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9 MEMS Commercial Packages, Materials, and Equipment

•Ken Gilleo PhD•ET-Trends LLC

84%

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Commercial SuppliersCommercial Suppliers• Commercial suppliers are emerging

Large packaging foundries; e.g., AMKOR

Smaller specialized; e.g.; RJR Polymers

Start-ups; e.g., Hymite, Silex

• Packages Standard

Modified standard

Full custom

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• Cavity ; “Free Space” or “Head Room”

sometimes isolated from the environment or not

• Minimized stress, especially for sensors

• Controlled internal environment

dry and non-contaminating

no reactive organics

• Or access as required:

Gas/air -Liquids -Solids

Energy beams; e.g. light for MOEMS

Biological agents

RJR MEMS PackagingRJR MEMS Packaging

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Quantum Leap Packaging

Quantum Leap Packaging

• Molded plastic cavity type; LCP

• Process is plastic injection molding

• Metal lead frames (MLF) are insert-molded

• Lid seal is ultrasonic or adhesive

• Passes He leak test

• Handles up to 500oC; highest of any plastics

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QLP MEMS PackageQLP MEMS Package

LCP Lid

MLF Insert molded with LCP

Air Cavity for device

Package looks like over-molded after sealing

Base with exposed pad

Ultrasonic Seal

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HyCap® for MEMSHyCap® for MEMS• Hermeticity exceeds MIL 883F

• Controlled atmosphere, vacuum

• Particle free

• TCE matched to silicon

• Thin 0.1 - 0.4mm

• SMT and/or wirebondable

• Wafer level process

• Low cost

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HyCap® for MEMSHyCap® for MEMS

HyCap®

MEMS

PCB

Hermetic AuSn sealing ring

El. contact

µ-Via SMD-contact

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HyCap® Silicon Based Packages

HyCap® Silicon Based Packages

µ-Vias

Electrical connection

Solder bumps for chip contactAuSn sealing ring SMT-solder bumps

Headroom for MEMS

SMT sideside Chip

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HyCap® S – deep cavity package

HyCap® S – deep cavity package

• Cavity (>250 µm) and small footprint (down to 1x1 mm2)

• No thermo-mechanical stress

• Reduced MEMS overhead (smaller die size)

• Wafer level assembly and testing

• Controlled atmosphere (gases, vacuum, getter)

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Silex MEMS PackageSilex MEMS Package• Silicon body & lid

• Uses unique TSV

• Conductors are doped Si plugs

• Hermetic

• May not be suitable for RF (vias higher Ω than Cu)

DRIE via with plug;

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Silex cont.Silex cont.

Micro-mirror with integrated package

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KyoceraKyoceraKyocera offers ceramic cavity packaging for MEMS:

Kyocera is cooperating with Coventor (CoventorWare). This enables MEMS device designers to simulate the behavior of their device within the package during the development phase.

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Amkor packages MEMS in a variety of packages for air bag and rollover detection sensors for automotive applications.

Amkor has developed several technologies including wafer level protected MEMS, capped MEMS and several types of molded packages.

Amkor also overmolds MEMS devices capped by fabs

AmkorAmkor

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SamsungSamsung

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Samsung cont.Samsung cont.

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Session SummarySession Summary• Billions spent on MEMS devices (especially in USA)

• Not enough invested in MEMS package R&D

• Custom requirements limit commercial products

• MEMS OEMs forced to invent their package

• These packages are not always optimum

• MEMS packaging industry is evolving

• Semi-standard packages are a starting point