Profile (Headquarters)

Name: Active Sales Associate Inc. LTD. Established: 1993 Address: 7441 114th Ave Suite 606, Largo, FL USA Employees: 30 Organization: Sales, Marketing, Administration, Quality and Engineering

President

V.P of sales

Technical

Sales

Inside Sales

Support Quality Engineering Administration

Profile (MN Sales Office)

MN Sales Office Location and Contacts: 11044 Industrial Circle NE, Suite N Elk River, MN 55330

Mike Dupont Jeff Scotting VP North America Sales / ITAR Technical Sales Mdupont@activepcb.com Jscotting@activepcb.com Tel: 763-229-2867 Tel: 763-441-7541 Fax: 763-445-2219 Fax: 763-445-2219 Shelly Bialka Inside Sales Mgr. Sbialka@activepcb.com Tel: 763-441-1239 Fax: 763-445-2219

Profile (Century PCB)

Name: Century PCB Established: 1998 Address: Taoyuan, Taiwan Employees: 300 Sales Revenue: US $40 Million Organization: Research, Development & Manufacturing. Certification: ISO9001, TS16949, AS9100, ISO13485, ITAR & UL #E189010 Capability: 1-36 layer - Including metal back

Organization Chart

President

MFG V.P.

Engineering Quality Management Admin Manufacturing Sales &

Shipping

Technology Capability (1/7) Item Capability Note

1 Board thickness and Layers

1.1 Finished board thickness Min. 4 Layer: 12 Mil. Min. (0.3MM)

6 Layer: 18 Mil. Min. (0.45MM)

Max. 185 Mil. Max. (4.625MM)

1.2 Finished board thickness tolerance

Thickness (Mil.)

<30 >30

Thickness (Mil.)

±3 Mil. ±10 %

1.3 Max. layer count 36

2 Mechanical Drilling (Finished board thickness .062 Mil.)

2.1 Diameter 6 Mil. (0.15MM) Min. 250 Mil. (6.35MM) Max.

2.2 Hole Position Tolerance ±2 Mil.

2.3 Finished Dia. Tolerance

2.3.1 Plated Through Hole ±3 Mil.

2.3.2 Non-Plated Through hole ±2 Mil.

2.3.3 Press-Fit Hole ±2 Mil.

2.4 Thru-Via diameter 6 Mil. (0.15MM)

2.5 Thru-Via Aspect Ratio 10:1

2.6 Thru-Via Pad Dia. (min) 16 Mil. (0.4MM)

2.7 Min. Gap Hole to Hole 5 Mil. Min.

2.8 Min. Pad Size 16 Mil. Min.

Technology Capability (2/7) Item Capability Note

3 Laser Drilling

3.1 HDI Production Method Sequential Lamination

Build-up Method (CO₂ Laser)

3.2 Micro-Via Formation Method

Direct Laser Drill, Conformal Windows, Enlarge Windows.

3.3 Build-Up Dielectric FR4, RCC

3.4 Hole Diameter by Laser 4-6 Mil

3.5 Via. Aspect Ratio 1:0.8

(Dia. 5 Mil. ; PP Thickness, 4 Mil. Max.)

3.6 Blind Hole Position Tolerance

3.6.1 Blind Hole Bottom Position

2 Mil.

3.6.2 Capture Pad A/R(Y) 2 Mil.

3.7 Blind Hole Angle to Bottom (Z)

75° +15°/-10°

Technology Capability (3/7) Item Capability

4 Line Thickness (T)

4.1.1 Inner Layer

0.5 OZ : 0.45 Mil. (11.4µm) Min. Per: IPC-6012

1 OZ : 0.98 Mil. (24.9µm) Min.

2 OZ : 2.19 Mil. (55.7µm) Min.

3 OZ : 3.41 Mil. (86.6µm) Min.

4 oz : 4.63 Mil. (117.5µm) Min.

