Active Sales Associates Inc (NEW)

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  • Profile (Headquarters)

    Name: Active Sales Associate Inc. LTD. Established: 1993 Address: 7441 114th Ave Suite 606, Largo, FL USA Employees: 30 Organization: Sales, Marketing, Administration, Quality and Engineering

    President

    V.P of sales

    Technical

    Sales

    Inside Sales

    Support Quality Engineering Administration

  • Profile (MN Sales Office)

    MN Sales Office Location and Contacts: 11044 Industrial Circle NE, Suite N Elk River, MN 55330

    Mike Dupont Jeff Scotting VP North America Sales / ITAR Technical Sales Mdupont@activepcb.com Jscotting@activepcb.com Tel: 763-229-2867 Tel: 763-441-7541 Fax: 763-445-2219 Fax: 763-445-2219 Shelly Bialka Inside Sales Mgr. Sbialka@activepcb.com Tel: 763-441-1239 Fax: 763-445-2219

    mailto:Mdupont@activepcb.commailto:Jscotting@activepcb.commailto:Sbialka@activepcb.commailto:Sbialka@activepcb.commailto:Sbialka@activepcb.com

  • Profile (Century PCB)

    Name: Century PCB Established: 1998 Address: Taoyuan, Taiwan Employees: 300 Sales Revenue: US $40 Million Organization: Research, Development & Manufacturing. Certification: ISO9001, TS16949, AS9100, ISO13485, ITAR & UL #E189010 Capability: 1-36 layer - Including metal back

  • Organization Chart

    President

    MFG V.P.

    Engineering Quality Management Admin Manufacturing Sales &

    Shipping

  • Technology Capability (1/7) Item Capability Note

    1 Board thickness and Layers

    1.1 Finished board thickness Min. 4 Layer: 12 Mil. Min. (0.3MM)

    6 Layer: 18 Mil. Min. (0.45MM)

    Max. 185 Mil. Max. (4.625MM)

    1.2 Finished board thickness tolerance

    Thickness (Mil.)

    30

    Thickness (Mil.)

    3 Mil. 10 %

    1.3 Max. layer count 36

    2 Mechanical Drilling (Finished board thickness .062 Mil.)

    2.1 Diameter 6 Mil. (0.15MM) Min. 250 Mil. (6.35MM) Max.

    2.2 Hole Position Tolerance 2 Mil.

    2.3 Finished Dia. Tolerance

    2.3.1 Plated Through Hole 3 Mil.

    2.3.2 Non-Plated Through hole 2 Mil.

    2.3.3 Press-Fit Hole 2 Mil.

    2.4 Thru-Via diameter 6 Mil. (0.15MM)

    2.5 Thru-Via Aspect Ratio 10:1

    2.6 Thru-Via Pad Dia. (min) 16 Mil. (0.4MM)

    2.7 Min. Gap Hole to Hole 5 Mil. Min.

    2.8 Min. Pad Size 16 Mil. Min.

  • Technology Capability (2/7) Item Capability Note

    3 Laser Drilling

    3.1 HDI Production Method Sequential Lamination

    Build-up Method (CO Laser)

    3.2 Micro-Via Formation Method

    Direct Laser Drill, Conformal Windows, Enlarge Windows.

    3.3 Build-Up Dielectric FR4, RCC

    3.4 Hole Diameter by Laser 4-6 Mil

    3.5 Via. Aspect Ratio 1:0.8

    (Dia. 5 Mil. ; PP Thickness, 4 Mil. Max.)

    3.6 Blind Hole Position Tolerance

    3.6.1 Blind Hole Bottom Position

    2 Mil.

    3.6.2 Capture Pad A/R(Y) 2 Mil.

    3.7 Blind Hole Angle to Bottom (Z)

    75 +15/-10

  • Technology Capability (3/7) Item Capability

    4 Line Thickness (T)

    4.1.1 Inner Layer

    0.5 OZ : 0.45 Mil. (11.4m) Min. Per: IPC-6012

    1 OZ : 0.98 Mil. (24.9m) Min.

    2 OZ : 2.19 Mil. (55.7m) Min.

    3 OZ : 3.41 Mil. (86.6m) Min.

    4 oz : 4.63 Mil. (117.5m) Min.

