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Advanced Microelectronic Packaging Manufacturing Technologies for

Handheld and Implantable Medical Devices IEEE EMBS Dallas Chapter Meeting

April 13, 2012

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Microelectronic Packaging Manufacturing Technologies for Handheld and

Implantable Medical Devices

Frank D. Egitto, Rabindra N. Das, Frank Marconi, W. Wilson and Voya R. Markovich

Endicott Interconnect Technologies, Inc.

1903 Clark Street, Endicott, New York, 13760

Presentation given by: Susan Bagen, PE

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• Motivations

• Objectives

• Approach

• Systems studied – ICD & Pacemakers

– Ultrasound devices

• Implantable substrates – Stretchable Flex

– Rigid-Flex

• Summary

Outline

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Medical Device

A medical device is a product used for

medical purposes in patients, in

diagnosis, therapy or surgery.

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Medical Electronics/Devices

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•Intravascular Ultrasound Catheter Sensor Package

•Ultrasound

•X-ray CT

•Digital Radiography

• Mammography

•Pharmaceutical Research

•Molecular Dynamics

•Defibrillators

•Pacemakers

•Neurostimulators

Medical Opportunities

Implantable Devices

Super-computing

Home Healthcare

Medical Imaging

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Medical Electronics Industry

• Gradual production growth.

• Healthy growth of over 8-9% for the next several years.

• Recession affected growth slightly. Not to the extent it hurt other industries.

Source:

http://www.ems007.com/pages/z

one.cgi?a=60051&artpg=1 US Implantable device market is on

pace to exceed $50 billion in 2015.

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Stretchable Substrates

Flexible

Substrates

Rigid

Substrates

Implantable Electronics: Substrate Technology

Implantable

Conformal Electronics

Imaging

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Objectives

Develop miniaturized rigid substrate for SWaP (size, power and weight) advantage.

Develop flexible substrates to satisfy space requirements for medical imaging and health monitoring devices.

Develop bio-compatible and or bio-stable shapeless substrates for Conformal Electronics.

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FDA

approval

Bio-compatible &

Bio-stable:

•Body fluid

solution stability

•Cytotoxicity

Testing

•…other

•Cell growth

Implantable Electronics

•Substrate

•Coating

•Over mold

•Housing

• Materials

purity

•Product

Quality

•Product

Traceability

•Product

Reliability

Law Requirements Approaches Check Points

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Technology Available Today Printed Wiring Board (PWB) to System-in-Package (SiP) Design Conversion

Critical Design Inputs

BOM Analysis

BOM Substitution

Recommendations

SiP Physical Layout

Preliminary Design

Review

Critical Design

Review

SiP Physical Layout

Optimization

EI Proprietary

Concurrent Engineering

•Signal & Power Integrity

•Mechanical Modeling

•Thermal

•Reliability

•Producibility

•DFM

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Standard Build-up 3-2-3 CoreEZTM 2-4-2

Building Blocks SiP Fabrication & Assembly Technology

• Substrate Technology – Replace bulky, thick PWBs with thin, high density substrates

Vias are 4X smaller

EI Proprietary

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• Embedding Resistors and Capacitors

– Remove discrete passive devices and incorporate into the substrate to reduce required surface area

Building Blocks SiP Fabrication & Assembly Technology

EI Proprietary

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• Bare Semiconductor Die

Building Blocks SiP Fabrication & Assembly Technology

•Unpackaged die

has significantly

smaller footprint.

•Flipchip attach

results in smallest

configuration.

EI Proprietary

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PWB

Substrate

Die

Building Blocks High Density Electronics Integration

EI Proprietary

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Turn Key Solutions for Microsystems

Microelectronics Packaging Rigid Substrates

Substrate & Design

• Physical design

• Mechanical layout for SiP (MCM)

Substrate Fabrication

• 50 μm laser drilled vias

• 25/25 μm line width & space

IC Assembly

• Flip chip pitch down to 150 μm

• Wirebond, 60 μm in line, 45 μm staggered

Teradyne Ultra FLEX Module Tester

• Boundary scan

• Full functional module test

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• CoreEZ® 2-4-2 substrate

• SiP assembly (FCA)

Si Package – Medical Imaging:

Ultrasound Application

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Standard Build-up 3-2-3 CoreEZ® 2-4-2

Ultrasound Application: High Density Rigid Substrate

- Both packages use 50um blind vias

- CoreEZ® core vias are 4x smaller

- Core EZ requires fewer costly build up layers for the same wiring capacity

- Thinner core reduces electrical parasitics

(photos are to scale)

2 fully wireable

build up layers

2 fully wireable

build up layers

3 fully wireable

build up layers

3 build up layers only

useful for redistribution

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Ultrasound Application: Rigid HDI Substrate With High Core Via Density

• Very Dense Package Interconnect

– Ultra Dense Core Via Pitch can eliminate additional build up layers

• Dual Side Component Mounting

• Fine Line Width and Spacing

HDI Substrate has 9X Core Via Density over conventional build up

Standard Build-Up Mechanically drilled core:

400 micron diameter pad, 200 um diameter via

Laser Drilled CoreEZ Thin Core:

100 um diameter pad (50 um via)

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Miniaturized Rigid Substrate

•Defibrillators

•Pacemakers

•Pulse generators

SWaP

Reductions

Shrink Device

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ICD (implantable cardioverter defibrillator) and Pacemaker

• Smaller, less intrusive applications for implantable devices

• High density interconnect substrate – 8 layers

– 1.2” x 0.5” & 1.7” x 1.6”

• October 2008 marked 1st human implant of pacemaker with EI substrate.

