©2011 Renesas Electronics Corporation. All rights reserved.

Strictly Confidential

1 ©2011 Renesas Electronics Corporation. All rights reserved. 1

An Introduction to Renesas Mobile Slim Modems to Mobile Multimedia Platforms – Flexibility & Performance

Jim Harper, Renesas Mobile Corporation

4G World

Chicago, IL

October 26, 2011

©2011 Renesas Electronics Corporation. All rights reserved. 2

Overview of Renesas Mobile Corporation

Renesas Mobile’s mission

Future wireless trends and challenges

Building the LTE ecosystem – major factors

Flexibility and performance

Contents

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The Genesis of Renesas Mobile

Dec. 2010

Overall the World’s 3rd Largest Semiconductor Supplier

Legacy experience across GSM/EDGE, WCDMA/HSPA, and LTE, having shipped modems powering over 2 Billion mobile devices

Mobile Multimedia Business • Global No.1 APE &

Co-processor • Global No.5 RF Device • Most Efficient SoC

Implementation Technology

• Software & Integration

Wireless Modem Unit • Most robust & Widely

deployed Modem Technology

• Global Field support Infrastructure

• Strong IPR & Contributions for Standardization

©2011 Renesas Electronics Corporation. All rights reserved. 4

-2008 / Step1: Renesas DoCoMo platform and global AP business, developing complete Symbian and Linux platforms for DoCoMo

2009 / Step2: Licensing Nokia Modem IP, get global system integration capabilities, kicked-off Renesas LTE/DC-HSPA+ triple-mode modem program

2010 / Step3: Acquisition of Nokia Wireless Modem, start of establishing a portfolio of modem, CP (communication processors) and AP/modem platforms

2011 / Step4: Integrating Wireless Modem and MMBU into RMC and start full operation, execute product plans

2012+ / Step5: Leadership in modem platform technology with LTE and LTE-advanced

The Launch Milestones for Renesas Mobile

2008

2009

2010

2011

2012

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Renesas Mobile’s Worldwide Presence

FINLAND Helsinki

Oulu Tampere

Salo

INDIA Bangalore

USA San Diego

Irving

TAIWAN Taipei

DENMARK Copenhagen

UK Farnborough

CHINA Beijing

Shanghai

GERMANY Munich

JAPAN Tokyo, RMC HQ

Takasaki Kodaira Nagoya

FRANCE Rennes Paris

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Evolving Mobile Markets

Mobile Devices

Car Infotainment & Connected Cars

PC/Convergence

Digital Consumer Electronics

Connected Devices

Other Devices

Application Softwares

Open OS (Android, Windows etc)

Mobile Platform

Middleware

Multi Media Modem

Software

Drivers

Core Chipsets

APE APE HW

BB Modem HW

PMIC/Audio RF IC

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The wireless revolution: change and challenges

Spectrum

User demand dictates the need for additional spectrum

Spectrum fragmentation becomes a bigger problem

Cellular connectivity moves to non-traditional areas

Automotive, industrial, M2M, medical, etc

New and diverse requirements are placed on devices (e.g. size, form factor)

Regionalization and customization considerations

Local regulation must be taken into account in designs

Market sizes are smaller and the need to configure to serve multiple industries

New business models

Trends towards faster times to market

Changes in testing methodologies and depth of testing

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Leading Modem Technology merged with State-of-Art Application Processor

Mobile Platforms

World leading modem

technology combined with high

performance APEs with stunning

graphics supporting major OSs,

for smart phones and tablets,

both one or two chip

implementations.

Application Processors

Stunning hardware accelerated 3D and

HD graphics capability on multi-core

ARM processors leading to unrivalled

performance. World leading area and

power. Supporting all leading OS’s.

Slim Modem Platforms

Highly integrated high performance

stand alone 2G/3G/LTE-FDD/LTE-TDD

modem solutions including RF system for

M2M, data cards, tablets and smart

phones. Underlying modem technology

in ~2 billion handsets

©2011 Renesas Electronics Corporation. All rights reserved. 9

Current Platforms And Segmentation B

asic

R

ich

In

tern

et

/ C

on

su

mer e

xp

erie

nce

Mo

dem

p

latf

orm

s

New emerging device categories with new form factors.

High-tier, super-sized smartphone with a processor faster than 1GHz, and a main display over 4 inches.

Mid-tier or high-tier, data-centric handset with a branded, often licensable high-level OS.

SFP: Mid-tier or high-tier, mostly data-centric feature phone mostly with touch screen and Wi-Fi.

FP: Low-tier, mid-tier or high-tier, voice centric, partly data-centric, handset, usually with an unbranded, proprietary OS.

Low-tier, voice centric handset, often with a basic WAP browser, usually unbranded proprietary OS.

Modem modules such as embedded modules for laptops, USB stick modems, modem modules for CE or M2M devices.

Typ

ically s

ep

arate

mo

dem

an

d A

PE

H

igh

ly

inte

grate

d

sin

gle

ch

ip A

SIC

s

Basic Phones

Super Phones

USB sticks, Emb. modules

Tablets MID

Feature Phones

Smart Feature Phones

Smart Phones

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Developing the LTE Ecosystem & achieving the right balance

Platform Performance

Supported Modes

Power Consumption

Number of Processors

Product timing

Integration Level

Product Configurability

Product Volume

Cost

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Renesas Mobile Septa-band RF

for LTE

The wireless revolution: change and challenges

Product variants Higher costs

Growing number of LTE frequency band variants

RMC’s multi-band RF capability solves this problem

FDD Bands

TDD Bands

Config A

Config D

Config B

Config E Config F

Config C

Band 38 Band 39 Band 40 Band 41

Band 13 Band 17 Band 20 Band 21

Band 3 Band 4 Band 5 Band 7

Band 1 Band 2 Band 8 Band 12

S O L U T I O N

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Platform Performance – Key Challenge

Mobile computing efficiency … achieving the right balance of power, performance for highly portable devices

System Shared Streaming Cache

ARM®

CortexTM-A9

ARM®

CortexTM-A9

NEON PTM NEON PTM

I$ D$ I$ D$

Snoop Control Unit

L2 Cache

PowerVRTM

SGX543

3D Graphics

Crypt

Engine

R-VCPTM

Multi Codec

Video

Processor

Sound/Audio Processor

Visual 2D

Graphic

Engine ISP

JPEG

Engine

System Interconnect

Multimedia Interconnect

S3$ RAM

Real time

CPU

1080p30

35Mtri/s

20Mpixels

140hours

1.2GHz 1.2GHz

Peripherals

R-MobileU2

LTE

HSPA+

GSM/EDGE

Modem

Optimized combination of general purpose ARM cores plus dedicated processor blocks

Built on consumer, automotive and cellular expertise

Renesas Mobile MP5225

Designed to deliver outstanding performance with Android™

R-Mobile APE5R state-of-the-art low-power, high-performance application processor

Includes the industry’s first multi-core graphics engine, PowerVR SGX MP, to deliver class-leading 2D/3D graphics to deliver console-like games quality

©2011 Renesas Electronics Corporation. All rights reserved. 13

Renesas Mobile is developing the chipsets and platforms to address evolution in the wireless industry utilizing integration and systems knowledge across many industries and technologies

Renesas Mobile has leading modem, applications processor, RF, systems knowledge across the automotive, consumer and cellular markets

Innovation in RF area and the ability to support a broad range band variants across the 3GPP family of wireless technologies is a key strength

Conclusions

©2011 Renesas Electronics Corporation. All rights reserved. 14

THANK YOU

www.renesasmobile.com

©2011 Renesas Mobile Corporation. All rights reserved.