    4.1.2 Outer Layer (Plated + Foil)

    0.5 OZ : 1.3 Mil. (33.4m) Min. Per. IPC-6012

    1 OZ : 1.89 Mil. (47.9m) Min.

    2 OZ : 3.10 Mil. (78.7m) Min.

    3 OZ : 4.28 Mil. (108.6m) Min.

    4 OZ : 5.49 Mil. (139.5m) Min.

    4.2 Line Width (W1)

    4.21 Inner Layer

    0.5 OZ : 3 Mil. (76.2m) Min. Per. IPC-6012

    1 OZ : 4 Mil. (101.6m) Min.

    2 OZ : 5 Mil. (127.0m) Min.

    3 OZ : 7 Mil. (177.8m) Min.33333

    4 OZ : 8 Mil. (203.2m) Min.

    5 OZ : 9 Mil. (228.6m) Min.

    4.22 Outer layer 1/3 OZ : 3 Mil. (76.2m) Min. /3 Mil. Per. IPC-6012

    0.5 OZ : 4 Mil. (101.6m) Min. /4 Mil.

    1 OZ : 5 Mil. (127m) Min. /5 Mil.

    2 OZ : 8 Mil. ( 203.2m) Min. /8 Mil.

    3 OZ : 9 Mil. (228.6m) Min. /9Mil.

    4 OZ : 10 Mil (254m) Min. /10 Mil.

    5 OZ : 12 Mil. (279.4m) Min. /12 Mil.

  • Technology Capability (4/7) Item Capability Note

    4.3 Letter Screen Tolerance 20% or 0.001 (Trace Width 8 Mil.

    4.4

    Conductive Test Position

    CSP, GF : Top (W1); PCB : Bottom (W2)

    CSP, BGA, SMD, Wire Bonding

    5.1 Layer to Layer Tolerance (X)

    3 Mil. (6 Mil.)

    Hole Center to Hole Center

    5.2 Annual Ring (outer Edge)

    PTH R : 2 Mil. Min. (Class 3) Per. IPC-6012

    NPTH

    R : 6 Mil. Min. (Class 3)

    Per. IPC-6012

    5.3 7 % Special Impedance

    6 Plating

    6.1 Surface Thickness Average 0.984 Mil. (25m) Class 3 Per. IPC-6012

    Minimum 0.787 Mil. (20m) Min. Class 3

    R R

    R

  • Technology Capability (5/7) Item Capability Note

    6.2 Normal Hole Wall Thickness

    6.21 Average 0.984 Mil. (25m) Class 3 Per. IPC-6012

    6.22 Min. .0787 Mil. (20m) Min. Class 3 Per. IPC-6012

    6.2.3 Wrap 0.472 Mil. (12m) Class 3 Per. IPC-6012

    6.3 Micro-Via Hole Thickness

    6.3.1 Average 0.472 Mil. (12m) Class 3 Per. IPC-6012

    6.3.2 Min. 0.394 Mil. (10m) Min. Class 3 Per. IPC-6012

    6.3.3 Wrap Plating 0.236 Mil. (6m) Class 3 Per. IPC-6012

    6.4 Hole Copper Adhesiveness >35kg/cm Per. IPC-6012

    6.5 Durability 2885C, 10 Sec. Per. IPC-TM-650

    7 Solder Mask

    7.1 Dielectric Strength 1000VDC/0.025mm Min. Per. IPC-SM-840

    7.2 Position Tolerance 2.0 Mil. Per. IPC-SM-840

    7.3 Max Plugged Hole Diameter 0.0197 Mils. Per. IPC-SM-840

    7.4 Adhesion (Tape Test) 2 Mil. Per. IPC-SM-840

  • Technology Capability (6/7) Item Capability Note

    7.5 Thickness (1 Time Printing)

    A: 0.4 Mil. Min. Solder mask brands:

    0.6 Mil. Max. Green: Tamura, Taiyo Matte Green: Advance, Taiyo Blue: Onstatic Tech, Taiyo Matte Blue: Onstatic Red: Taiyo Matte Red: Onstatic Black: Onstatic, Taiyo White: Taiyo PSR4000 WT02 & WT05

    T: 0.5 Mil. Min.

    1.0 Mil. Max.

    S: 0.7 Mil. Min.

