1 iar makeapp for the bluetooth protocol stack a superior configuration and optimization tool!

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1 IAR MakeApp for the IAR MakeApp for the Bluetooth protocol stack Bluetooth protocol stack A superior configuration and optimization tool! A superior configuration and optimization tool!

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IAR MakeApp for the Bluetooth IAR MakeApp for the Bluetooth protocol stackprotocol stack

A superior configuration and optimization tool!A superior configuration and optimization tool!

The importance of tool support• Most stacks come with no tool support for

configuration and optimization

• Manual adaptations are needed to use the stack on a new H/W or S/W platform

• Most stacks contain code for many features you don’t use –> waste of memory space!

• Manual optimizations are needed to get a fast and compact stack for your project

• You will need training courses or expensive consultants

• You will suffer a heavy development cost and time-to-market penalty!

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The IAR MakeApp tool

• IAR MakeApp is the most powerful Bluetooth protocol stack optimization tool ever created!

• Advanced configurations are made within a few seconds on a high abstraction level

• The tool generates optimized and adapted Bluetooth protocol stacks in ANSI-C

• The stack becomes highly optimized for your H/W and S/W platform in seconds

• You save development time, production cost, and shorten time-to-market!

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MakeApp ”runtime” environment

- Superior GUI power and flexibility!

Configure using property lists

Support MCUs or external devices

Support a Bluetooth stack or other configurable software blocks

Drag components from the library and drop in the drawing editor

Component drag & drop

Add text or drawings (like the LEDs here) to enhance clarity

Project explorer

Source code generation output log

Feature highlights

• Highly graphical, ”CAD-like” drawing editor with drag & drop

• Optimizing code generator

• Built-in IAR Editor with source code syntax coloring

• HTML report generator creates detailed project reports with hypertext-links.

• Built-in HTML report viewer

• XML based file formats

Component model- Power and flexibility

• MakeApp supports many types of components, that can be added to the same project for configuration & code generation:

• Microcontrollers (8/16/32-bit, DSP)• External devices (Ethernet, LCD, USB, CAN, ASIC, FPGA)• S/W emulated peripherals (I2C)• S/W components (Bluetooth or TCP/IP stacks, Keyboard scan)

• Unprecedented flexibility – MakeApp becomes a code generation platform, that can generate source code for the complete embedded system!

Stack configuration

Environment

• H/W (Host CPU, Bluetooth device)

• S/W (RTOS, Compiler)

Stack features

• Core (HCI, L2CAP, RFCOMM, SDP, ...)

• Profiles (GAP, SDAP, SPP, ...)

• Other (TCI, Message logs, ...)

• Select API functions to implement

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Configuration controls code generation

MakeApp helps the user focus on the application rather than MCU and stack internals!

Stack A:GAPSDPSPP

Stack B:GAPSDPSPP

Headset

Stack C:GAPSDPSPP

Headset(other settings)

ANSI-C code generation

Code adaptations

• The stack source code is generated for the selected H/W and S/W environment

• The generated stack source code only implements the selected stack features

Code optimizations

• Unused features and API functions are removed from the stack implementation

• Gives you a very compact stack = reduced memory usage and faster execution!

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Code size affect production cost!

• The stack optimizer makes a ”vertical slice” of the stack and removes unused code

• The resulting stack becomes very compact and waste no ROM space

• Production cost is reduced as CPU and ROM requirements are lower!

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L2CAP

SDAPSPP

BMC

HCI

RFCOMM SDP

GAP

Application program

Unused stack parts are removed

Selected features are implemented

Time to market is critical – delayed launch means lost market window and reduced sales.Use good tools to shorten your time to market!

SALES

Plannedintro

Lost sales Fixed in time

Maturity

TimeSlip

Source: McKinsey & Co.

Product life cycle

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Sensitivity of profits over life cycle% diff. profit

0

-5

-10

-15

-20

-25

-30

-35

-40

-45

-33 %

-22 %

-3.5 %

Source: McKinsey & Co.

ship 6 mths late prod. cost 9% high 50% dev. cost overrun

No tool support for stack

adaptation

Stack uses too much memory or needs faster CPU

More expensive development tool

IAR comments.This symbol gives examples of reason to failure

Superior tool support

Configurable stack

Compact stack

Shorter development

RAD expertise

Timely arrival to market

Optimal solution

Lower production cost

Lower NRE cost

Increased human capital

Bluetooth Protocol Stack technology from IAR Systems

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