material for Length-Scale Integration

Material Mechanical Properties

Tg (o

C) Tm (o

C) σy (Mpa) Hv ρ (g/cc) TSPF (o

C)

Vit 1B 350 659 1900 540 6.04 420 - 460

Steel 1200 - 1500 900 341 7.80

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25Micromachining response of amorphous and crystalline Ni-based alloys

Findings:

Laser processing both with short and long pulses is a promising technique for micromachining amorphous Ni-based alloys because does not lead to material crystallisation.

There was no signs of crack formation in amorphous Ni-based alloys and thus a higher surface integrity can be achieved after after µs laser machining.

The µs and ps laser machining of micro-scale features and micro-structures in metallic glasses is possible while preserving the attractive mechanical properties of metallic glasses.

SEM images of trenches produced in amorphous, (a) and (b), and polycrystalline, (c), Ni78B14Si8; (d) a cross-sectional FIB image of the crater produced by a single µs pulse.

Quintana I., Dobrev T., Aranzabe A., Lalev G., Dimov S. (2009)

Investigation of amorphous and crystalline Ni alloys response to machining with micro-second and pico-second lasers, Applied Surface Science, Volume 255, Issues 13-14, Pages 6641-6646

SEM image of the FIB milled trench in an amorphous Ni78B14Si8 that starts at the hole side wall and continues through its surrounding area

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26Injection Moulded Different Scales Q-codes

H1= 13.92µm

H1= 503.8 nm

Zr-based BMG Replication Master

ps

Lase

r FIB

mill

ing

Topas COC Replicas

Two Q-codes:

- Micro pixels: 75x75x10 [µm]

- “Nano” pixels: 2.6x2.6x0.9 [µm]

P. Vella, S. Dimov, E. Brousseau, B. Whiteside (2015)

A new process chain for producing bulk metallic glass replicationmasters with micro- and nano-scale features, Int J Adv Manuf Technol, Vol. 76, Pages 523–543

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27

Integration of Complementary Technologies in Production Line:

1) Case Study 1: Integration of 3D printing & Laser Processing for producing miniaturise housing enclosures (HYPROLINE)

2) Case Study 2: Integration of Mechanical Machining & Laser Structuring for Producing THz Devices(HINMICO)

Technology Convergence: Integration Challenges & Opportunities

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28Integration of laser processing module with 3D printing

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29

Case Study 2: Integration of Mechanical Machining & Laser Structuring for Producing

THz Devices(HINMICO)

Penchev P., Shang X., Dimov S. and Lancaster M. (2016) Novel manufacturing route for scale up production of THz technology devices, ASME J. of Micro and Nano-Manufacturing, Vol.4, 021002-1

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30Motivation: Emerging Applications for THz Devices

• “Transition Region” between Electronics and Photonicswavelength ~ 1mm-0.1mm (0.3THz ≤ f ≤ 3THz)

• Technology driven by promising applications as follows

Imaging Communications Gas-sensing Astronomy

Serial production of passive signal processing components (e.g. THz filters)

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31Two-side Laser Machining of THz components

Key attributes:

• Modular workpiece holding

devices

• Automated workpiece

alignment routines

• Automated strategy for

multi-axis LMM employing

rotary stages

• Generic tool to counteract

the dynamics effect of

optical beam deflector

systems

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32Two-side Laser Machining of THz components

CAD model of THz waveguide filter Laser machined THz waveguide filter

Measurement results of the WR-3 filter

• insertion loss is around 4.5 dB

• centre frequency shifts upwards by around 3 GHz (1%)

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334M2020 Roadmap: Informing FoF 2018-2020 WP

www.4m2020.eu

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34

Action ID

Action Title TRL

Expected Type

VC5-S-001

Integration of novel multi-materials into modular, automated and reconfigurable production lines

5-6 IA

VC5-M-002

Integration of nano particles and aggregates into new and precise micro- and macro-engineering tooling and processes

4-5 RIA

VC5-S-003

Multi-materials, multi-scale and 3D-shape closed-loop control strategies for micro- and nano- manufacturing

3-4 RIA

VC5-M-004

In-line control & inspection solutions of novel materials for modular, updatable, reconfigurable and disassemblable products

3-4 RIA

VC5-L-005

Multiscale and multiphysics modelling solutions for novel material systems and products performance & robustness

3-4 RIA

VC5-S-006

Modular, updatable and reconfigurable manufacturing solutions for micro/nano-enabled miniaturized products

3-4 RIA

VC5-S-007

Pilot line for standardized manufacturing of hybrid and structured materials with customized properties

7-8 IA

VC5-M-008

Pilot line for 3D-manufacturing, process, analytical and material interface control and modelling of products integrating hybrid and structured materials

6-7 IA

4M2020 Roadmap: Informing FoF 2018-2020 WP

www.4m2020.eu

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35Technology Convergence: Generic Conclusions

There is no one technology that will prevail - the “breakthroughs” if any will come from an innovative integration of complementary technologies and their implementation in new manufacturing platforms.

A “tool box” of technologies exists to support the move from designing 4M2020-based products for specific materials and processes to designing processes/process chains to satisfy specific functional and technical requirements of new emerging multi-material products.

Technology conversion enabled solutions exist for bridging the “gap” between “mechanical” ultra-precision engineering and “MEMS/IC based” technologies.

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36Acknowledgements

Companies:

High performance Production line for Small Series Metal Parts (Sep ‘12 – Aug ‘15)

Laser Machining of Ceramic Interface Cards for 3D wafer bumps (Nov ‘15 – Sep ‘18)

High throughput integrated technologies for multimaterialfunctional micro components (Sep ‘13 – Aug ‘16)

Advanced Manufacturing of Multi-Material Multi-Functional Products towards 2020 and Beyond (Sep ‘13 – Aug ‘16)

European ESRs Network on SPL Micro\Nano Structuring for Improved Functional Applications (Sep ’15 – Aug ’19)

Modular Laser-based Additive Manufacturing Platform for large scale industrial application (Oct ‘16 – Sep ‘19)

ECO-efficient LASER technology for FACTories of the future (May 2012 - Apr 2015)

High-Impact Injection Moulding Platform for mass-production of 3D and/or large micro-structured surfaces (Oct ‘17 – Sep ‘20)