    2.0 Mil. Max.

    7.6 Solder Mask Dam (Green Solder mask)

    7.6.1 Dam Width .003 Mil. Min. All other colors 5 Mil. Min.

    7.6.2 Distance Dam to Pad .002 Mil. Min.

    7.6.3 Distance Pad to Pad .007 Mil. Min.

    8 Silkscreen

    8.1 Width .005 Mil.

    8.2 Character Height .032 Mils.

    8.3 Position Tolerance .003 Mils.

    8.4 Color White, Yellow, Black, Gray Other colors available upon request

    8.5 Type Heat Curing, UV

  • Technology Capability (7/7) Item Capability Note

    9 Surface Finish

    9.1 Hot Air Leveling

    9.1.1 Thickness

    100-1000

    X-Ray, 3MMx3MM Pad.

    9.1.2 Content (Hot Air Leveling) 63%SN(1%), 37%Pb, Impurity

  • Current Certifications

  • Major Customers

  • Overview

  • Profile (Century PCB)

    Established: 1993 New Facility Completed in 2016 Address: Kunshan City, China Building Area: 470,000 Square Feet. PCB Fabrication Size: 200,000 Square Feet. Employees: 380 (1st stage), 600 (2nd Stage) Organization: Research, Development & Manufacturing. Certification: ISO9001, TS16949, ISO14001 & UL #E189010 Capability: 1-12 layers Capacity: 40,000 square Meters (1st stage); 70,000 square Meters (2nd stage)

  • Organization Chart

  • Technology Capability (1/5) General Capability Y2016 Y2017 Y2018

    Material

    Material Type

    Cem-3, FR4 140-170, Lead free & Halogen Free

    Layer Count

    2- 8

    2-14

    2-14

    Maximum Board Size

    24.49 x 21.50

    24.49 x 21.50

    24.49 x 21.50

    Minimum Board Thickness

    0.015 Mils.

    0.012 Mils.

    0.012 Mils.

    Maximum Board Thickness

    0.093 Mils.

    0.125 Mils

    0.156 Mils.

    Minimum Core Thickness (I/L)

    0.004 Mils.

    0.003 Mils.

    0.002 Mils.

    Minimum Cu Thickness (Base)

    0.047 Mils.

    0.047 Mils.

    0.047 Mil.s

    Maximum Cu Thickness (Base)

    0.0042 Mils (3 oz.)

    0.0042 Mils (3 oz.)

    0.0056 Mils. (4 oz.)

  • Technology Capability (2/5) General Capability Y2016 Y2017 Y2018

    Finished Board Thickness Tolerance

    Finished Board Thickness >0.039 Mils. 10% 10% 10%

    0.6mm

  • Technology Capability (3/5)

    General Capability Y2016 Y2017 Y2018

    Drilling And Routing

    Min. Mechanical Drill Size 0.0098 0.0078 0.0078

    Drilling Hole to Hole Accuracy 0.003 Mils. 0.003 Mils. 0.003 Mils.

    Routing Edge to Edge Accuracy 0.004 Mils. 0.004 Mils. 0.004 Mils.

    Stamping Edge to Edge Accuracy 0.003 Mils. 0.003 Mils. 0.003 Mils.

    Score V-Cut Edge to Edge Accuracy 0.004 Mils. 0.004 Mils. 0.004 Mils.

    Aspect Ratio (Drill Thru Via) 6.5:1 8:1 8:1

    NPTH Diameter Tolerance 0.002 Mils. 0.002 Mils. 0.002 Mils.

    PTH Diameter Tolerance 0.003 Mils. 0.003 Mils. 0.003 Mils.

    Hole to Hole Accuracy 0.003 Mils. 0.003 Mils. 0.003 Mils.

  • Technology Capability (4/5)

    General Capability Y2016 Y2017 Y2018

    Solder Mask and Electrical Testing

    Min. Solder Mask Dam Width (Green Mask) 0.003 Mils. 0.003 Mils. 0.003 Mils.

    Min. Solder Mask Dam Width (All other Colors) 0.005 Mils. 0.005 Mils. 0.004 Mils.

    Solder Mask Plugged Hole Diameter (Max.) 0.0197 Mils. 0.0197 Mils. 0.0197 Mils.

    Solder Mask Registration Tolerance 0.0025 Mils. 0.0025 Mils. 0.0025 Mils.

