04/15/2023© 2014 88 Equipment

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Equipment Engineering and Process Consulting

Members Biographies &

Fields of Expertise

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Member Biographies

Peter J. Nowosad - President and Director of Operations 20+ yrs. experience in project and customer support management WW Broad semiconductor and equipment background CAD design for high-tech chemical/gas distribution systems Knowledgeable in Diffusion, CVD, ALD, PVD, and Etch Based and living in Taiwan since 2000

Todd O. Curtis - V.P. and Chief Technical Officer 40 yrs. experience in III-V and Silicon: CVD/ALD processing and

integration R&D with IBM, Intel, TI, Motorola, SEMATECH, SELETE Japan, TSMC,

ST… Semi-Materials R&D Apps. Lab Mngr: equip, metro, staff, training,

facilities… Over 25 articles: CVD & ALD, silicon and III-V materials, device

integration Technology consultant to the 22nm node, selective deposition

patent Semi, Solar, LED, and Raw Materials Engineering. Taiwan resident

Michel D. Ouaknine - Vice-President of European Operations µProcessor Apps Mgr. for 12 years with Intel, Intersil, and Zilog Authored 2 books on µP’s and ~ 40 technical & scientific papers CNAM ingénieur thesis on selective EPROM programming, 1976 Coordinator with EU organizations: CE standardization, working

with IMEC, LETI & Fraunhofer Institute SEMI S23 standard on Energy Conservation. Paris resident

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Todd O. Curtis: Expanded Bio

Todd started his semiconductor career in 1973 at the Hewlett-Packard Opto-Electronics Division in Palo Alto California. He spent the next 15 years in L.E.D. and MESFET III-V materials production and development epitaxial operations at such notable companies as Siemens, Fairchild, Avantek, Gould-Dexcel, and Watkins-Johnson Microwave Group.

In 1989 he began his silicon materials career in Watkins-Johnson Semiconductor Products Division in Scotts Valley California at the cusp of the industry evolution from 150mm to 200mm wafers. Todd spent the next 15 years with Watkins-Johnson in equipment and process engineering working in production and R&D device and materials operations. Todd worked with and co-published technical papers with companies world-wide including INTEL, TSMC, UMC, Texas Instruments, ST Microelectronics, Motorola, IBM, Chartered, Samsung, Sematech, SMIC, Toshiba, Sony, and NEC.

His process development work in the early 1990’s on STI (shallow trench isolation), ILD (inter-level dielectrics) and IMD (inter-metal dielectrics) became mainstream production processes used in over 80% of the semiconductor factories world-wide. His last R&D project was at the 22 nano-meter technology node for ALD (atomic layer deposition) for high-K gate dielectrics and ALD tunable work-function metal gates.

His 40+ years of materials research and production experience includes III-V's for L.E.D. and MESFET's, and over 30 types of silicon related oxides, nitrides, and metals utilized in front-end and back-end applications.

He has been an independent technology consultant since 2003 for equipment and process in the fields of semiconductor, solar, and LED operations. He has lived in Taiwan since the year 2000 and travels frequently to Vietnam in support of his current projects.

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Todd O. Curtis Companies-Position-R&D Sites

Technicon 1971 Electrician

Hewlett-Packard 1973-

1978 LED Epi & Xtal Growth

Ops.

Siemens Opto 1978-1979

GaAsP Epi R&D

Fairchild Opto 1979-1982 LPE, MOCVD III-V EPI R&D

Avantek GaAs 1982-1983

Military GaAs Epi & Implant

Dexcel-Gould 1983-1986

Military GaAs AsCl3 Epi &

Dev.

Si-Fab 1986-1988 Silicon Fab Equipment

WJ Microwave 1988-89

Military III-V MBE

WJ Semi. Equip. 1989-2000

APCVD, MOCVD Apps. Lab R&D

ASML Thermal 2000-2003 ALD, APCVD, MOCVD R&D

Consulting 03-06

Genus-Aixtron 2006-2007 ALD R&D CVD

W

2007-Current Used Equip.

Technical Consulting

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GaAs ~ III-VProcess, Materials, Device, Equip.

CONFIDENTIAL

Hewlett-Packard 1973-1978Epi & Xtal

Growth GaAs, GaAsP, GaP

Siemens Opto 1978-1979

GaAsP VPE Epi R&D

Fairchild Opto 1979-1982 LPE, MOCVD

III-V EPI R&D Ternary &

Quaternary

Avantek Microwave

1982-1983 Military GaAs

VPE Epi & Implant

Dexcel-Gould 1983-1986

Military GaAs AsCl3, MBE Epi & Device Process

WJ Microwave 1988-89

Military III-V MBE

Genus-Aixtron 2006-2007 ALD & EPI R&D

MOCVD

Over 15 yrs. of III-V

ExperienceProcess Materials Device Equipme

nt

AVANTEK

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GaAs ~ III-VProcess, Materials, Device, Equip.

CONFIDENTIAL

Process Epitaxy

MBE-MOCVDLPE-VPE

Cl3 & AsCl3Solid and Semi Solid

Sources

Materials

GaAsGaAsPGaP

AlGaAsInAlGaAs

P or N Doped

DeviceL.E.D.