4.1.2 Outer Layer (Plated + Foil)

0.5 OZ : 1.3 Mil. (33.4µm) Min. Per. IPC-6012

1 OZ : 1.89 Mil. (47.9µm) Min.

2 OZ : 3.10 Mil. (78.7µm) Min.

3 OZ : 4.28 Mil. (108.6µm) Min.

4 OZ : 5.49 Mil. (139.5µm) Min.

4.2 Line Width (W1)

4.21 Inner Layer

0.5 OZ : 3 Mil. (76.2µm) Min. Per. IPC-6012

1 OZ : 4 Mil. (101.6µm) Min.

2 OZ : 5 Mil. (127.0µm) Min.

3 OZ : 7 Mil. (177.8µm) Min.33333

4 OZ : 8 Mil. (203.2µm) Min.

5 OZ : 9 Mil. (228.6µm) Min.

4.22 Outer layer 1/3 OZ : 3 Mil. (76.2µm) Min. /3 Mil. Per. IPC-6012

0.5 OZ : 4 Mil. (101.6µm) Min. /4 Mil.

1 OZ : 5 Mil. (127µm) Min. /5 Mil.

2 OZ : 8 Mil. ( 203.2µm) Min. /8 Mil.

3 OZ : 9 Mil. (228.6µm) Min. /9Mil.

4 OZ : 10 Mil (254µm) Min. /10 Mil.

5 OZ : 12 Mil. (279.4µm) Min. /12 Mil.

Technology Capability (4/7) Item Capability Note

4.3 Letter Screen Tolerance ±20% or ±0.001” (Trace Width ≥ 8 Mil.

4.4

Conductive Test Position

CSP, GF : Top (W1); PCB : Bottom (W2)

CSP, BGA, SMD, Wire Bonding

5.1 Layer to Layer Tolerance (X)

±3 Mil. (6 Mil.)

Hole Center to Hole Center

5.2 Annual Ring (outer Edge)

PTH R : 2 Mil. Min. (Class 3) Per. IPC-6012

NPTH

R : 6 Mil. Min. (Class 3)

Per. IPC-6012

5.3 7 % Special Impedance

6 Plating

6.1 Surface Thickness Average 0.984 Mil. (25µm) Class 3 Per. IPC-6012

Minimum 0.787 Mil. (20µm) Min. Class 3

R R

R

Technology Capability (5/7) Item Capability Note

6.2 Normal Hole Wall Thickness

6.21 Average 0.984 Mil. (25µm) Class 3 Per. IPC-6012

6.22 Min. .0787 Mil. (20µm) Min. Class 3 Per. IPC-6012

6.2.3 Wrap 0.472 Mil. (12µm) Class 3 Per. IPC-6012

6.3 Micro-Via Hole Thickness

6.3.1 Average 0.472 Mil. (12µm) Class 3 Per. IPC-6012

6.3.2 Min. 0.394 Mil. (10µm) Min. Class 3 Per. IPC-6012

6.3.3 Wrap Plating 0.236 Mil. (6µm) Class 3 Per. IPC-6012

6.4 Hole Copper Adhesiveness >35kg/cm Per. IPC-6012

6.5 Durability 288±5°C, 10 Sec. Per. IPC-TM-650

7 Solder Mask

7.1 Dielectric Strength 1000VDC/0.025mm Min. Per. IPC-SM-840

7.2 Position Tolerance ±2.0 Mil. Per. IPC-SM-840

7.3 Max Plugged Hole Diameter 0.0197 Mils. Per. IPC-SM-840

7.4 Adhesion (Tape Test) 2 Mil. Per. IPC-SM-840

Technology Capability (6/7) Item Capability Note

7.5 Thickness (1 Time Printing)

A: 0.4 Mil. Min. Solder mask brands:

0.6 Mil. Max. Green: Tamura, Taiyo Matte Green: Advance, Taiyo Blue: Onstatic Tech, Taiyo Matte Blue: Onstatic Red: Taiyo Matte Red: Onstatic Black: Onstatic, Taiyo White: Taiyo – PSR4000 WT02 & WT05

T: 0.5 Mil. Min.

1.0 Mil. Max.

S: 0.7 Mil. Min.

2.0 Mil. Max.

7.6 Solder Mask Dam (Green Solder mask)

7.6.1 Dam Width .003 Mil. Min. All other colors 5 Mil. Min.

7.6.2 Distance Dam to Pad .002 Mil. Min.

7.6.3 Distance Pad to Pad .007 Mil. Min.

8 Silkscreen

8.1 Width .005 Mil.

8.2 Character Height .032 Mils.

8.3 Position Tolerance ±.003 Mils.

8.4 Color White, Yellow, Black, Gray Other colors available upon request

8.5 Type Heat Curing, UV

Technology Capability (7/7) Item Capability Note

9 Surface Finish

9.1 Hot Air Leveling

9.1.1 Thickness

100µ”-1000µ”

X-Ray, 3MMx3MM Pad.