    Maximum Test Points Bare Board 16,000 20,000 20,000

    Electrical Test Conditions 250 V 0:20/S:30

    250 V 0:20/S:30

    250 V 0:20/S:30

    Maximum Board Array Size Electrical Testing 15.75 x 21.65 15.75 x 21.65 15.75 x 21.65

  • Technology Capability (5/5)

    General Capability Y2016 Y2017 Notes

    Surface Finishes

    OSP Yes Yes 7.87 -15.75

    ENIG Yes Yes Nickel Thickness: 118 -150 Gold Thickness: .98 -3

    Selective ENIG Yes Yes Nickel Thickness: 118 -150 Gold Thickness: .98 -3

    Hard Gold Yes Yes Nickel Thickness: 118 -150 Gold: 7.87 39.37

    Lead Free Hot Air Leveling Yes Yes 100 -1000

  • Order Process

  • Order Process

  • Production Process (1 of 17)

    Etching+

    Brown OxidePressing

    Lab

    Sidewalk

    Sidewalk

    Sidewalk

    Vacuum

    Etching

    Dry Film+

    ExposureLay-up

    Sidewalk

    Sidewalk

    Dry Film+

    Exposure

    Pattern

    Plating

    Negative Film

    House

    Developing

    Marerial

    Warehouse

    Cuttting

    CNC Drilling

    DMSE double Side

    Multila

    yer

    Material Cutting Machine

    Auto-edge Grinding Machine

  • Production Process (2 of 17)

    Inner Layer Etching Line

    Brown Oxide Line

    Etching+

    Brown OxidePressing

    Lab

    Sidewalk

    Sidewalk

    Sidewalk

    Vacuum

    Etching

    Dry Film+

    ExposureLay-up

    Sidewalk

    Sidewalk

    Dry Film+

    Exposure

    Pattern

    Plating

    Negative Film

    House

    Developing

    Marerial

    Warehouse

    Cuttting

    CNC Drilling

    DMSE double Side

    Multila

    yer

  • Production Process (3 of 17)

    CEDAL Laminate Machine

    Etching+

    Brown OxidePressing

    Lab

    Sidewalk

    Sidewalk

    Sidewalk

    Vacuum

    Etching

    Dry Film+

    ExposureLay-up

    Sidewalk

    Sidewalk

    Dry Film+

    Exposure

    Pattern

    Plating

    Negative Film

    House

    Developing

    Marerial

    Warehouse

    Cuttting

    CNC Drilling

    DMSE double Side

    Multila

    yer

  • Production Process (4 of 17)

    Drill Machines

    Hitachi Drills

    Etching+

    Brown OxidePressing

    Lab

    Sidewalk

    Sidewalk

    Sidewalk

    Vacuum

    Etching

    Dry Film+

    ExposureLay-up

    Sidewalk

    Sidewalk

    Dry Film+

    Exposure

    Pattern

    Plating

    Negative Film

    House

    Developing

    Marerial

    Warehouse

    Cuttting

    CNC Drilling

    DMSE double Side

    Multila

    yer

  • Production Process (5 of 17)

    PTH Line

    Sidewalk

    Sidewalk

    Dry Film+

    Exposure

    Pattern

    Plating

    Negative Film

    House

    Developing

    Marerial

    Warehouse

    Cuttting

    CNC Drilling

    DMSE

    Etching+

    Brown OxidePressing

    Lab

    Sidewalk

    Sidewalk

    Sidewalk

    Vacuum

    Etching

    Dry Film+

    ExposureLay-up

    double Side

    Multila

    yer

  • Production Process (6 of 17)

    Auto-Press Film Machine

    CCD-exposure Machine *Class 10000 level clean Room.

    Etching+

    Brown OxidePressing

    Lab

    Sidewalk

    Sidewalk

    Sidewalk

    Vacuum

    Etching

    Dry Film+

    ExposureLay-up

    Sidewalk

    Sidewalk

    Dry Film+

    Exposure

    Pattern

    Plating

    Negative Film

    House

    Developing

    Marerial

    Warehouse

    Cuttting

    CNC Drilling

    DMSE double Side

    Multila

    yer

  • Production Process (7 of 17)

    Developing Line Etching+Brown Oxide

    Pressing

    Lab

    Sidewalk

    Sidewalk

    Sidewalk

    Vacuum

    Etching

    Dry Film+

    ExposureLay-up

    Sidewalk

    Sidewalk

    Dry Film+

    Exposure

    Pattern

    Plating

    Negative Film

    House

    Developing

    Marerial

    Warehouse

    Cuttting

    CNC Drilling

    DMSE double Side

    Multila

    yer

  • Production Process (8 of 17)

    Pattern Plating Line

    Automatic larger pattern plating, Auto-add and control chemical, current, density, current time & fail warning.