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Ultrasound Device Packaging

Transducers & Die

• PZT, PLZT, PMN-PT,

• ASIC Die

Substrate Fabrication

• 25 μm laser drilled vias (minimum)

• 12/12μm line width & space (minimum)

IC Assembly

• Flip chip pitch down to 70 μm (minimum)

• Piezoelectric Crystal assembly

Module Tester

• Full functional module test

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•Intravascular Ultrasound (IVUS) is a catheter- based system

that allows physicians to acquire images of diseased vessels

from inside the artery. IVUS provides detailed and accurate

measurements of lumen and vessel size, plaque area and

volume, and the location of key anatomical landmarks.

Intravascular Ultrasound Catheter Sensor Package

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Support of 12.5 µm polyimide film

during substrate fabrication: use of

rigid frame

14 µm line and space

Intravascular Ultrasound Catheter Manufacturing

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Micro Pillar Technology for Finer Pitch Applications

ASIC die with 70 µm bonding pad pitch

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Intravascular Ultrasound Catheter Sensor Package

• Flip Chip Ultrasound Transducer for Catheter

• Sensor assembly rolled to 1.175mm diameter

• 5 Flip Chip ASIC,.1mm thick, 31 I/O each, 2.5mm x 0.5mm

– 22 micron flip chip bumps on 70 micron die pad pitch

• 12.5mm by 6.5 mm single layer flex circuit

– 14 micron wide lines and space copper circuitry

– 12.5 micron thick polyimide dielectric

• Prototype to production

– Over 1M shipped

Single layer HDI Flex

200 µm

Transducer

ASIC Die

Flip Chip Bumps

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Intravascular Ultrasound Catheter Package

Intravascular Ultrasound (IVUS) catheter

Images: The image on the left depicts a

healthy artery with larger opening, while the

image on the right depicts a blocked vessel

with smaller opening

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Ultrasound Medical Application

• 12 µm lines / spaces

• 25 µm vias

• 6 µm thick metallurgy

• Flexible soldermask

• FC Die & SMT passives

High Density Double Sided Flex

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Multilayer Flex

Flex

Flex

Bond-ply

1. Cu Thickness

2. Flex thickness

3. Bond-ply thickness

Roll

Bend/Flex

Flex

Flexibility

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12 metal layers, 12.8-13 mils thick, bend radius 1 inch or higher

Multilayer Flex

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Multilayer Flex

12 metal layers, 7.5 mils thick, bend radius 1 inch or less

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2 metal layers, ~1 mil thick, Roll diameter: 180 mils

6 metal layers, ~5 mils thick

Multilayer Flex

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Silicones Polydimethylsiloxane (PDMS)

Si O

CH3

CH3n

Silicones

Nano composites

Marine coatings

Microfluidics

Medicals Electromechanical actuators

Microbe-resistant household products

Thermal interface materials

Random lasers

Magnetic

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Silicones PDMS Base Resins

Si O

CH3

HO H

CH3n

Silanol-Terminated PDMS Vinyl-Terminated PDMS

Silane-Terminated PDMS

Si O

CH3

H Si

CH3n

CH3

CH3

H

Si O

CH3

H2C=HC Si

CH3n

CH3

CH3

CH=CH2

•Molecular weight of Polymer •Curing Chemistry

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Silicones

Optically active silicone

Explore stretching

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Stretchable Electronics

Conductive wires made from a new carbon nanotube-polymer composite.

Professor Takao Someya of the University

of Tokyo

Stretchable Electronics with a Twist: Prof. John A.

Rogers, University of Illinois at Urbana-Champaign)

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Stretchable Electronics

• Bio-compatible

• Bio-stable

• Fine lines

silicone

SiOx

Cu

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Water soluble PVA Substrate

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Liquid Crystal Polymer (LCP)

LCP based Z-interconnect substrate

– 4 layer TV, 6” x 6”

– 1, 1.5, 2, 2.5 mil lines & spaces

– 2 & 4 mil thru vias

– 1, 2, 3 mil blind vias

– Understand uVia Reliability

6 Layer

2 mil uvia

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LCP based Rigid-Flex

Rigid Flex gives the ability to design circuitry to fit the

device, rather than building the device to fit the circuitry.

Rigid-flex can stay inside a semi-conformal metal shell

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Roll-to-Roll Manufacturing

Supply Roll Take-Up Roll

Thin Film Deposition & Laser Processing Photolithography

Supply Roll Take-Up Roll

Wet Chemical

Etching & Cleaning

Cooling Drum Laser

Azores Photolithography

R2R can lead to reductions in cost. • A fully integrated facility

• Lower capital & labor cost

Flex Rigid-Flex Rigid

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Summary

EI developed variety of Substrate technology for a host of applications including:

• Pacemakers

• Implantable cardioverter defibrillators (ICD)

• Ultrasonic catheters

• LED surgical overhead and endoscope lighting

• Digital x-ray

• Patient monitoring systems

• CT scan

• Supercomputing for life science simulation (drug design)

Extending development to other implantable applications

• Conformal electronics

• Pulse generator