9.1.2 Content (Hot Air Leveling) 63%SN(±1%), 37%Pb, Impurity<0.4% ANSI/J-STD-003 3.2.1

9.1.3 Content (Lead Free Hot Air) 100% Sn (Sn-Ag-Cu)

9.2 ENIG Thickness

9.2.1 Gold Thickness 2-10µ” Max. X-Ray, 3MMx3MM Pad.

9.2.2 Nickel Thickness 200µ” Max.

9.2.3 Hardness 560HV

9.3 Gold Finger

9.3.1 Gold Thickness 50µ” Max. (30µ” Preferred)

9.3.2 Nickel Thickness 118µ” Min. - 200µ” Max.

9.3.3 Hardness (Hard Gold) 260-270HV

Current Certifications

Major Customers

Overview

Profile (Century PCB)

Established: 1993 New Facility Completed in 2016 Address: Kunshan City, China Building Area: 470,000 Square Feet. PCB Fabrication Size: 200,000 Square Feet. Employees: 380 (1st stage), 600 (2nd Stage) Organization: Research, Development & Manufacturing. Certification: ISO9001, TS16949, ISO14001 & UL #E189010 Capability: 1-12 layers Capacity: 40,000 square Meters (1st stage); 70,000 square Meters (2nd stage)

Organization Chart

Technology Capability (1/5) General Capability Y2016 Y2017 Y2018

Material

Material Type

Cem-3, FR4 140-170, Lead free & Halogen Free

Layer Count

2- 8

2-14

2-14

Maximum Board Size

24.49 x 21.50

24.49 x 21.50

24.49 x 21.50

Minimum Board Thickness

0.015 Mils.

0.012 Mils.

0.012 Mils.

Maximum Board Thickness

0.093 Mils.

0.125 Mils

0.156 Mils.

Minimum Core Thickness (I/L)

0.004 Mils.

0.003 Mils.

0.002 Mils.

Minimum Cu Thickness (Base)

0.047 Mils.

0.047 Mils.

0.047 Mil.s

Maximum Cu Thickness (Base)

0.0042 Mils (3 oz.)

0.0042 Mils (3 oz.)

0.0056 Mils. (4 oz.)

Technology Capability (2/5) General Capability Y2016 Y2017 Y2018

Finished Board Thickness Tolerance

Finished Board Thickness >0.039 Mils. ±10% ±10% ±10%

0.6mm <Finished Board Thickness ≤0.039 Mils. ±10% ±10% ±10%

Finished Board Thickness ≤0.02362 ±3% ±3% ±3%

Traces & Pads

Minimum Line Width & Space .004 Mils. / .004 Mils. .003 Mils. / .003 Mils. .003 Mils. / .003 Mils.

Trace Width Tolerance (≥0.00394) <.005 Mils. : ±.001 Mil. ≥.005 Mils. : ±20%

<.005 Mils. : ±.001 Mil. ≥.005 Mils. : ±20%

<.005 Mils. : ±.001 Mil. ≥.005 Mils. : ±20%

Impedance Control Tolerance ±10% ±8% ±8%

Minimum SMT Pad / Pitch .0098 Mils. (.25mm) Pad. .0157 Mils. (.40mm) Pitch

.0098 Mils. (.25mm) Pad. .0157 Mils. (.40mm) Pitch

.0079 Mils. (.20mm) Pad. .0157 Mils. (.40mm) Pitch

Minimum BGA Pad / Pitch .0118 Mils. (.30mm) Pad. .0256 Mils. (.65mm) Pitch

.0118 Mils. (.30mm) Pad. .0256 Mils. (.65mm) Pitch

.0098 Mils. (.25mm) Pad. .0236 Mils. (.60mm) Pitch

Pattern to Outline Tolerance ±5% ±5% ±5%

Technology Capability (3/5)

General Capability Y2016 Y2017 Y2018

Drilling And Routing

Min. Mechanical Drill Size 0.0098 0.0078 0.0078

Drilling Hole to Hole Accuracy ±0.003 Mils. ±0.003 Mils. ±0.003 Mils.

Routing Edge to Edge Accuracy ±0.004 Mils. ±0.004 Mils. ±0.004 Mils.

Stamping Edge to Edge Accuracy ±0.003 Mils. ±0.003 Mils. ±0.003 Mils.

Score V-Cut Edge to Edge Accuracy ±0.004 Mils. ±0.004 Mils. ±0.004 Mils.

Aspect Ratio (Drill Thru Via) 6.5:1 8:1 8:1

NPTH Diameter Tolerance ±0.002 Mils. ±0.002 Mils. ±0.002 Mils.

