advances in fhe integration using flexform-adc · advances in fhe integration using flexform-adc...

Advances in FHE Integration using FleXform-ADC

2016FLEX Conference

March 03, 2015

©2016 American Semiconductor, Inc. All rights reserved.

Flexible Hybrid System“Combination of flexible printed materials and

flexible silicon-based ICs to create a new class of flexible electronics.”

Printed ElectronicsLow Cost, R2R, Large

Format

Printed Electronics• Sensors• Interconnects• Substrates• Displays

• Low Cost, Large Format• Roll-To-Roll, Screen, Inkjet Print,

…

What are Flexible Hybrid Electronics?

2

Flexible FleX-ICsHigh Performance, High Density

FleX-ICs• Sensor Signal Processing• Data Processing• Data Storage• Communications

• Low Cost, High Performance• Compatible with Printed Electronics• Foundry CMOS + FleX Processing

Molex flexible substrateAmerican Semiconductor


FleXform-ADC™ Development Kit

FleXform-ADC Kits provide:

• SOTA FHE System

• Supports printed sensor development

• User printable FHE with on-board FleX-ADC™

• Integration Board and Software

• Enables printed device demonstrations

• Fully supported by ASI flexible technology

integration team for design and manufacturing

FleXform-ADC Kit contents:

• Quick Start Guide

• FleXform-ADC printed circuit board (PCB)

• Two button cell batteries

• One 8.5” X 5.5” flexible circuit board sheet with two instances of the

FleXform-ADC flexible circuit board (FCB)

• Additional documentation, videos and software development tools

are available for download

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This work sponsored in part by Air Force Research Laboratory

Kit Availability:

• Limited initial release 2/23/15

• Now accepting pre-orders for March deliveries

©2016 American Semiconductor, Inc. All rights reserved. 4

FHE Capability Demonstration

Brewer Science/American Semiconductor collaboration• FleXform-ADC™ Dev Kit (FleX ADC IC)

• Temperature and humidity sensors (printed SWCNT)

Temperature Testing

Humidity Testing


Flexible ICs

FleX-ICs required to achieve a fully flexible system

• Traditional packaged parts and bare die can be surface

mounted to flexible substrates

Create rigid “islands” in flex substrates and/or

Rigid parts delaminate with even gentle curvature

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FleX OPAMP

Test Setup:

Vdd = 2.5V

Vss = 0V

Ibias = 10uA

In-pos = 1kHz square wave (YELLOW trace on

oscilloscope)

In-neg = connected to Out, voltage follower configuration

(BLUE trace on scope)

Out= connected to In-neg, voltage follower configuration

(BLUE trace on scope)

Package Die

BareDie

SoPDie

~300um ~30um

Flex Op-Amp functions at

5mm radius of curvature!


SOTA (In-Production)

• FleX-ADC/OPAMP

• 200um/300um Pad Pitch

• Pad up

• Silver Epoxy

• Manual Assembly

• 5mm RoC

Attach and Interconnect

Flip Chip (fcst 2016)

• 200um/300um (ADC/OpAmp)

• 160um/260um (MCU)

• All FleX ICs

• Plated Pads

• ACA/ACI (tbd)

• Manual Assembly

This work has been partially funded by NBMC contract

FA8650-13-2-7311

2014 MRL 3

Flip Chip/ACI (2014)

• FleX-MCU

• 160um/260um Pad Pitch

• AS_MEC1001.fxd

• AS_MEC4001.fcb

• ACA manual assembly

2014 MRL 4

Today MRL 8

Flip Chip (fcst 2017)

• All FleX ICs

• <260um pitch

• ACA/ACI (tbd)

• Fully Automated


Interconnect Direct Write

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2014 MRL 4

Today MRL 8

2016 Engineers Showing Off

2012 First Functional Print


Encapsulation

Reliability Requirements

Scratch protection

Environmental protection

Mechanical Requirements

Conformal

Thin

Flexible

Beta 2015 RoC 40mm

Gen 1 2016 RoC <5mm

“Beta” Units

• 600um thickness

• Rcurve limit 40mm

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Gen 1 Units

• 120um thickness

• Rcurve limit <5mm

FAIL

PASS

80% thinner

~90% more flexible

Overlaycompare


FleXform-ADC™ PlatformFHE Reliability Testing

Goals:

1. Dynamic Radius of Curvature (RCurve) Testing

2. Dynamic Complex Bend (Torsion) Testing

Test Coupon:

Flexible Hybrid Electronics (FHE) system with FleX-OpAmp on a PET substrate

• 127um (5mil) thick PET substrate with traces screen printed using a silver nanoparticle ink

• FleX-OpAmp™ general purpose operational amplifier configured as a voltage follower

• UV curable, non-conductive adhesives used for die attach and overcoat

• Thermal cure silver flake conductive adhesive used for interconnect

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150mm


FleXform-ADC™ Platform Radius of Curvature Testing

• Robotics system used to dynamically flex

the FHE system around a 15mm radius

mandrel

• FHE system tested electrically throughout

the curvature cycles

• Sample 1 – 10K cycles convex followed by

13.6K cycles concave without failure

• Sample 2 – 11K cycles concave followed

by 15.8K cycles convex before first failure

Failure due to crack in the silver flake

conductive adhesive used for interconnect

on the VDD line

Sample would still function if stress applied

to bridge the crack

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FleXform-ADC™ Platform Axial Torsion Testing

• Robotics system used to rotate the sample ±60

or ±90 degrees

• FHE system tested electrically throughout the

application of rotational stresses

• Sample 3 – 10K cycles of ±60 degrees followed

by 92K cycles of ±90 degrees before failure

• Failure mode indicates a crack in the silver flake

conductive adhesive

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• FleXform-ADC Development Kit (AS_DEVA) – Immediate availability

• FleXform-MCU Development Kit (AS_DEVB) – Available Q2 2016

• FleX-OPA1 Dual General Purpose Opamps (AS_OPA1) – Immediate availability

• FleX-OPA2 Quad General Purpose Opamps (AS_OPA2) – Available Q3 2016

• FleX-OPA3 Quad High Performance Opamps (AS_OPA3) – Available Q4 2016

• FleX-OPA4 Quad Output Transconductance Amps (AS_OPA4) – Available Q4 2016

• FleX-ADC1 8-channels, 8-bits (AS_ADC1) – Immediate availability

• FleX-ADC2 ADC with 3 Configurable Opamps (AS_ADC2) – Available Q4 2016

• FleX-MCU1 8-bit PIC Microcontroller (AS_MCU1) – Available Q2 2016

• FleX-MCU2 Microcontroller with ADC (AS_MCU2) – Available Q4 2016

• FHE Sensor Reference Design – Available Q2 2016

Flexible ICs

Thank You

American Semiconductor, Inc.6987 W. Targee St.

Boise, ID 83709Tel: 208.336.2773Fax: 208.336.2752

www.americansemi.com

© 2016 American Semiconductor, Inc. All rights reserved. American Semiconductor is a registered trademark of American Semiconductor, Inc. FleXform, FleXform-ADC, FleX, Silicon-on-Polymer, FleX-ADC, FleX-MCU and FleX-IC are trademarks of American Semiconductor, Inc.

Thank you for attending

Special thanks to :• Air Force Research Lab• Brewer Science• Molex• Boise State University

advances in fhe integration using flexform-adc · advances in fhe integration using flexform-adc...

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