    Sidewalk

    Sidewalk

    Dry Film+

    Exposure

    Pattern

    Plating

    Negative Film

    House

    Developing

    Marerial

    Warehouse

    Cuttting

    CNC Drilling

    DMSE

    Etching+

    Brown OxidePressing

    Lab

    Sidewalk

    Sidewalk

    Sidewalk

    Vacuum

    Etching

    Dry Film+

    ExposureLay-up

    double Side

    Multila

    yer

  • Production Process (9 of 17)

    Vacuum Etching Line

    Sidewalk

    Sidewalk

    Dry Film+

    Exposure

    Pattern

    Plating

    Negative Film

    House

    Developing

    Marerial

    Warehouse

    Cuttting

    CNC Drilling

    DMSE

    Etching+

    Brown OxidePressing

    Lab

    Sidewalk

    Sidewalk

    Sidewalk

    Vacuum

    Etching

    Dry Film+

    ExposureLay-up

    double Side

    Multila

    yer

  • Production Process (10 of 17)

    Solder Mask Pre-Treatment

    Solder Mask Pre-Treatment Sidewalk

    OSP

    Sidewalk

    E/T+FQC

    Sidewalk

    Screen Room

    S/M printing+S/M Exposure

    Legend Print

    Warehouse

    Tooling Room

    Packing

    Sidewalk

    pre-treatmentDeveloping

    ENIG

    CNC+Cleaning

  • Production Process (11 of 17)

    Solder Mask Printing Line

    Automatic Spray Coating Line

    Sidewalk

    pre-treatmentDeveloping

    ENIG

    CNC+Cleaning

    Sidewalk

    OSP

    Sidewalk

    E/T+FQC

    Sidewalk

    Screen Room

    S/M printing+S/M Exposure

    Legend Print

    Warehouse

    Tooling Room

    Packing

  • Production Process (12 of 17)

    Solder Mask Developing Line

    Solder Mask Baking Ovens

    Sidewalk

    pre-treatmentDeveloping

    ENIG

    CNC+Cleaning

    Sidewalk

    OSP

    Sidewalk

    E/T+FQC

    Sidewalk

    Screen Room

    S/M printing+S/M Exposure

    Legend Print

    Warehouse

    Tooling Room

    Packing

  • Production Process (13 of 17)

    Letter Screen Printing

    Letter Screen Inkjet Printer

    Sidewalk

    pre-treatmentDeveloping

    ENIG

    CNC+Cleaning

    Sidewalk

    OSP

    Sidewalk

    E/T+FQC

    Sidewalk

    Screen Room

    S/M printing+S/M Exposure

    Legend Print

    Warehouse

    Tooling Room

    Packing

  • Production Process (14 of 17)

    Immersion Gold Line

    Sidewalk

    pre-treatmentDeveloping

    ENIG

    CNC+Cleaning

    Sidewalk

    OSP

    Sidewalk

    E/T+FQC

    Sidewalk

    Screen Room

    S/M printing+S/M Exposure

    Legend Print

    Warehouse

    Tooling Room

    Packing

  • Production Process (15 of 17)

    Routing

    V-Scoring

    Sidewalk

    pre-treatmentDeveloping

    ENIG

    CNC+Cleaning

    Sidewalk

    OSP

    Sidewalk

    E/T+FQC

    Sidewalk

    Screen Room

    S/M printing+S/M Exposure

    Legend Print

    Warehouse

    Tooling Room

    Packing

  • Production Process (16 of 17)

    Flying Probe Tester

    Automatic E/T Machine

    Sidewalk

    pre-treatmentDeveloping

    ENIG

    CNC+Cleaning

    Sidewalk

    OSP

    Sidewalk

    E/T+FQC

    Sidewalk

    Screen Room

    S/M printing+S/M Exposure

    Legend Print

    Warehouse

    Tooling Room

    Packing

  • Production Process (17 of 17)

    OSP Line, Packaging & warehouse

    Sidewalk

    pre-treatmentDeveloping

    ENIG

    CNC+Cleaning

    Sidewalk

    OSP

    Sidewalk

    E/T+FQC

    Sidewalk

    Screen Room

    S/M printing+S/M Exposure

    Legend Print

    Warehouse

    Tooling Room

    Packing