PTH Diameter Tolerance ±0.003 Mils. ±0.003 Mils. ±0.003 Mils.

Hole to Hole Accuracy ±0.003 Mils. ±0.003 Mils. ±0.003 Mils.

Technology Capability (4/5)

General Capability Y2016 Y2017 Y2018

Solder Mask and Electrical Testing

Min. Solder Mask Dam Width (Green Mask) ±0.003 Mils. ±0.003 Mils. ±0.003 Mils.

Min. Solder Mask Dam Width (All other Colors) ±0.005 Mils. ±0.005 Mils. ±0.004 Mils.

Solder Mask Plugged Hole Diameter (Max.) ≤0.0197 Mils. ≤0.0197 Mils. ≤0.0197 Mils.

Solder Mask Registration Tolerance ±0.0025 Mils. ±0.0025 Mils. ±0.0025 Mils.

Maximum Test Points – Bare Board 16,000 20,000 20,000

Electrical Test Conditions 250 V 0:20Ω/S:30Ω

250 V 0:20Ω/S:30Ω

250 V 0:20Ω/S:30Ω

Maximum Board Array Size – Electrical Testing 15.75 x 21.65 15.75 x 21.65 15.75 x 21.65

Technology Capability (5/5)

General Capability Y2016 Y2017 Notes

Surface Finishes

OSP Yes Yes 7.87 -15.75µ”

ENIG Yes Yes Nickel Thickness: 118 -150µ” Gold Thickness: .98 -3µ”

Selective ENIG Yes Yes Nickel Thickness: 118 -150µ” Gold Thickness: .98 -3µ”

Hard Gold Yes Yes Nickel Thickness: 118 -150µ” Gold: 7.87 – 39.37µ”

Lead Free Hot Air Leveling Yes Yes 100 -1000µ”

Order Process

Order Process

Production Process (1 of 17)

Etching+

Brown OxidePressing

Lab

Sidewalk

Sidewalk

Sidewalk

Vacuum

Etching

Dry Film+

ExposureLay-up

Sidewalk

Sidewalk

Dry Film+

Exposure

Pattern

Plating

Negative Film

House

Developing

Marerial

Warehouse

Cuttting

CNC Drilling

DMSE double Side

Multila

yer

Material Cutting Machine

Auto-edge Grinding Machine

Production Process (2 of 17)

Inner Layer Etching Line

Brown Oxide Line

Etching+

Brown OxidePressing

Lab

Sidewalk

Sidewalk

Sidewalk

Vacuum

Etching

Dry Film+

ExposureLay-up

Sidewalk

Sidewalk

Dry Film+

Exposure

Pattern

Plating

Negative Film

House

Developing

Marerial

Warehouse

Cuttting

CNC Drilling

DMSE double Side

Multila

yer

Production Process (3 of 17)

CEDAL Laminate Machine

Etching+

Brown OxidePressing

Lab

Sidewalk

Sidewalk

Sidewalk

Vacuum

Etching

Dry Film+

ExposureLay-up

Sidewalk

Sidewalk

Dry Film+

Exposure

Pattern

Plating

Negative Film

House

Developing

Marerial

Warehouse

Cuttting

CNC Drilling

DMSE double Side

Multila

yer

Production Process (4 of 17)

Drill Machines

Hitachi Drills

Etching+

Brown OxidePressing

Lab

Sidewalk

Sidewalk

Sidewalk

Vacuum

Etching

Dry Film+

ExposureLay-up

Sidewalk

Sidewalk

Dry Film+

Exposure

Pattern

Plating

Negative Film

House

Developing

Marerial

Warehouse

Cuttting

CNC Drilling

DMSE double Side

Multila

yer

Production Process (5 of 17)

PTH Line

Sidewalk

Sidewalk

Dry Film+

Exposure

Pattern

Plating

Negative Film

House

Developing

Marerial

Warehouse

Cuttting

CNC Drilling

DMSE

Etching+

Brown OxidePressing

Lab

Sidewalk

Sidewalk

Sidewalk

Vacuum

Etching

Dry Film+

ExposureLay-up

double Side

Multila

yer

Production Process (6 of 17)

Auto-Press Film Machine

CCD-exposure Machine *Class 10000 level clean Room.

