3d electronic packaging for iot devices from …...tobias tiedje & friedrich hanzsch 3d...
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Tobias Tiedje & Friedrich Hanzsch
3D electronic packaging for IoT devices – fromprototype to series production
Electronic Packaging Lab (IAVT)
Technische Universität Dresden
Outline
• The Challenges of 3D Packaging
• The Challenge of High Frequency Connections
• The Solution – The KONEKT Approach
• Current Demonstrators
The Challenges of 3D Packaging
The Challenges of 3D Packaging
3D System-in-PackageNormal System-in-Package on PCB
Why 3D Electronic Packaging?
Advantages:
- Miniaturization
- Heterogeneous Integration
- Package as Functional Component
- Larger Freedom in Design
RF Packaging – The Classical Approach
0 1 0 1 0 0 1 0
Signal at high frequencyInput Output
? ? ? ? ? ? ? ?
RF Packaging – The Classical Approach
0 1 0 1 0 0 1 0
? ? ? ? ? ? ? ?
Signal at high frequencyInput Output
The Solution – The KONEKT Approach
RF Packaging – The KONEKT Approach
0 1 0 1 0 0 1 0
Signal at high frequencyInput Output
0 1 0 1 0 0 1 0
The KONEKT Approach - Customization
Free choice of arrangement, distance and vendor
Free placement ofelectronic
componentsWhat we do:
Your advantage:
The KONEKT Approach - Customization
Free choice of arrangement, distance and vendor
Free placement ofelectronic
components
Any shape of package bycustomer needs onlyavailable in 3D, e.g.
trenches and canals forsensors
What we do:
Your advantage:
Adaption of package sizeneeds esp. miniaturization
The KONEKT Approach - Customization
Free choice of arrangement, distance and vendor
Variations in device can beequalized in package, whichincreases yield and reduces
costs
Free placement ofelectronic
components
Any shape of package bycustomer needs onlyavailable in 3D, e.g.
trenches and canals forsensors
Customizedproduction
available for eachindividual package
What we do:
Your advantage:
Adaption of package sizeneeds esp. miniaturization
The KONEKT Approach - Customization
Free choice of arrangement, distance and vendor
Flexible copper connectionsallow high frequency
applications
Variations in device can beequalized in package, whichincreases yield and reduces
costs
Free placement ofelectronic
components
Any shape of package bycustomer needs onlyavailable in 3D, e.g.
trenches and canals forsensors
Customizedproduction
available for eachindividual package
Connection ofcomponents with low
temperaturemetallization and
structuring
What we do:
Your advantage:
Adaption of package sizeneeds esp. miniaturization
The KONEKT Approach – Batch Production
Customization
Current Demonstrators
Electro Optical Fluidic Demonstrator
Electro Optical Fluidic Demonstrator
Customized VIAS for microfluidic applications, or coolingpurposes
Customization regarding shape and colour
Reconnection to PCB possible
Perfect Tracebility by individual marking of every product
ISO 25178
Surface parameters
Sq 0,03 µm
Ssk -1,45
Sku 8,69
Sp 0,11 µm
Sv 0,29 µm
Sz 0,40 µm
Sa 0,02 µm
Surface properties of the embedding process
Integration of components in package with low surface roughness
Package
materialLaser driver
Laser
(VCSEL)
Topography level (+/- 2 µm) and low tilt of components
Same roughness as individual components
Electro Optical Fluidic Demonstrator
Embedding material
0201 LED package
Cross-section polymer
LED
-Pac
kage
02
01
LED
Cross-section of electric contact in package
High quality electric connection of package
20 µm200
500
1000
2000
2000+100
50 µm
Commercial LEDPCB Via
20 µmAdditive Copper on Package
TST cycles
Conditions:-20°C – 85°C1-2000 cycles-40°C – 125°C>2000 cycles
Thermal Shock Test (TST) of package including electric connection
KONEKT Technolgy enables:
Combination of series production andmanufacturing (Lotsize 1)
Less resourcesLess energy
Lower costs forpackage prototypes
Compact package size
High frequency copperinterconnects
Free combination ofelectrical, mechanicaland optical components
Tracebility
Fast production time
Who we are
Who we are
Dr. Andreas Krause, DI Sebastian Lüngen, MSc. Friedrich Hanzsch, DI Tobias Tiede
We are a Start-up at the Electronic Packaging Lab (IAVT)of TU Dresden with world class research possibilities
The project "Kontaktierung eingebetteter Komponenten als Technologielösung", in short: KONEKT (FKZ: 03EFMSN148) is funded under the EXIST program by the Federal
Ministry for Economic Affairs and Energy and the European Social Fund.
Thank you very much for your kind attention!Find further information at:
https://www.avt.et.tu-dresden.de/forschung/projekte/konektor