MESFETSLo-noise

Power T and Y-gates

Air BridgesHEMT-Quad-

Layers

Equip.ReactorsMetals

MetrologyParametric

TestCleans

All Types

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Michel D. Ouaknine: Expanded Bio

• Started as Design Engineer: frequency counters, real time control equipment, digital intelligent clock for industrial applications, data acquisition systems, microcomputer memory tester controller…• Microprocessor support at Intel. Handled Intel’s microprocessor courses & technical seminars in France. Started Intel’s European Applications Lab (with DRAM/EPROM test & analysis).• Managed Intersil South Europe Applications & microprocessor courses. At Zilog, launched Z800 & Z8000 microprocessor families and specialized in communications controller support.• Created Western Digital South Europe subsidiary organization: sales, applications, marketing, customer service, bonded warehouse... to address the 3 WD markets simultaneously. Qualified WD’s X.25 communications products with all key South Europe organizations (CNET, Transpac, Telefonica…) and customers (Olivetti, Bull, HP …).• Started Genus European operations: sales, service & process engineers, inventories in strategic locations... Introduced Genus technologies (mostly tungsten silicide CVD and high energy implant into key European accounts and grew EU sales to approximately 12 % of Genus revenues.• Joined Mattson Technology to handle South Europe Sales: introduced & qualified Mattson ICP strip into all major semiconductor manufacturers in France & Italy (& their US operations). Became Global Account Manager for a major EU manufacturer, directly reporting to Mattson’s President; developed partnership, joint papers & seminars; filed 2 joint patents. Promoted to the responsibility of RTP European Sales on January 1st, 2000.• Launched WaferMasters EU organization to develop its unique RTP technology: get qualified with EU semiconductor companies, organized a EU Applications Lab, European support. Got WaferMasters involved with the key European R&D organizations, organized all EU certifications and involved WaferMasters with the SEMI S23 standard on Energy Conservation. Represented my company at several scientific seminar on RTP & authored several papers.

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Michel D. Ouaknine: Expanded Bio

Vast applications-oriented background.o Author of « La pratique des microprocesseurs », 1977, Paris & Intersil IM6100 µP course book.o Published ~40 papers in French & US magazines and for scientific symposia.o Design then applications manager for 12 years, mostly in control logic & microcomputer real time

and data acquisition systems.o Initiated microprocessor & microcomputer courses for Intel customers & representatives.o Started the European DRAM memory test & analysis laboratory and designed the first EPROM

programmer for Intel development systems.o Organized technical presentations & lectures to scientific seminars for new equipment &

processes; participating to the demos: preparation, execution & results review.

Managing vision/Understanding customerso Started the European operations for 4 different US companies: Western Digital (1984), Genus

(1992), Mattson Technology (1996) and WaferMasters (2001).o Set up & organized the European branch offices in synchronization with operations growth: sales,

applications, marketing, customer service, bonded warehouse & administration. o Organized operations to provide total customer satisfaction: exposition to advanced systems or

process, technical service and all administrative support.o Developed partnerships: JDP, joint patents, papers and participation to scientific symposiums.o Familiar with EU organizations while involved in Corporate projects : CE standardization, design

center in Nice, France, distribution center in Amsterdam, The Netherlands...

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Michel D. Ouaknine Companies-Position

Dyna Electronique 1972-1974 Design Mngr.

Intel 1974-1977 Apps. Engineer

Intersil1977-1982

Applications Manager

Zilog 1982-1983 Applications Manager

Western Digital 1984-1990

Managing Director

Genus Inc. 1992-1996

Europe Director of Operations

Mattson Technology 1996-2001 RTP Sales Manager

WaferMasters 2001-2004

Europe Operations Manager

Technical and Sales Consulting 2004 to current

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Peter J. NowosadCompanies-Positions-Sites Supported

BA from Michigan Tech

1994

Silicon Systems / Texas

Instruments 1995-1997

Thin Film Maint

Novellus Systems 1997-

1999Field Service Eng

WJ / SVG / ASML / Aviza1999-2009

Final Test Technician - WJ

Field Service “WJ Hot Shot” Team

Asia Tech Support Manager

Fab-Finder, Inc2009-2014

2011-Current High Tech Equip.

Consulting

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Dr. Len Mei joins 88 Equipment as Key Advisor for International Business and Technology

Feb 15

Dating back to the early 1980’s, Dr. Mei has been at the forefront of advanced semiconductor development and manufacturing on an International scale with over 30+ years of academic and industrial experience in semiconductors. Fab director at Read-Rite California, managing thin film disk head fab ops and dev. Process manager at Fairchild Semiconductor for advanced memories . Process manager at Data General for microprocessor development and pilot line. Director of planning at Elebra, designing the first 8” advanced wafer for Brazil in

1987.

In academics, he has been a professor at the University of Campinas, Brazil and a visiting Research Associate Professor at Stanford Electronics Lab, Department of EE - Stanford University.

From 1997-2009: EVP of Operations and Business Development for ProMOS Technologies - responsible

for all aspects of ProMOS manufacturing operations including four front end wafer fabs with total capacity exceeding 80K/month 12” wafers and back end operation, product engineering, strategic planning, automation for equipment, factory and data. He managed up to 4,000 head-count and 65 nm technology in volume production with annual capex exceeding $1 billion.

After 2006, Dr. Mei became responsible for new technology and business development at ProMOS. In this capacity, he founded CapsoVision, a company dedicated for the research and production of capsule camera for medical applications. CapsoVision’s device is pending on FDA approval in 2015.

Dr. Mei holds more than 20 US international patents in semiconductor technology and is the author of the book "Practices of Wafer Fab Operations“.

He received his Ph.D. in Metallurgy from University of Illinois at Urbana-Champaign, USA.