Etching+

Brown OxidePressing

Lab

Sidewalk

Sidewalk

Sidewalk

Vacuum

Etching

Dry Film+

ExposureLay-up

Sidewalk

Sidewalk

Dry Film+

Exposure

Pattern

Plating

Negative Film

House

Developing

Marerial

Warehouse

Cuttting

CNC Drilling

DMSE double Side

Multila

yer

Production Process (7 of 17)

Developing Line Etching+

Brown OxidePressing

Lab

Sidewalk

Sidewalk

Sidewalk

Vacuum

Etching

Dry Film+

ExposureLay-up

Sidewalk

Sidewalk

Dry Film+

Exposure

Pattern

Plating

Negative Film

House

Developing

Marerial

Warehouse

Cuttting

CNC Drilling

DMSE double Side

Multila

yer

Production Process (8 of 17)

Pattern Plating Line

Automatic larger pattern plating, Auto-add and control chemical, current, density, current time & fail warning.

Sidewalk

Sidewalk

Dry Film+

Exposure

Pattern

Plating

Negative Film

House

Developing

Marerial

Warehouse

Cuttting

CNC Drilling

DMSE

Etching+

Brown OxidePressing

Lab

Sidewalk

Sidewalk

Sidewalk

Vacuum

Etching

Dry Film+

ExposureLay-up

double Side

Multila

yer

Production Process (9 of 17)

Vacuum Etching Line

Sidewalk

Sidewalk

Dry Film+

Exposure

Pattern

Plating

Negative Film

House

Developing

Marerial

Warehouse

Cuttting

CNC Drilling

DMSE

Etching+

Brown OxidePressing

Lab

Sidewalk

Sidewalk

Sidewalk

Vacuum

Etching

Dry Film+

ExposureLay-up

double Side

Multila

yer

Production Process (10 of 17)

Solder Mask Pre-Treatment

Solder Mask Pre-Treatment Sidewalk

OSP

Sidewalk

E/T+FQC

Sidewalk

Screen Room

S/M printing+S/M Exposure

Legend Print

Warehouse

Tooling Room

Packing

Sidewalk

pre-treatmentDeveloping

ENIG

CNC+Cleaning

Production Process (11 of 17)

Solder Mask Printing Line

Automatic Spray Coating Line

Sidewalk

pre-treatmentDeveloping

ENIG

CNC+Cleaning

Sidewalk

OSP

Sidewalk

E/T+FQC

Sidewalk

Screen Room

S/M printing+S/M Exposure

Legend Print

Warehouse

Tooling Room

Packing

Production Process (12 of 17)

Solder Mask Developing Line

Solder Mask Baking Ovens

Sidewalk

pre-treatmentDeveloping

ENIG

CNC+Cleaning

Sidewalk

OSP

Sidewalk

E/T+FQC

Sidewalk

Screen Room

S/M printing+S/M Exposure

Legend Print

Warehouse

Tooling Room

Packing

Production Process (13 of 17)

Letter Screen Printing

Letter Screen Inkjet Printer

Sidewalk

pre-treatmentDeveloping

ENIG

CNC+Cleaning

Sidewalk

OSP

Sidewalk

E/T+FQC

Sidewalk

Screen Room

S/M printing+S/M Exposure

Legend Print

Warehouse

Tooling Room

Packing

Production Process (14 of 17)

Immersion Gold Line

Sidewalk

pre-treatmentDeveloping

ENIG

CNC+Cleaning

Sidewalk

OSP

Sidewalk

E/T+FQC

Sidewalk

Screen Room

S/M printing+S/M Exposure

Legend Print

Warehouse

Tooling Room

Packing

Production Process (15 of 17)

Routing

V-Scoring

Sidewalk

pre-treatmentDeveloping

ENIG

CNC+Cleaning

Sidewalk

OSP

Sidewalk

E/T+FQC

Sidewalk

Screen Room

S/M printing+S/M Exposure

Legend Print

Warehouse

Tooling Room

Packing

Production Process (16 of 17)

Flying Probe Tester

Automatic E/T Machine

Sidewalk

pre-treatmentDeveloping

ENIG

CNC+Cleaning

Sidewalk

OSP

Sidewalk

E/T+FQC

Sidewalk

Screen Room

S/M printing+S/M Exposure

Legend Print

Warehouse

Tooling Room

Packing

Production Process (17 of 17)

OSP Line, Packaging & warehouse

Sidewalk

pre-treatmentDeveloping

ENIG

CNC+Cleaning

Sidewalk

OSP

Sidewalk

E/T+FQC

Sidewalk

Screen Room

S/M printing+S/M Exposure

Legend Print

Warehouse

Tooling Room

Packing